Patent application number | Description | Published |
20080239679 | HEAT DISSIPATION DEVICE HAVING METAL DIE-CASTING COMPONENT AND METAL-EXTRUSION COMPONENT - A heat dissipation device for dissipating heat from heat-generating components on a printed circuit board includes a cover for covering the printed circuit board and a radiator mounted on the cover. The cover defines a plurality of holes corresponding to the heat-generating components on the printed circuit board. The radiator includes a plurality of contacting portions extending through the holes of the cover for contacting the heat-generating components, respectively. The cover and the radiator are made of different materials by different manufacturing techniques, i.e. aluminum die-casting and aluminum extrusion. | 10-02-2008 |
20080257527 | HEAT SINK ASSEMBLY HAVING A FIN ALSO FUNCTIONING AS A SUPPORTING BRACKET - A heat sink assembly ( | 10-23-2008 |
20080289797 | HEAT DISSIPATION DEVICE HAVING CAP FOR PROTECTING THERMAL INTERFACE MATERIAL THEREON - A heat dissipation device includes a heat sink having a base with thermal interface material thereon and a protective cap covering the base. The protective cap includes a body shielding the thermal interface material and sidewalls extending from the body and engaging with a periphery of the base of the heat sink. A rotatable portion is rotatable relative to the body of the protective cap. The rotatable portion includes a base-wall being rotatably connected with the body of the protective cap and a plurality of positioning sides extending from the base-wall and engaging lateral sides of a corner of the base of the heat sink. | 11-27-2008 |
20090040730 | HEAT DISSIPATION DEVICE HAVING A ROTATABLE FASTENER - A heat dissipation device includes a heat sink, a retention module and a rotatable fastener for securing the heat sink to the retention module. The retention module includes two supporting ribs and a positioning block above one of the supporting ribs. The rotatable fastener is rotatably received in the retention module and includes an actuating portion and a pressing portion fastened to the actuating portion. The heat sink rests on the supporting ribs of the retention module with an end thereof being pressed by the positioning block, and an opposite end thereof being pressed by the pressing portion. The rotatable fastener can be rotated to an unlocked position wherein the pressing portion is moved away from the opposite end of the heat sink, so that the heat sink is removable from the retention module. | 02-12-2009 |
20090059526 | HEAT SINK ASSEMBLY AND METHOD MANUFACTURING THE SAME - A heat sink assembly includes a base plate, a fin group and a heat pipe thermally connecting the base plate with the fin group. The fin group includes a plurality of fins. The heat pipe includes a straight evaporating section contacting with the base plate, a first condensing section extending upwardly from an end of the evaporating section and through the fins, a second condensing section bent downwardly from a free end of the first condensing section and through the fins, and a third condensing section extending upwardly from an opposite end of the evaporating section and through the fins. Periphery walls of at least two of the first, second and third condensing sections substantially totally contact with the fins to increase a contact area between the heat pipe and the fins. | 03-05-2009 |
20090080160 | HEAT DISSIPATION DEVICE WITH A HEAT PIPE - A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a bottom face. The base has a bottom surface and a top surface. The heat pipe comprises an evaporation portion thermally engaging with the top surface of the base plate and a curved portion extending from the evaporation portion and projecting beyond the base plate. The heat spreader has a first face engaging with the bottom face of the fin assembly and a second face thermally engaging with the condensation portion of the heat pipe. The heat spreader has a profile on the bottom face of the fin assembly, which is in compliance with at least a portion of the heat pipe. | 03-26-2009 |
20090122268 | BLIND FOR A PROJECTOR | 05-14-2009 |
20090151897 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group mounted on a top surface of the base, and a plurality of fasteners secured on the base. Each fastener includes a bolt extending through the base, and an elastic sleeve engaging with the bolt under the base. The sleeve defines a hole and the hole has a configuration such that the sleeve securely clasp the bolt. The bolt extends through the base and engages in the hole of the sleeve. | 06-18-2009 |
20090166007 | HEAT DISSIPATION DEVICE WITH A HEAT PIPE - A heat dissipation device includes a base for contacting with a heat-generating electronic component, a fin assembly, a heat pipe connecting with the base and the fin assembly, and a holder connecting with the base and the fin assembly and supporting the heat pipe. The fin assembly includes a plurality of fins far away from the base. The heat pipe includes an evaporation portion thermally engaging with the base, a condensation portion connecting with the fin assembly and a connecting portion connecting with the evaporation portion and the condensation portion. The holder has a profile similar to the connecting portion of the heat pipe. | 07-02-2009 |
20130333216 | METHOD FOR MANUFACTURING HEAT DISSIPATION DEVICE - An exemplary method for manufacturing a heat dissipation device includes the following steps. First, providing fins spaced from each other. Then, providing an electric conductor extending through the fins and being electrically connected to the fins. Next, immersing the combination of the fins and the electric conductor into an electrolyte of an electrolytic cell. After that, connecting an anode of the electrolytic cell with the electric conductor in an electric conductive relationship. Finally, providing the anode with electrical power to form metal oxide films over surfaces of the fins and the electric conductor. | 12-19-2013 |