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Yi-Hua
Yi-Hua Chang, Hsin-Chu Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080246502 | SEMICONDUCTOR DEVICE FOR TESTING SEMICONDUCTOR PROCESS AND METHOD THEREOF - A semiconductor device for testing a semiconductor process applied to manufacturing the semiconductor device is disclosed. The semiconductor device includes at least a testing group. The testing group includes a first testing block and a second testing. The first testing block includes: a first input node; a first output node; a plurality of first selecting nodes; a first reference device, coupled to the first input node and the first output node; and a first target device, coupled to the first selecting nodes and the first output node. The second testing block includes: a second input node; a second output node; a plurality of second selecting nodes; a second reference device, coupled to the second input node and the second output node; and a second target device, coupled to the second selecting nodes and the second output node. | 10-09-2008 |
Yi-Hua Chen, Taipei Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090256708 | SYSTEM AND METHOD OF RFID WIRELESS CONTROL - A system of RFID wireless control comprises: at least one electronic device having an RFID tag and a receiver, and a controller having a reader for reading and recording the RFID tag of the at least one electronic device to form a list of electronic devices. The electronic device to be controlled is selected from the list, and the controller transmits or receives signals to or from the selected electronic device. The present invention also discloses a method of RFID wireless control for an RFID system. | 10-15-2009 |
Yi-Hua Fan, Taoyuan County TW
| Patent application number | Description | Published |
|---|---|---|
| 20130149789 | LIQUID TESTING SYSTEM - A liquid testing system is provided, which includes a distribution module, a testing chip, a driving module and an image analyzing module. The distribution module is for providing a liquid. The testing chip receives the liquid from the distribution module. The driving module is connected to the testing chip and drives the testing chip to rotate, wherein the liquid flowing in the testing chip is actuated by centrifugal force. The image analyzing module produces and analyzes an image of the liquid in the testing chip. | 06-13-2013 |
Yi-Hua Lee US
| Patent application number | Description | Published |
|---|---|---|
| 20110138908 | HUMIDITY SENSING CIRCUIT WITH TEMPERATURE COMPENSATION - A humidity sensing circuit with temperature compensation includes a wave producing module, a phase processing module, a sensing module and a detecting module. The wave producing module outputs a wave signal. The phase processing module outputs an oscillatory wave and an invert oscillatory wave according to the wave signal. The sensing module has a temperature sensor and a humidity sensor which are connected in series. The temperature sensor and the humidity sensor respectively receive the oscillatory wave and the invert oscillatory wave. The sensing module outputs a parameter signal according to the oscillatory wave and the invert oscillatory wave. The detecting module outputs a detection signal according to the parameter signal. Hence, the humidity sensing circuit with temperature compensation senses the temperature and humidity by the simple circuit design. Moreover, it is feasible for circuit design and application. | 06-16-2011 |
Yi-Hua Lee, Taoyuan Shien TW
| Patent application number | Description | Published |
|---|---|---|
| 20120299525 | VENTILATION APPARATUS WITH FEEDBACK COMPENSATION CONTROL AND METHOD FOR OPERATING THE SAME - A ventilation apparatus with a two-section feedback compensation control and a method for operating the same are disclosed. The ventilation apparatus includes a power conversion trait ( | 11-29-2012 |
Yi-Hua Li, San Chung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110298378 | Light-emitting diode (LED) protection structure - A light-emitting diode (LED) protection structure includes an LED portion and a protection portion. The protection portion includes a fuse and a Zener diode connected in series. The protection portion is electrically connected to the LED portion in parallel but opposite in direction. As such, the LED protection structure can effectively protect the LEDs and the Zener diode from being damaged to thereby reduce costs. | 12-08-2011 |
| 20110304271 | Light-emitting diode (LED) protection structure - A light-emitting diode (LED) protection structure includes an LED portion and a protection portion. The protection portion includes a fuse and a Zener diode connected in series. The protection portion is electrically connected to the LED portion in parallel but opposite in direction. As such, the LED protection structure can effectively protect the LEDs and the Zener diode from being damaged to thereby reduce costs. | 12-15-2011 |
Yi-Hua Liu, Shenzhen City CN
| Patent application number | Description | Published |
|---|---|---|
| 20090241750 | HOLDING FIXTURE - A holding fixture includes a first part, a securing member and a second part. The first part includes a first end face and a sleeve extending from the first end face, the sleeve defines a plurality of radial through holes each receiving a ball therein, and each ball has a diameter larger than the wall thickness of the sleeve therein. The securing member located around the sleeve includes a plurality of protrusions configured on an inner wall thereof, with every two neighboring protrusions defining a notch therebetween. The second part includes a body and a tail fixed on the body, with seating thereof in the sleeve enabled by an annular groove in the periphery thereof. The protrusions guide the balls into the annular groove to secure the second part on the first part. | 10-01-2009 |
| 20090255313 | BENDING DIE - A bending die includes an upper die base fixing a punch, a lower die base, a stripping block, a bending block and a gasket assembly. The stripping block is on the lower die base and under the punch and can elastically move relative to the lower die base. The bending block includes a first sidewall and a second sidewall, wherein the first sidewall is contiguous with the stripping block and the second sidewall is connected to the lower die base via screws. The gasket assembly between the second sidewall and the lower die base provides adjustment of clearance of the bending die. | 10-15-2009 |
| 20090260412 | CURLING DIE TOOL - A curling die tool includes an upper die, a transmission, and a lower die. The upper die includes an upper-die body and a warping-bending pressure portion for a workpiece. The warping-bending pressure portion includes a punch member and is secured to the upper-die body. The transmission member includes a first supporting body corresponding to the punch member supporting the workpiece, along with a curling pressure portion. The transmission member defines a first supporting groove facing the upper die receiving the first supporting body, along with a curling-pressure-portion receiving groove opposite to the first supporting groove receiving the curling pressure portion. The lower die includes a second supporting body facing the curling pressure portion, supporting the workpiece, and defining a guiding groove and a second supporting groove receiving the second supporting body. The transmission member is movably connected to the lower die and slides along the guiding groove. | 10-22-2009 |
| 20090266134 | STAMPING DIE - A stamping die ( | 10-29-2009 |