Yi-Da
Yi-Da Chen, Taipei City TW
Patent application number | Description | Published |
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20150377942 | ELECTRONIC DEVICE AND TESTING SYSTEM - An electronic device is provided. The electronic device includes a printed circuit board (PCB), an antenna structure, a radio frequency signal transceiving circuit and a testing structure. The antenna structure is disposed on the PCB. The radio frequency signal transceiving circuit is disposed on the PCB, and is connected to the antenna structure through a conductive line. The testing structure includes a testing point and a grounding structure. The testing point is disposed on the conductive line, and the grounding structure is disposed on the PCB. | 12-31-2015 |
Yi-Da Huang, Jhu-Nan TW
Patent application number | Description | Published |
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20130329177 | LIQUID-CRYSTAL DISPLAY - A liquid-crystal display is provided, including: a first substrate including a plurality of electrode units, wherein each of the electrode units includes a pixel electrode having a first edge adjacent to a second edge and a plurality of finger-type electrodes connected to the first edge of the pixel electrode; a second substrate having an opposite electrode overlapping the plurality of electrode units, wherein the opposite electrode includes a hollow pattern, including: at least one first main slit and at least one second main slit intersecting with each other, wherein the second main slit intersects the second edge at a first intersection, and the first edge intersects the second edge at a second intersection, and a distance along the second edge and between the first and second intersections is smaller than about 10 nm; and a liquid-crystal layer interposed between the first and second substrates. | 12-12-2013 |
Yi-Da Tsai, Dongshi Township TW
Patent application number | Description | Published |
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20140042622 | Fine Pitch Package-on-Package Structure - A package-on-package (PoP) device including a substrate having an array of contact pads arranged around a periphery of the substrate, a logic chip mounted to the substrate inward of the array of contact pads, and non-solder bump structures mounted on less than an entirety of the contact pads available. | 02-13-2014 |
20140061932 | Methods and Apparatus for Package on Package Structures - A package-on-package (“PoP”) structure and a method of forming are provided. The PoP structure may be formed by forming a first set of electrical connections on a first substrate. A first material may be applied to the first set of electrical connections. A second substrate may be provided having a second set of electrical connections formed thereon. The first set of electrical connections of the first substrate having the epoxy flux applied may be contacted to the second electrical connections of the second substrate. A reflow process may be performed to electrically connect the first substrate to the second substrate. The epoxy flux applied to the first electrical connections of the first substrate may prohibit electrical bridges or shorts from forming during the reflow process. | 03-06-2014 |