Patent application number | Description | Published |
20120250549 | METHOD FOR REPORTING UPLINK CONTROL INFORMATION AND WIRELESS COMMUNICATION DEVICE USING THE SAME - A method for reporting uplink control information and a wireless communication device using the same are disclosed. The wireless communication device supports multiple component carriers (CC), and the proposed method includes following steps. When a base station requests the wireless communication device to transmit aperiodic channel state information (CSI) report of one or more downlink CC to the base station, but the CSI of the downlink CCs may be invalid, following steps are executed on the downlink CC. Full payloads of channel quality indicator (CQI)/precoding matrix indicator (PMI) corresponding to a plurality of selectable RI values of the downlink CC are respectively calculated. Additionally, an RI value of the downlink CC is selected according to the full payloads of the CQI/PMI corresponding to the selectable RI values. | 10-04-2012 |
20130021969 | Method of Performing Retransmissions via Different Transmission Points and Related Communication Device - A method of performing a retransmission of a packet from a plurality of transmission points in a wireless communication system to a mobile device of the wireless communication system is disclosed. The method comprises transmitting the packet from a first transmission point of the plurality transmission points to the mobile device in a first transmission; and transmitting the packet from a second transmission point of the plurality transmission points to the mobile device in a second transmission, after transmitting the packet from the first transmission point in the first transmission, wherein the first transmission point and the second transmission point are different transmission points. | 01-24-2013 |
20130021987 | Method of Performing Retransmissions by Using Different Resources and Related Communication Device - A method of performing a retransmission of a packet from at least one transmission point of a wireless communication system to a mobile device in the wireless communication system is disclosed. The method comprises transmitting the packet from the at least one transmission point to the mobile device by using a first resource group in a first transmission; and transmitting the packet from the at least one transmission point to the mobile device by using a second resource group in a second transmission, after transmitting the packet in the first transmission, wherein the first resource group and the second resource group are different resource groups. | 01-24-2013 |
20130044686 | CARRIER AGGREGATION WIRELESS NETWORK SYSTEM AND BASE STATION, WIRELESS COMMUNICATION DEVICE, AND SYNCHRONIZATION METHOD THEREOF - A carrier aggregation wireless network system and a base station (BS), a wireless communication device, and a synchronization method thereof are disclosed. The wireless communication device receives a wireless signal from the BS. The wireless signal includes a primary cell (pcell) and a secondary cell (scell). A subframe of the scell includes a first OFDM symbol and a second OFDM symbol. The first OFDM symbol includes an extended primary synchronization signal (PSS). The second OFDM symbol includes a PSS. The scell includes a secondary synchronization signal (SSS). The wireless communication device acquires synchronization according to the extended PSS and/or the PSS. In addition, the wireless communication device may also acquire synchronization according to a cell ID, the PSS, and the SSS. | 02-21-2013 |
20150023260 | COMMUNICATING METHOD FOR ANTENNA ARRAY COMMUNICATION SYSTEM, USER EQUIPMENT AND BASE STATION - A communicating method for an antenna array communication system, a user equipment and a base station are provided. The communicating method includes the following steps. A plurality of beams which are formed by a plurality of antennas is transmitted by a base station, and some of the beams is selected by a user equipment. A beam set of the selected beams for the user equipment is configured by the base station. A pre-coding information is fed back to the base station according to the configured beam set by the user equipment. | 01-22-2015 |
Patent application number | Description | Published |
20120324081 | Unified Network Architecture Based on Medium Access Control Abstraction Sub-layer - A unified network architecture based on a medium access control (MAC) abstraction sub-layer for converging a plurality of communication standards is disclosed. The unified network architecture in a control plane comprises a first unified terminal device comprising a unified management entity in the MAC abstraction sub-layer, for mapping a unified parameter from an upper layer to a first MAC type parameter for a configuration of a first MAC type of a MAC layer complied with a first communication standard of the plurality of communication standards, and a service management entity service access point, hereafter called SME SAP, arranged between the MAC abstraction sub-layer and a service management entity (SME) of the MAC layer, wherein the unified management entity communicates with the SME via the SME SAP for setting the first MAC type parameter into the first MAC type of the MAC layer. | 12-20-2012 |
20130034022 | Method of Unified Parameter Mapping - A method of unified parameter mapping for a communication device comprising a medium access control (MAC) abstraction sub-layer for converging a plurality of media in a network system is disclosed. The method comprises obtaining a unified parameter and value of the unified parameter from an upper layer of the MAC abstraction sub-layer, and a medium type of a MAC layer underlying the MAC abstraction sub-layer, determining a special parameter for configuration of the medium type of the MAC layer and a format of the special parameter according to the medium type of the MAC layer and the unified parameter, and generating value of the special parameter according to the value of the unified parameter and the format of the special parameter. | 02-07-2013 |
20130036209 | Method of Medium Access Control Type Detection - A method of medium access control (MAC) type detection for a communication device compatible of a plurality of media each conformed to a communication standard in a network system is disclosed. The method comprises generating a library, wherein the library includes at least a character for each medium, configuring a MAC layer of the communication device according to the library, and determining the existence of a medium according to the configuration result. | 02-07-2013 |
20130044640 | Method of Processing Device Discovery - A method of processing device discovery for a first communication device in a network system is disclosed. The method comprises generating a discovery management frame including an identity and a medium access control (MAC) address of the first communication device, broadcasting the discovery management frame, and when a response corresponding to the discovery management frame is received from the second communication device, adding an entry with the identity and the MAC address of the second communication device in a device table stored in the first communication device. | 02-21-2013 |
20130044750 | Method of Processing Management Frame and Related Communication Device - A method of processing management frame for a first communication device in a network system is disclosed. The method comprises maintaining a device table including at least an identity of at least a communication device of the network system, and at least a medium access control (MAC) address corresponding to the identity, and determining whether to perform management frame transmission to a second communication device of the network system according to the existence of the identity of the second communication device in the device table. | 02-21-2013 |
20130070595 | Unified Quality of Service Negotiation Method Cross Multi-Media - A method of unified quality of service, hereafter called QoS, negotiation cross multi-media for a first unified terminal device (UTD) using a first medium for communication in a network system is disclosed. The method comprises obtaining a QoS requirement from the first UTD, via the first medium, transmitting the QoS negotiation request including QoS requirement to a second UTD using a second medium for communication in the network system, and when a QoS negotiation response corresponding to the QoS negotiation request is received from the second UTD, reporting a QoS negotiation result to first UTD according to the QoS negotiation response. | 03-21-2013 |
Patent application number | Description | Published |
20090222500 | Information storage device and method capable of hiding confidential files - The present invention is to provide a method implemented to an information storage device comprising a storage unit and a secret chamber management unit, wherein the storage unit is connected with a computer device through the secret chamber management unit for allowing the computer device to obtain a storage capacity of the storage unit. The secret chamber management unit sets an access authority selectively over the entirety or a part of the storage unit and formats the storage unit according to a command and a password inputted by a user, so as to create at least one physical open storage area and at least one physical hidden storage area in the storage unit. In addition, an allocation management area is defined in the secret chamber management unit or the storage unit for storing management information related to the open storage area and the hidden storage area. | 09-03-2009 |
20110296099 | Access device and method for accelerating data storage and retrieval into and from storage device - The present invention is to provide an access device connected to a computer, a hard disk drive and a memory disk respectively, wherein the hard disk drive has a normal region divided into a plurality of regular sections, the memory disk is divided into a plurality of mirroring sections, and the access device stores an index table comprising a plurality of fields each having a flag. The access device can execute the steps of receiving a read instruction from the computer; reading sequentially the fields corresponding to the read instruction; reading data stored in a mirroring section corresponding to a field thus read and sending the data to the computer when the flag in the field is a first value; and reading data stored in a regular section corresponding to the field and sending the data to the computer when the flag in the field is a second value. | 12-01-2011 |
20130060999 | SYSTEM AND METHOD FOR INCREASING READ AND WRITE SPEEDS OF HYBRID STORAGE UNIT - The present invention is to provide a system for increasing read and write speeds of a hybrid storage unit, which includes a cache controller connected to the hybrid storage unit and a computer respectively, and stores forward and backward mapping tables each including a plurality of fields. The hybrid storage unit is composed of at least one regular storage unit (e.g., an HDD) having a plurality of regular sections corresponding to forward fields respectively, and at least one high-speed storage unit (e.g., an SSD) having a plurality of high-speed storage sections corresponding to backward fields respectively with higher read and write speeds than the regular storage unit. The cache controller can make the high-speed storage section corresponding to each backward field correspond to the regular section corresponding to the forward field, thus allowing the computer to rapidly read and write data from and into the hybrid storage unit. | 03-07-2013 |
20130212307 | CONNECTION DEVICE CAPABLE OF INCREASING DATA READING AND WRITING SPEEDS - The present invention is to provide a connection device capable of increasing data reading and writing speeds, wherein the connection device includes a first connection module connected to a computer, a second connection module connected to at least one regular storage unit, a high-speed storage unit having higher data reading and writing speeds than each regular storage unit, and a control module respectively connected to the connection modules and the high-speed storage unit for identifying product information of each regular storage unit and the high-speed storage unit and generating a forward mapping table for each regular storage unit and a backward mapping table for the high-speed storage unit. Thus, when the computer performs a reading or writing operation on the regular storage unit, the control module can execute the operation through the high-speed storage unit according to the mapping tables, so as to shorten the time required for data processing. | 08-15-2013 |
Patent application number | Description | Published |
20120120198 | THREE-DIMENSIONAL SIZE MEASURING SYSTEM AND THREE-DIMENSIONAL SIZE MEASURING METHOD - A system for measuring a three-dimensional (3D) size of an object in a space according to an indicating mark is provided, wherein the indicating mark is used to point to one of a plurality of measuring points on the object. The system includes an image capturing module, an spatial vector calculating module, and a measuring module. The image capturing module captures an image of the space. The spatial vector calculating module respectively calculates a spatial vector corresponding to the indicating mark when the indicating mark is used to point to each of the measuring points on the object in the image. The measuring module calculates spatial coordinates of the measuring points according to the spatial vectors so as to obtain the 3D size of the object. | 05-17-2012 |
20120136628 | MACHINE TOOL DATA ACQUISITION DEVICE AND METHOD - A machine tool data acquisition device for processing a plurality of far-end acquisition commands transmitted from a plurality of monitoring devices is provided. The far-end acquisition commands are used for requesting a plurality of parameters from a machine tool, and the plurality of parameters constitute a combination of parameters, including: a monitoring device connection module for receiving the plurality of far-end acquisition commands from the plurality of monitoring devices; a command establishing module for establishing a plurality of near-end acquisition commands according to the far-end acquisition commands, wherein there is an sequence among the plurality of near-end acquisition commands, and each near-end acquisition command corresponds to a plurality of parameter acquisition requests used for requesting and acquiring all of the parameters of one combination of parameters; and a machine tool connection module for sequentially transmitting the parameter acquisition requests corresponding to the near-end commands to the machine tool according to the sequence among the near-end acquisition commands, and acquiring the parameters corresponding to the parameter acquisition requests from the machine tool. | 05-31-2012 |
20130145372 | EMBEDDED SYSTEMS AND METHODS FOR THREADS AND BUFFER MANAGEMENT THEREOF - Embedded systems are provided, which includes a processing unit and a memory. The processing unit simultaneously executes first thread having a flag for performing a data acquisition operation and second thread for performing a data process and output operation for the acquired data in the data acquisition operation. The flag is used for indicating whether a state of the first thread is in an execution state or a sleep state. The memory which is coupled to the processing unit provides a shared buffer for the first and second threads. Before executing the second thread, the flag is checked to determine whether to execute the second thread, wherein the second thread is executed when the flag indicates the sleep state while execution of the second thread is suspended when the flag indicates the execution state. | 06-06-2013 |
20140136911 | REMOTE MONITORING SYSTEMS AND RELATED METHODS AND RECORDING MEDIUMS USING THE SAME - Remote monitoring systems for remotely monitoring execution status of a PLC (Programmable Logic controller) program of a machine include a storage module, a parameter retrieval module and a monitoring module. The storage module stores ladder diagram information corresponding to a PLC source program, wherein the ladder diagram information includes PLC signal address relation information, a plurality of logic switches and a responsive collect command of each logic switch of a ladder diagram. The PLC signal address relation information indicates the relations of the logic switches on the ladder diagram. The parameter retrieval module respectively retrieves parameter data corresponding to the logic switches using the responsive collect commands. The monitoring module generates a status of ladder diagram according to the logic switches, the parameter data and the PLC signal address relation information to display the parameter data corresponding to each logic switch when the machine is executing the PLC source program. | 05-15-2014 |
20140142738 | METHOD AND SYSTEM FOR DETERMINING A STATUS OF AT LEAST ONE MACHINE AND COMPUTER READABLE STORAGE MEDIUM STORING THE METHOD - A method for determining a status of at least one machine includes the following steps: a processing unit is utilized to receive and record spindle load values of the spindle in a period of time to generate a spindle load record of the spindle, and to determine if a preset condition is matched according to the spindle load record. When the preset condition is matched, the processing unit is utilized to determine a present category corresponding to the spindle load record of the spindle, and to obtain parameter-to-be-collected information corresponding to the present category. The processing unit is utilized to obtain at least one value of at least one collected parameter of the at least one machine according to the parameter-to-be-collected information corresponding to the present category, and to determine a status of the at least one machine according to the obtained value of the at least one collected parameter. | 05-22-2014 |
Patent application number | Description | Published |
20130292808 | SEMICONDUCTOR PACKAGE INTEGRATED WITH CONFORMAL SHIELD AND ANTENNA - A semiconductor package includes a substrate, a semiconductor die, a package body, an electromagnetic interference shield, a dielectric structure and an antenna element. The substrate comprises a grounding segment and a feeding point. The semiconductor die is disposed on the substrate. The package body encapsulates the semiconductor die. The electromagnetic interference shield is formed on the package body. The dielectric structure encapsulates the electromagnetic interference shield. The antenna element is formed on the dielectric structure and electrically connecting the grounding segment of the substrate and the feeding point. | 11-07-2013 |
20140035097 | SEMICONDUCTOR PACKAGE HAVING AN ANTENNA AND MANUFACTURING METHOD THEREOF - A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first substrate, a second substrate, an interposer substrate, a semiconductor chip, a package body and a first antenna layer. The first substrate comprises a grounding segment. The interposer substrate is disposed between the second substrate and the first substrate. The semiconductor chip is disposed on the second substrate. The package body encapsulates the second substrate, the semiconductor chip and the interposer substrate, and has a lateral surface and an upper surface. The first antenna layer is formed on the lateral surface and the upper surface of the package body, and electrically connected to the grounding segment. | 02-06-2014 |
20140239465 | SEMICONDUCTOR PACKAGE HAVING A WAVEGUIDE ANTENNA AND MANUFACTURING METHOD THEREOF - A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna. | 08-28-2014 |
20140247195 | SEMICONDUCTOR PACKAGE INCLUDING ANTENNA SUBSTRATE AND MANUFACTURING METHOD THEREOF - A semiconductor package includes a package substrate, a semiconductor device, an antenna substrate and a package body. The semiconductor device is disposed on an upper surface of the package substrate. The antenna substrate is disposed on the semiconductor device and includes a core layer, a grounding layer formed on a lower surface of the core layer, and an antenna layer formed on an upper surface of the core layer and electrically connected to the grounding layer through a conductive via of the core layer. The package body encapsulates the semiconductor device and the antenna substrate. | 09-04-2014 |
20140252595 | SEMICONDUCTOR PACKAGE INCLUDING ANTENNA LAYER AND MANUFACTURING METHOD THEREOF - A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor chip, a package body and an antenna layer. The semiconductor chip is disposed on the substrate. The package body encapsulates the semiconductor chip and includes an upper surface. The antenna layer is formed on the upper surface of the package body and includes two antenna slot groups connected together. Each antenna slot group includes a wave guiding slot extending along a first direction, and an irradiation slot group extending along a second direction, wherein the irradiation slot group is connected to the wave guiding slot. | 09-11-2014 |
Patent application number | Description | Published |
20110296105 | SYSTEM AND METHOD FOR REALIZING RAID-1 ON A PORTABLE STORAGE MEDIUM - A system of realizing RAID-1 on a portable storage medium includes a Universal Serial Bus device and the portable storage medium. The portable storage medium is divided into a main partition and at least one backup partition according to a RAID-1 mode. The Universal Serial Bus device is coupled to the portable storage medium for receiving a write command and/or a read command transmitted by a host, and writing data to the portable storage medium and/or reading data from the portable storage medium according to the write command and/or the read command. The Universal Serial Bus device does not transmit capacity information of the at least one backup partition to the host. | 12-01-2011 |
20110296106 | SYSTEM FOR REALIZING MULTI-PORT STORAGE MEDIA BASED ON A UASP PROTOCOL OF A USB SPECIFICATION VERSION 3.0 AND METHOD THEREOF - A system for realizing multi-port storage media based on a UASP protocol of a USB specification version 3.0 includes a Universal Serial Bus, at least one storage media, and a storage device, where the storage device stores a mapping table. The Universal Serial Bus is used for transmitting at least one write data command. Each storage media is used for replying a write ready command to the Universal Serial Bus after receiving a write data command. When the Universal Serial Bus transmits a data including a command tag according to the write ready command, the storage device finds a number mapping to the command tag according to the command tag and the mapping table, and transmits the data to a storage media mapping to the number. | 12-01-2011 |
20120089755 | Method of adjusting transfer speed after initialization of SATA interface - In a method of adjusting transfer speed after initialization of a SATA interface, a SATA link device transmits a first predetermined primitive to a SATA link partner for requesting to change a first transfer speed of the SATA link device from a first speed to a second speed, the SATA link partner replies to the SATA link device with a second predetermined primitive according to the first predetermined primitive, and the SATA link device and the SATA link partner respectively adjust the first transfer speed of the SATA link device and a second transfer speed of the SATA link partner according to the second predetermined primitive. | 04-12-2012 |
20120121052 | PHASE SELECTOR CAPABLE OF TOLERATING JITTER AND METHOD THEREOF, AND CLOCK AND DATA RECOVERY CIRCUIT - A phase selector capable of tolerating jitters is applied in a clock and data recovery circuit. The phase selector includes a comparing module, a weighting circuit, and a predictor. The comparing module compares a phase-detecting signal and a phase-selecting signal corresponding to the last cycle so as to generate an error signal. The weighting circuit calculates a weighting error signal according to the error signal and a weighting parameter. The phase predictor compares the weighting error signal and predetermined threshold values so as to generate the phase-selecting signal corresponding to the present cycle. When the received input data stream of the clock and data recovery circuit has a small jitter, the phase selector rapidly locks the phase so as to generate the correct phase-selecting signal. When the received input data stream of the clock and data recovery circuit has a large jitter, the phase selector stably generates the phase-selecting signal. | 05-17-2012 |
Patent application number | Description | Published |
20080203414 | WHITE LIGHT LED DEVICE - Light-emitting diode (LED) devices which can produce a uniform white light with a broad emission spectrum and a high color rendering index (CRI) are provided. For example, the emission spectrum of LED devices as described herein may provide more red light and yield a higher CRI light when compared to conventional white LEDs. For some embodiments, the various lights emitted from different layers of the LED device may mix at a light-scattering encapsulation layer and become a uniform white light. | 08-28-2008 |
20080303157 | HIGH THERMAL CONDUCTIVITY SUBSTRATE FOR A SEMICONDUCTOR DEVICE - A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation. | 12-11-2008 |
20090065791 | WHITE LIGHT LED WITH MULTIPLE ENCAPSULATION LAYERS - Light-emitting semiconductor devices with multiple encapsulation layers having more uniform white light when compared to conventional light-emitting devices and methods for producing the same are provided. The uniformity of the emitted white light may be quantified by comparing correlated color temperature (CCT) variations between devices, where embodiments of the present invention have a lower CCT variation when compared to conventional devices over a substantial range of light emission angles. | 03-12-2009 |
20090236625 | LED DEVICE WITH CONDUCTIVE WINGS AND TABS - Apparatus for increased heat dissipation from a light-emitting diode (LED) die are provided. The apparatus may include a metal member thermally and electrically coupled to the LED die and having one or more wings for heat transfer away from the LED die and/or increased mechanical strength of the metal member. The wings may be flat, sloped, or tiered. For some embodiments, the wings may have holes in them in an effort to increase the structural integrity when combined with a housing, which made be composed of plastic or resin. | 09-24-2009 |
20100298965 | LED ARRAY - Methods for fabricating light-emitting diode (LED) array structures comprising multiple vertical LED stacks coupled to a single metal substrate is provided. The LED array structure may comprise two, three, four, or more LED stacks arranged in any configuration. Each of the LED stacks may have an individual external connection to make a common anode array since the p-doped regions of the LED stacks are all coupled to the metal substrate, or some to all of the n-doped regions of the LED stacks may be electrically connected to create a parallel LED array. Such LED arrays may offer better heat conduction and improved matching of LED characteristics (e.g., forward voltage and emission wavelength) between the individual LED stacks compared to conventional LED arrays. | 11-25-2010 |
20110049559 | LIGHT-EMITTING DIODE LAMP WITH LOW THERMAL RESISTANCE - A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable light-emitting diode structure is provided having an active layer deposited on a metal substrate directly bonded to a metal plate that is substantially exposed for low thermal resistance by positioning it on the bottom of the light-emitting diode structure. This metal plate can then be soldered to a printed circuit board (PCB) that includes a heat sink. For some embodiments of the invention, the metal plate is thermally and electrically conductively connected through several heat conduction layers to a large heat sink that may be included in the structure. | 03-03-2011 |
20110111537 | HIGH THERMAL CONDUCTIVITY SUBSTRATE FOR A SEMICONDUCTOR DEVICE - A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation. | 05-12-2011 |
20110284866 | LIGHT-EMITTING DIODE (LED) STRUCTURE HAVING A WAVELENGTH-CONVERTING LAYER AND METHOD OF PRODUCING - A light emitting diode (LED) device having a substantially conformal wavelength-converting layer for producing uniform white light and a method of making said LED at both the wafer and individual die levels are provided. The LED device includes a metal substrate, a p-type semiconductor coupled to the metal substrate, an active region coupled to the p-type semiconductor, an n-type semiconductor coupled to the active region, and a wavelength converting layer coupled to the n-type semiconductor. | 11-24-2011 |
20120086035 | LED Device With A Light Extracting Rough Structure And Manufacturing Methods Thereof - A light emitting diode device includes a substrate, one or more light emitting diode chips on the substrate configured to emit electromagnetic radiation, and a lens configured to encapsulate the light emitting diode chips having a surface with a micro-roughness structure. The micro-roughness structure functions to improve the light extraction of the electromagnetic radiation and to direct the electromagnetic radiation outward from the lens. | 04-12-2012 |
20120092852 | LLB BULB HAVING LIGHT EXTRACTING ROUGH SURFACE PATTERN (LERSP) AND METHOD OF FABRICATION - A LLB bulb includes a base, a LED light source configured to emit electromagnetic radiation, and a lens/cover having a light extracting rough surface pattern (LERSP) configured to reduce glare and reflection in the LLB bulb without light loss. A method for fabricating the LLB bulb includes the steps of providing the lens/cover, and forming the light extracting rough surface pattern (LERSP) on the lens/cover. The lens/cover can be fabricated with the light extracting rough surface pattern (LERSP) using a process such as bead blasting, sand blasting, etching (chemical or plasma), or molding. | 04-19-2012 |
20120132952 | LIGHT-EMITTING DIODE LAMP WITH LOW THERMAL RESISTANCE - A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable light-emitting diode structure is provided having an active layer deposited on a substrate directly bonded to a metal plate that is substantially exposed for low thermal resistance by positioning the metal plate at the bottom of the light-emitting diode structure. This metal plate may then be soldered to a printed circuit board (PCB) that includes a heat sink. For some embodiments of the invention, the metal plate is thermally and electrically conductively coupled through several heat conduction layers to a large heat sink that may be included in the structure. | 05-31-2012 |
20130062592 | LIGHT EMITTING DIODE (LED) DICE HAVING WAVELENGTH CONVERSION LAYERS AND METHODS OF FABRICATION - A light emitting diode (LED) die includes a wavelength conversion layer having a base material, and a plurality of particles embedded in the base material including wavelength conversion particles, and reflective particles. A method for fabricating light emitting diode (LED) dice includes the steps of mixing the wavelength conversion particles in the base material to a first weight percentage, mixing the reflective particles in the base material to a second weight percentage, curing the base material to form a wavelength conversion layer having a selected thickness, and attaching the wavelength conversion layer to a die. | 03-14-2013 |
20130062639 | METHOD FOR FABRICATING LIGHT EMITTING DIODE (LED) DEVICES HAVING OUTPUT WITH SELECTED CHARACTERISTICS - A method for fabricating a light emitting diode (LED) device includes the steps of forming (or providing) a plurality of LED dice, forming a plurality of wavelength conversions layers, and then evaluating at least one electromagnetic radiation emission characteristic of each LED die and at least one color characteristic of each wavelength conversion layer. The method also includes the steps of comparing the evaluated characteristic of each LED die and the evaluated characteristic of each wavelength conversion layer to a database, selecting a selected LED die and a selected wavelength conversion layer based on the evaluating and comparing steps, and then attaching the selected wavelength conversion layer to the selected LED die. | 03-14-2013 |
20130062640 | LIGHT EMITTING DIODE (LED) PACKAGE HAVING WAVELENGTH CONVERSION MEMBER AND WAFER LEVEL FABRICATION METHOD - A light emitting diode (LED) package includes a substrate and a light emitting diode (LED) die on the substrate configured to emit electromagnetic radiation in a first spectral region. The (LED) package also includes a dielectric layer on the (LED) die and a wavelength conversion member on the dielectric layer configured to convert the electromagnetic radiation in the first spectral region to electromagnetic radiation in a second spectral region. The (LED) package also includes an interconnect comprising a conductive trace on the wavelength conversion member and on the dielectric layer in electrical contact with a die contact on the (LED) die and with a conductor on the substrate, and a transparent dome configured as a lens encapsulating the (LED) die. | 03-14-2013 |
20140051197 | METHOD FOR FABRICATING A VERTICAL LIGHT EMITTING DIODE (VLED) DIE HAVING EPITAXIAL STRUCTURE WITH PROTECTIVE LAYER - A method for fabricating a vertical light emitting diode (VLED) die includes the steps of: providing a substrate; forming an epitaxial structure on the substrate; forming an electrically insulative insulation layer covering the lateral surfaces of the epitaxial structure; forming an electrically non-conductive material on the electrically insulative insulation layer; and forming a mirror on the p-doped layer, with the electrically insulative insulation layer configured to protect the epitaxial structure during formation of the mirror. | 02-20-2014 |
20140151630 | PROTECTION FOR THE EPITAXIAL STRUCTURE OF METAL DEVICES - Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non-(or low) thermally conductive and/or non-(or low) electrically conductive carrier substrate that has been removed. | 06-05-2014 |
Patent application number | Description | Published |
20090086999 | Acoustic Transducer and Microphone Using the Same - An acoustic transducer comprises a substrate, a membrane configured to move relative to the substrate, a number of supports configured to suspend the membrane over the substrate, a first group of projections extending from the membrane, and a second group of projections extending from the substrate, the second group of projections being interweaved with and movable relative to the first group of projections, wherein each projection of one group of the first group of projections and the second group of projections is composed of a first conductive layer, a second conductive layer and a dielectric layer between the first conductive layer and the second conductive layer, and each projection of the other one group of the first group of projections and the second group of projections is composed of a third conductive layer. | 04-02-2009 |
20090101998 | ELECTRO-ACOUSTIC SENSING DEVICE - An electro-acoustic sensing device including a sensing chip, a carrier chip and a sealing element is provided. The sensing chip is for electro-acoustic transducing and thereby outputting an electrical signal. The carrier chip disposed below the sensing chip has at least one second connecting point, at least one electrical channel and at least one channel connecting point. The second connecting point is electrically contacted with the first connecting point. The second connecting point and the channel connecting point are located at different surfaces of the carrier chip. The electrical channel passes through the carrier chip and electrically connects the second connecting point and the channel connecting point. The electrical signal is transmitted to the channel connecting point via the first and the second connecting points and the electrical channel. The sealing element is disposed between the sensing chip and the carrier chip for air-tight coupling the two chips. | 04-23-2009 |
20090115430 | SENSOR - A sensor including a carrier having two channels, a capacitive sensing element disposed on the carrier, and a cover is provided. The capacitive sensing element has a membrane, and a first chamber is formed between the membrane and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A second chamber is formed between the membrane and the cover. The first chamber and the second chamber are located at two sides of the membrane, and the channels are respectively communicated with the first chamber and the second chamber. | 05-07-2009 |
20090161901 | ULTRA THIN PACKAGE FOR ELECTRIC ACOUSTIC SENSOR CHIP OF MICRO ELECTRO MECHANICAL SYSTEM - An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed. | 06-25-2009 |
20110121843 | SENSOR - A sensor including a carrier, a plurality of conductive bumps, a capacitive sensing element connected to the carrier through the conductive bumps, and a cover is provided. The capacitive sensing element has a membrane, and a channel is formed among the capacitive sensing element, the conductive bumps, and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A chamber is formed between the capacitive sensing element and the cover. The chamber and the channel are respectively located at two sides of the membrane. | 05-26-2011 |
Patent application number | Description | Published |
20090272702 | PROCESS AND APPARATUS FOR ONLINE REJUVENATION OF CONTAMINATED SULFOLANE SOLVENT - A continuous online process for rejuvenating whole stream of contaminated lean sulfolane in an extraction system is provided. In particular, a rejuvenator is installed in the solvent circulation loop to remove the contaminants continuously to keep the solvent clean, effective and less corrosive. Specifically, the rejuvenator comprises a high pressure vessel with a removable cover and a round rack with vertical stainless steel tubes fitted in the high pressure vessel. A magnetic bar is placed in each stainless steel tube. A screen cylinder is installed inside the ring of stainless steel tubes. As the contaminated sulfolane is passed through the rejuvenator, the rejuvenator picks up its contaminants. The rejuvenator can be dissembled to remove the contaminants periodically. The rejuvenator is characterized by simple in construction, reliable in operation, and low in operation and maintenance costs. With this rejuvenator, the extraction system can be operated at high efficiency and high capacity without the dreaded corrosion. | 11-05-2009 |
20100065504 | Novel filtration method for refining and chemical industries - A novel design of filters for removing iron rust particulates and other polymeric sludge from refinery and chemical process streams that are paramagnetic in nature is provided. The performance of these filters is greatly enhanced by the presence of the magnetic field induced by magnets. Basically, the filter comprises a high-pressure vessel with means to support the plurality of magnets in the form of bars or plates that are encased in stainless steel tubes or columns. Filters with various configurations are disclosed for accommodating the removal of contaminants from the process streams of different industries, with high efficiency for contaminants removal, simple construction, low operational and maintenance costs, and low hazardous operation. | 03-18-2010 |
20120165551 | Process and Apparatus for Online Rejuvenation of Contaminated Sulfolane Solvent - A continuous online process for rejuvenating whole stream of contaminated lean sulfolane in an extraction system is provided. A rejuvenator is installed in the solvent circulation loop to remove the contaminants continuously to keep the solvent clean, effective and less corrosive. The rejuvenator includes a high pressure vessel with a removable cover and a round rack with vertical stainless steel tubes fitted in the high pressure vessel. A magnetic bar is placed in each stainless steel tube. A screen cylinder is installed outside the ring of stainless steel tubes. As the contaminated sulfolane is passed through the rejuvenator, the rejuvenator picks up contaminants. The rejuvenator can be dissembled to remove the contaminants periodically. The rejuvenator is simple in construction, reliable in operation, and low in operation and maintenance costs. With this rejuvenator, the extraction system operates at high efficiency and high capacity without the dreaded corrosion. | 06-28-2012 |
Patent application number | Description | Published |
20120176104 | Synchronous Switching Power Converter with Zero Current Detection, and Method Thereof - Zero current detecting circuit includes a zero current comparator for determining current variation on an inductor of a synchronous switching power converter so as to accordingly turn off a down bridge transistor of the synchronous power converter; an integrator for executing integration to the signal on an input end of the zero current comparator within a transient period after the down bridge transistor is turned off, for eliminating the effect from the offset voltage of the zero current comparator; and an integration controller for determining if the down bridge transistor is turned off too early or too late so as to control the integrator to positively or negatively integrate. | 07-12-2012 |
20120235653 | Zero Current Detecting Circuit and Related Synchronous Switching Power Converter - A zero current detecting circuit is disclosed. The zero current detecting circuit includes a first zero current comparator for determining current variation on an inductor of a synchronous switching power converter so as to accordingly turn off a down-bridge transistor of the synchronous power converter; a second zero current comparator for determining whether the first zero current comparator turns off the down-bridge transistor too early or too late and outputting a comparison result, and a counter coupled to the second zero current comparator for ascending or descending a control bit according to the comparison result. | 09-20-2012 |
20130257403 | Constant-On-Time Generation Circuit and Buck Converter - A constant-on-time generation circuit for generating a turn-on signal to a buck is disclosed. The constant-on-time generation circuit includes a capacitor, a current source, a second resistor, an inverter, a transistor coupled to the inverter for generating a set turn-on signal according to a first front-end driver signal of the buck converter, a comparator including a negative input terminal coupled to a reference voltage, a positive input terminal coupled to the second resistor and the current source, and an output terminal, for comparing the reference voltage with the set turn-on signal to output a comparison result, and an SR-latch for outputting a turn-on signal to a driver stage circuit of the buck converter according to a trigger signal of the buck converter and the comparison result. | 10-03-2013 |
20140111168 | Synchronous Switching Power Converter with Zero Current Detection, and Method Thereof - The synchronous switching power converter comprises an inductor; a down bridge transistor; and a zero current detection circuit comprising a zero current comparator for receiving a fixed comparing level at a negative input end for comparison to change state of a comparing result; a delay unit, for delaying the comparing result to change state of a turn off signal according to a compensation voltage, to turn off the down bridge transistor when determining current on the inductor is zero; a transient state adjusting circuit for indicating a transient period when detecting state of the turn off signal is changed; and an integrator for integrating the compensation voltage by analog manner to adjust value of the compensation voltage and providing to the delay unit within the transient period; wherein the zero current comparator determines the integrator to integrate positively or negatively within the transient period. | 04-24-2014 |
20140375285 | DC-DC BOOST CONVERTER - The present disclosure provides a DC-DC boost converter operating in a pulse frequency modulation mode. The DC-DC boost converter includes an inductor, a first switch, a capacitor, a second switch and a control circuit. The inductor is coupled between an input voltage node and a phase node. The first switch is coupled between the phase node and an output voltage node. The capacitor is coupled between the output voltage node and a ground. The second switch is coupled between the phase node and the ground. The control circuit controls the conducting status of the first switch and the second switch. The control circuit detects whether the voltage at the phase node is changed. When the voltage at the phase node is not changed during a predetermined time interval, the control circuit turns on the first switch. Therefore, the noise with frequency could be hear by human is avoided. | 12-25-2014 |
Patent application number | Description | Published |
20090027008 | Battery module and charge and discharge method thereof - A battery module and a charge/discharge method thereof are provided. The battery module comprises a cell, a charge/discharge circuit, a temperature sensing circuit and a charge/discharge speed controlling circuit. The charge/discharge circuit is coupled to the cell. The temperature sensing circuit further comprises a temperature coefficient (PTC) device used for sensing a temperature of the cell, so that the temperature sensing circuit outputs a first analog signal according to the temperature of the cell. The charge/discharge speed controlling circuit, according to the first analog signal, outputs a control signal to the charge/discharge circuit to adjust a charge/discharge speed of the cell. | 01-29-2009 |
20090109163 | Driving apparatus, backlight module, and driving method - The invention discloses a driving apparatus for driving a back light module, and the driving apparatus comprises a driving unit and a deviation detecting unit. The driving unit is used for driving a plurality of lighting units to emit light. The deviation detecting unit is used for calculating for a current deviation of each of the lighting emitting units. Wherein, when the deviation overtakes a first threshold, the deviation detecting unit controls the driving unit to stop driving the lighting emitting units to light. | 04-30-2009 |
20100075207 | BATTERY LIFE ALARM SYSTEM AND BATTERY LIFE ALARM METHOD - A battery life alarm system and a battery life alarm method are provided. The battery life alarm system includes a first arithmetic unit, a second arithmetic unit and a third arithmetic unit. The first arithmetic unit outputs a capacity ratio according to a sense voltage and a design capacity of a battery. The second arithmetic unit outputs a life ratio according to a used life parameter and a design life parameter of the battery, wherein the used life parameter and design life parameter correspond to the using time or the charge/discharge times of the battery. The third arithmetic unit outputs a life index according to the capacity ratio, the life ratio and a weighted percentage. | 03-25-2010 |
20100176763 | Battery balancing apparatus and operating method thereof - The invention provides a battery balancing apparatus. The battery balancing apparatus is applied to a battery module of a laptop computer. The battery module comprises a plurality of batteries and a plurality of switch units coupled in series. The battery balancing apparatus comprises a first multiplexer, a second multiplexer, a switch module and a controlling module. The first multiplexer is coupled to the anode of each of the batteries; the second multiplexer is coupled to the cathode of each of the batteries. The switch module is coupled to the switch units. When a cycle counting parameter meets a default condition, the controlling module controls the first multiplexer, the second multiplexer and the switch module to be in a specific mode to form a specific current path among the batteries. | 07-15-2010 |
20100268970 | PORTABLE COMPUTER AND CHARGING METHOD THEREOF - A portable computer and a charging method thereof are provided. The portable computer includes a charge integrated circuit (IC), a basic input/output system (BIOS) and embedded controller (EC), a south bridge chip, a north bridge chip and a central processing unit (CPU). After the portable computer is connected to a battery, the BIOS and EC controls the south bridge chip to read a sealed security bit of the battery and checks whether the sealed security bit equals a default value. The BIOS and EC controls the south bridge chip to read a battery data of the battery if the sealed security bit equals default value. The BIOS and EC controls the charge IC via the south bridge chip to charge the battery according to the battery data. The CPU controls the south bridge chip and the north bridge chip. | 10-21-2010 |
20100324847 | BATTERY GAS-GAUGE CIRCUIT AND METHOD THEREOF - A battery gas-gauge circuit and method thereof are provided. The battery gas-gauge circuit includes a sensing resistor, a voltage-to-current conversion circuit, a subtractor, a comparator, a logic circuit and a power-management unit. In the voltage-to-current conversion circuit, two conversion circuits thereof obtain two voltage signals according to the two ends of the sensing resistor, respectively, and convert the two voltage signals to two current signals correspondingly. The subtractor generates a current difference signal according to the two current signals. The comparator outputs a comparison signal according to the current difference signal and a current dead-band. The logic circuit outputs a logic signal according to the comparison signal and a predetermined signal. The power-management unit determines battery power according to the logic signal. | 12-23-2010 |
20110096070 | STEREOSCOPIC IMAGE DISPLAY - A stereoscopic image display including an image displaying unit and an optical grating is provided. The image displaying unit has a black matrix and pixels surround by the black matrix, and each pixel has a width P in a first direction. The optical grating is disposed corresponding to the image displaying unit, wherein the optical grating comprises a plurality of constitutional groups arranged in the first direction. Each of constitutional groups comprises a plurality of slits having the same width W to expose the corresponding pixels, the width P of pixel and the width W of slit satisfy a specific relationship, so as to reduce the morie phenomenon and provide excellent stereo image quality. | 04-28-2011 |
20110127965 | BATTERY CHARGE-DISCHARGE PATH MANAGEMENT CIRCUIT AND METHOD THEREOF - A battery charge-discharge path management circuit and method thereof are provided. The battery charge-discharge path management circuit is coupled to a battery module and an electronic device. The battery charge-discharge path management circuit includes a first determination circuit, a second determination circuit and a switch circuit. The first determination is for determining whether the battery module and the electronic device are in a charge status or in a discharge status at the same time. The second determination circuit is for determining whether the electronic device is coupled to the battery module. The switch circuit forms a charge-discharge path between the battery module and the electronic device both if the battery module and the electronic device are in the discharge status or in the charge status at the same time and if the electronic device is coupled to the battery module. | 06-02-2011 |
20120075106 | PORTABLE COMPUTER SYSTEM - A portable computer system including a battery, a power switch and a computer unit is provided. The battery provides a supply signal to the power switch. The computer unit includes an embedded controller (EC), a driver and a user interface device. The EC determines whether the battery satisfies a low power condition according to the supply signal. If so, the EC provides a driving supply signal. The driver determines whether the supply signal satisfies a low voltage condition according to the driving supply signal. If so, the driver triggers an alert event. The user interface device triggers a user notification event according to the alert event. The power switch is further turned on/off in response to an operation event for respectively providing the supply signal to power the computer unit and put the computer unit in a power cut-off state. | 03-29-2012 |
20120286737 | ELECTRONIC DEVICE USING RECHARGEABLE BATTERIES AND BATTERY STATUS CONTROL METHOD APPLICABLE THERETO - An electronic device includes: a plurality of parallel-connection battery groups; and a plurality of battery balance circuits, respectively coupled to the parallel-connection battery groups, when the parallel-connection battery group has a temperature over a predetermined temperature range, the battery balance circuit performs a thermal balance operation on the parallel-connection battery group so that the temperature of the parallel-connection battery group returns into the predetermined temperature range. | 11-15-2012 |
20130155503 | AUTO-STEREOSCOPIC THREE DIMENSIONAL DISPLAY - An auto-stereoscopic type 3D-display including a transmissive display panel, a dynamic backlight module and a light guiding unit is provided. The dynamic backlight module is disposed at a side of the transmissive display panel and includes a plurality of bar-shaped light sources parallel to each other and a miniature lens. Each of the bar-shaped light sources includes an illumination region and the width of the illumination region is W | 06-20-2013 |
20130169518 | DISPLAY APPARATUS - A display apparatus including a backlight module, a filtering module and a display panel is provided. The backlight module includes a plurality of sets of light emitting devices. Each set of light emitting devices includes at least one first color light emitting device and at least one second color light emitting device. The filtering module is disposed on a transmission path of light emitted by the plurality of sets of light emitting devices and includes a plurality of sets of filtering units. Each set of filtering units is configured to allow light emitted by one set of light emitting devices to pass through. The display panel is disposed on the transmission path of the light emitted by the plurality of sets of light emitting devices. The backlight module turns on the plurality of sets of light emitting devices by turns. | 07-04-2013 |
20130169694 | DISPLAY APPARATUS - A display apparatus including a backlight module and a transmissive display panel is provided. The backlight module includes a light guide plate, a patterned light scattering structure, and a light emitting device. The light guide plate has a first surface, a second surface opposite to the first surface, and a light incident surface connecting the first surface and the second surface. The patterned light scattering structure is disposed on the light guide plate or inside the light guide plate. The patterned light scattering structure includes a plurality of light scattering strips. The light emitting device is configured to emit an illumination light and the light incident surface is disposed on the path of the illumination light. The light scattering strips are configured to scatter the illumination light. The transmissive display panel is disposed beside the backlight module. The first surface faces the transmissive display panel. | 07-04-2013 |
20140104878 | STEREOSCOPIC DISPLAY - A stereoscopic display including a backlight module, a display panel, a light-controlling element and a switching element is provided. The backlight module includes a light source and a light guide plate. The light guide plate has a light incident surface and a light emitting surface. The light-controlling element is disposed between the display panel and the light guide plate. The light-controlling element includes a plurality of light-controlling surface groups. Each of the light-controlling surface groups has a first surface and a second surface opposite to each other. At least one of the first surface and the second surface inclines with respect to the light emitting surface by over 90 degrees. The switching element is configured to switch between a light transmitting mode and a light scattering mode. | 04-17-2014 |
Patent application number | Description | Published |
20090086029 | Method of transmitting real-time network image - A method of transmitting a real-time network image is applied to a network system having an IP camera, a NAT router, the Internet, and a server of an Internet service provider (ISP). The method includes steps of: requesting an IP address from the DHCP server by the IP camera according to a DHCP protocol when the IP camera is linked to the Internet via the NAT router; automatically logging the IP camera in the ISP server after requesting the IP address and linking to the Internet; and building up a linking channel between the IP camera and the ISP server after finishing logging. As a result, other remote electronic devices can download a real-time image captured by the IP camera through the linking channel via the Internet after logging in the ISP server. | 04-02-2009 |
20090086730 | Method of making a router act as a relay proxy - The present invention is to provide a method of making a router act as a relay proxy, which is applied to a network system comprising a server of an Internet service provider, at least a router, the Internet and at least two network devices, wherein the router and network devices are connected with the server through the Internet respectively. The method comprises the steps of designating the router as a relay proxy when the router receives and accepts a relay request from the server, and directing the network devices to connect to the router designated as a relay proxy respectively when the server attempts to connect the network devices which enables the network devices to communicate and proceed data access with each other through the relay proxy. Thus, the data access with each other of said network devices may be accomplished through said relay proxy instead of said server. | 04-02-2009 |
20090089400 | Method of playing real time audio and video signals via a network platform - A method of playing real time audio and video signals via a network platform is applied to a network system, which comprises a server at an internet service provider (ISP) having a network platform comprising at least one user selectable icon corresponding to a web camera being connected to said server via internet, and comprises the steps of when said web camera is turned on and is connected to said network platform, said network platform making said icon enter a standby mode; when a computing device is connected to said server via internet and logged on to said network platform, and said icon in standby mode is clicked, said network platform establishing a connection channel between said web camera and said computing device; and transmitting audio and video signals captured by said web camera via internet and directly through said connection channel to said computing device in real time. | 04-02-2009 |
20090106394 | Method of establishing a tunnel between network terminal devices passing through firewall - A method of establishing a tunnel between network terminal devices passing through firewall is applied to a network system which comprises at least two private networks and Internet wherein each of said private networks comprises at least a NAT router and at least a network terminal device (such as a computer, web camera, IP phone, network disk or network printer with network interface etc.), and each of said network terminal devices connects to the Internet through corresponding NAT router respectively. The method enables each of said network terminal devices of said private networks to detect the firewall policy of corresponding NAT router so as to pass through the firewall installed in corresponding NAT router according to its setting and establish a tunnel between said network terminal devices over the Internet for communication and data access by using p2p, a local relay or a remote relay. | 04-23-2009 |
20090122722 | Method of connecting and sharing resources of network terminal devices of two private networks via user agents - A method of connecting and sharing resources of network terminal devices of two private networks via user agents is applied in a network system including at least two private networks and an Internet. Each private network includes at least two network terminal devices. At least one network terminal device installs a user agent, and each user agent is connected with the other network terminal device on a private network. Each network terminal device is connected to the Internet through a network connecting device. In the method, the network terminal device can be connected with other network terminal devices on the private network for accessing data, and a connection channel can be established between the network terminal devices on the public network and another private network, and the network terminal devices on the other private network can share the services provided by other network terminal devices on the private network. | 05-14-2009 |
20090135736 | Method of connecting network terminal devices of a private network by using a hand-held electronic device - The present invention is to provide a method applied to a network system which comprises a private network having at least a computer and at least two network terminal devices connecting to the Internet, and said computer is installed with a Fat UA while said hand-held electronic device is installed with a Thin User Agent enabling said hand-held electronic device to send a control command to said computer through the Internet. After said control command is received, said Fat UA encapsulates said control command in two SIP packets for connection request and connection response and send them to said two network terminal devices respectively. And after said SIP packets are received, said network terminal devices will send the SIP packets with each other so as to automatically establish a tunnel and proceed mutual data access therebetween according to said control command encapsulated in said SIP packets. | 05-28-2009 |
20090138961 | Portable ice proxy and method thereof - This invention is to provide a method applied to a network system comprising Internet and at least two private networks each having at least one NAT router and at least one network terminal device. Each network terminal device can link to Internet through an ICE proxy and the NAT router in the corresponding private network. The method allows an ICE proxy in a private network to hijack connection signals sent from a network terminal device, to write a plurality of candidate access points provided by an ICE protocol standard into a SDP packet containing the connection signals, and to transmit the SDP packet to a remote ICE proxy in another private network via Internet. As a result, the ICE proxies of two private networks can selectively use the candidate access points provided by the ICE protocol standard in order to pass through the respective NAT routers and firewalls thereof. | 05-28-2009 |
20100014536 | Method for building connection channel between network terminals through dynamic domain name sarver - A method for building a connection channel between network terminals through a dynamic domain name server (DDNS) is applied to a network system including a DDNS, the Internet, and at least one private network including more than one network address translation (NAT) router and at least one network terminal linked to the Internet through the NAT routers sequentially. The network terminal detects usable linking information of related equipments between the network terminal and the DDNS, and writes the linking information into a web page under a domain name registered with the DDNS by the network terminal, or into the DDNS. Another network terminal on the Internet wanting to link to the network terminal can input the domain name and read the linking information either from the web page or by using a utility program to search the DDNS, thereby building a connection channel with the network terminal. | 01-21-2010 |
Patent application number | Description | Published |
20110193241 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - According to an embodiment of the invention, a chip package is provided, which includes: a substrate having an upper surface and a lower surface; a hole extending from the upper surface toward the lower surface; an insulating layer located overlying a sidewall of the hole; and a material layer located overlying the sidewall of the hole, wherein the material layer is separated from the upper surface of the substrate by a distance and a thickness of the material layer decreases along a direction toward the lower surface. | 08-11-2011 |
20110221070 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - According to an embodiment of the invention, a chip package is provided. The chip package includes a substrate having an upper surface and a lower surface, a plurality of conducting pads located in the substrate or under the lower surface thereof, a dielectric layer located between the conducting pads, a hole extending from the upper surface towards the lower surface of the substrate and exposing a portion of the conducting pads, and a conducting layer located in the hole and electrically contacting the conducting pads. | 09-15-2011 |
20110278734 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - According to an embodiment of the invention, a chip package is provided. The chip package includes: a substrate having an upper surface and a lower surface; a plurality of conducting pads located under the lower surface of the substrate; a dielectric layer located between the conducting pads; a trench extending from the upper surface towards the lower surface of the substrate; a hole extending from a bottom of the trench towards the lower surface of the substrate, wherein an upper sidewall of the hole inclines to the lower surface of the substrate, and a lower sidewall or a bottom of the hole exposes a portion of the conducting pads; and a conducting layer located in the hole and electrically connected to at least one of the conducting pads. | 11-17-2011 |
20110278735 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - According to an embodiment of the invention, a chip package is provided. The chip package includes: a substrate having an upper surface and a lower surface; a plurality of conducting pads located under the lower surface of the substrate; a dielectric layer located between the conducting pads; a trench extending from the upper surface towards the lower surface of the substrate; a hole extending from a bottom of the trench towards the lower surface of the substrate, wherein a sidewall of the hole is substantially perpendicular to the lower surface of the substrate, and the sidewall or a bottom of the hole exposes a portion of the conducting pads; and a conducting layer located in the hole and electrically connected to at least one of the conducting pads. | 11-17-2011 |
20110285032 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - According to an embodiment of the invention, a chip package is provided. The chip package includes a substrate having an upper surface and a lower surface, a plurality of conducting pads located in the substrate or under the lower surface thereof, a dielectric layer located between the conducting pads, a hole extending from the upper surface towards the lower surface of the substrate and exposing a portion of the conducting pads, and a conducting layer located in the hole and electrically contacting the conducting pads. | 11-24-2011 |
20120112329 | CHIP PACKAGE - An embodiment of the invention provides a chip package, which includes: a semiconductor substrate having a device region and a non-device region neighboring the device region; a package layer disposed on the semiconductor substrate; a spacing layer disposed between the semiconductor substrate and the package layer and surrounding the device region and the non-device region; a ring structure disposed between the semiconductor substrate and the package layer, and between the spacing layer and the device region, and surrounding a portion of the non-device region; and an auxiliary pattern including a hollow pattern formed in the spacing layer or the ring structure, a material pattern located between the spacing layer and the device region, or combinations thereof. | 05-10-2012 |
20120261809 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - An embodiment of the invention provides a manufacturing method of a chip package including: providing a semiconductor wafer having a plurality of device regions separated by a plurality of scribe lines; bonding a package substrate to the semiconductor wafer wherein a spacer layer is disposed therebetween and defines a plurality of cavities respectively exposing the device regions and the spacer layer has a plurality of through holes neighboring the edge of the semiconductor wafer; filling an adhesive material in the through holes wherein the material of the spacer layer is adhesive and different from the adhesive material; and dicing the semiconductor wafer, the package substrate and the spacer layer along the scribe lines to form a plurality of chip packages separated from each other. | 10-18-2012 |
20120319297 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a substrate having a plurality of sides and a plurality of corner regions, wherein each of the corner regions is located at an intersection of at least two of the sides of the substrate; a device region formed in the substrate; a conducting layer disposed on the substrate and electrically connected to the device region; an insulating layer disposed between the substrate and the conducting layer; and a carrier substrate, wherein the substrate is disposed on the carrier substrate, and the substrate has a recess extending towards the carrier substrate in at least one of the corner regions. | 12-20-2012 |
20140199830 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - According to an embodiment of the invention, a chip package is provided. The chip package includes: a substrate having an upper surface and a lower surface; a plurality of conducting pads located under the lower surface of the substrate; a dielectric layer located between the conducting pads; a trench extending from the upper surface towards the lower surface of the substrate; a hole extending from a bottom of the trench towards the lower surface of the substrate, wherein a sidewall of the hole is substantially perpendicular to the lower surface of the substrate, and the sidewall or a bottom of the hole exposes a portion of the conducting pads; and a conducting layer located in the hole and electrically connected to at least one of the conducting pads. | 07-17-2014 |
20140199835 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - According to an embodiment of the invention, a chip package is provided. The chip package includes: a substrate having an upper surface and a lower surface; a plurality of conducting pads located under the lower surface of the substrate; a dielectric layer located between the conducting pads; a trench extending from the upper surface towards the lower surface of the substrate; a hole extending from a bottom of the trench towards the lower surface of the substrate, wherein an upper sidewall of the hole inclines to the lower surface of the substrate, and a lower sidewall or a bottom of the hole exposes a portion of the conducting pads; and a conducting layer located in the hole and electrically connected to at least one of the conducting pads. | 07-17-2014 |