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Yeh, Taichung City
Chen-Hao Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120028457 | Metal Layer End-Cut Flow - A method of patterning a metal layer is disclosed. The method includes providing a substrate and forming a material layer over the substrate. The method includes forming a second material layer over the first material layer. The method includes performing a first patterning process to the second material layer to form a trench in the second material layer. The first patterning process defines a width size of the trench, the width size being measured in a first direction. The method includes performing a second patterning process to the trench to transform the trench. The second patterning process defines a length size of the transformed trench. The length size is measured in a second direction different from the first direction. The method also includes filling the transformed trench with a conductive material. | 02-02-2012 |
Chen-Yu Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20130090469 | GREEN ZINC PORPHYRIN SENSITIZERS AND THEIR APPLICATIONS - The present invention relates to zinc porphyrin-based photosensitive dyes, specifically to zinc porphyrin-based photosensitive dyes with green transparency. The photosensitive dyes exhibit high push-pull ability in the zinc porphyrin-based structure, higher absorption and power conversion efficiency. The photosensitive dyes are used in the manufacture of dye-sensitive solar cells. | 04-11-2013 |
Chia-Lin Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120064145 | WOUND DRESSING - The present invention discloses a wound dressing which may be a double-layer wound dressing, comprising a polymer material layer in combination with anti-infective antibiotics or anti-infective Chinese herb medicine at the upper layer of the wound dressing, and a porous carbon material layer capable of loading with skin-associated epithelial cells at the lower layer of the wound dressing. The wound dressing with the antibiotics can block effectively the invasion of bacteria in the external environment, thereby preventing the wound from secondary infection. While covering the wound site, the porous carbon material layer with the epithelial cells can thus provide the healthy epithelial cells and attract the surrounding healthy cells to aggregate for secreting collagen so as to promote the wound healing process. According to the present invention, there is an obviously enhancing effect on wound tissue regeneration, restoration and healing, and there is a grant development potential in clinical applications. | 03-15-2012 |
Chung-Mao Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090178758 | METHOD OF ARRANGING STACKED CHIP BY PHOTO-CURING ADHESIVE - A method of arranging stacked chips by photo-curing adhesive includes the steps of disposing a first chip on a top side of a substrate and electrically connecting the first chip to the substrate by wire bonding; forming a photo-curing adhesive layer on a top side of the first chip; hardening the photo-curing adhesive layer by irradiation to convert it from colloid to solid for 70-80% degree of solidification; softening the photo-curing adhesive layer by heating of 50-80° C. to convert it from solid to semisolid to enable the photo-curing adhesive layer to be adherent; disposing a second chip on a top side of the photo-curing adhesive layer, then converting the photo-curing adhesive layer from semisolid to complete solid by heating of 100-150° C., and finally electrically connecting the second chip to the substrate by wire bonding. | 07-16-2009 |
| 20090186450 | IC PACKAGING PROCESS BY PHOTO-CURING ADHESIVE - A IC packaging process includes the steps of mounting at least one retaining member on a top side of a substrate, the retaining member defining a receiving space, a chip being mounted to the substrate and located in the receiving space; forming a photo-curing adhesive layer in the receiving space, the photo-curing adhesive layer being capable of shielding the chip completely; irradiating and developing the photo-curing adhesive layer to harden a part of the photo-curing adhesive layer to define a hardened portion thereof, the other part of the photo-curing adhesive layer defining a non-hardened portion corresponding to the chip; and removing the non-hardened portion to expose an active portion of the chip. | 07-23-2009 |
| 20090236712 | IC PACKAGE HAVING REDUCED THICKNESS - An IC package having reduced thickness includes a lead frame, a chip, and a plurality of bonding wires. The lead frame includes a front side, a rear side, a plurality of pins located on the front side, and a hollow portion formed on the lead frame. The chip is larger than the rear side of the lead frame. The chip includes a plurality of electrodes and is adhered to the rear side of the lead frame. The electrodes correspond to the hollow portion. The bonding wires pass through the hollow portion to be connected with the pins and the electrodes. Accordingly, the IC package can effectively take good use of the space below the lead frame, reducing the height of the bonding wires and saving the packaging space above the lead frame, and reduce the thickness of the IC package without addition of the cost and equipment. | 09-24-2009 |
| 20090239339 | METHOD OF STACKING DIES FOR DIE STACK PACKAGE - A method of manufacturing a die stack package includes the steps of providing a wafer having a first surface and a second surface, said first surface having a plurality of cut ways thereon, the second surface being coated with adhesive of a predetermined thickness at a predetermined position thereof, removing parts of the adhesive by photo-lithography, each of the parts of the adhesive corresponds to the cut way and is wider than the cut way; cutting the wafer along the cut ways to make a plurality of dies, each of the dies having a part of the adhesive thereon; and stacking each of the dies, whose surface having the adhesive faces a lower-layer die, on the lower-layer die. Therefore, the method facilitates the stacking operation and saves the production cost. | 09-24-2009 |
| 20090239341 | IC PACKAGING PROCESS - An IC packaging process includes the steps of preparing a substrate having a chip-receiving place formed on a front side thereof; creating a dam layer on the front side of the substrate; coating an ultraviolet adhesive layer on the dam layer; removing a part of the ultraviolet adhesive layer that corresponds to the chip-receiving place; removing a part of the dam layer that corresponds to the chip-receiving place; mounting a chip to the chip-receiving place in the open chamber and bonding wires between the substrate and the chip for electrical connection of the chip and the substrate; and mounting a cover layer on the ultraviolet adhesive layer and then heating the ultraviolet adhesive layer to adhesively fasten the cover layer on the dam layer. Accordingly, the IC packaging process effectively reduces the adhesive squeeze-out to prevent it from damage to the chip. | 09-24-2009 |
| 20090286355 | FLIP-CHIP PROCESS BY PHOTO-CURING ADHESIVE - A flip-chip process includes the steps of disposing a plurality of spherical contact members on a surface of a wafer; forming a photo-curing adhesive layer on the surface of the wafer, wherein said photo-curing adhesive layer covers a part of each of the spherical contact members to expose the spherical contact members of the photo-curing adhesive layer; solidifying the photo-curing adhesive layer by exposure; cutting the wafer into a plurality of chip units; placing the chip units on a substrate to let the spherical contact members lie against contact points of the substrate; and pressurizing the chip units and then heating the spherical contact potions to enable the spherical contact members to be welded and electrically connected with the chip units and the contact points of the substrate | 11-19-2009 |
Chun-Min Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090215572 | DIFFERENTIAL FOR MODEL CAR - A differential for a model car includes a housing having a chamber, four notches recessed in a periphery of the chamber and each having a trapezoid section, four blocks received in the notches respectively, a spider having four ends connected with the blocks respectively, four first bevel gears respectively sleeved on the ends of the spider, two second bevel gears received in the chamber and engaged with the first bevel gears respectively, a main gear sleeved on the housing, and two output shafts respectively passing through the main gear and the housing to be connected with the second bevel gears. Thus, the first bevel gears and the second bevel gears can be tightly engaged with each other by means of the arrangement of the spider and the blocks to eliminate the power loss of the model car. | 08-27-2009 |
| 20120238397 | LIMITED SLIPPERY DIFFERENTIAL FOR REMOTE CONTROL MODEL VEHICLE - A limited slippery differential used in a remote control model vehicle is disclosed to include a housing, a main gear mounted on one side of the housing, two transmission gears mounted inside the housing, and a differential unit mounted in the housing. When the remote control model vehicle is moving over a turn at a high speed, bevel gears of the differential unit are forced into positive engagement with respective transmission gears to reduce the speed of the vehicle wheels that are suspending in the air. When the remote control model vehicle moved over the turn, the bevel gears are forced away from the transmission gears by respective spring members, enabling engine power to be normally transferred to the wheels. | 09-20-2012 |
Chu-Yu Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120188184 | DISPLAY HAVING A FRAME, TOUCH DISPLAY, AND METHOD OF MANUFACTURING A FRAME - A display having a frame, a touch display, and a method of manufacturing a frame are provided. The display includes a first frame, a second frame, and a display panel. The first frame includes a bottom surface, a sidewall, and a strengthened structure. The sidewall connects the bottom surface to define an accommodation space. The strengthened structure connects a terminal of the sidewall away from the bottom surface, is located at a side of the sidewall facing the accommodation space, and is substantially parallel to the sidewall. The strengthened structure has a contact surface. The contact surface faces the bottom surface and is substantially parallel to the bottom surface. The second frame is configured in the accommodation space and has a locking portion that has a locking surface leaning against the contact surface of the strengthened structure. The display panel is accommodated in the second frame. | 07-26-2012 |
Hong-Zen Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100136579 | BIOMARKERS USEFUL IN LIVER FIBROSIS DIAGNOSIS - Identification of urokinase-type plasminogen, matrix metalloproteinase 9, and β-2-microglobulin as novel biomarkers associated with liver fibrosis and uses thereof in diagnosing liver fibrosis. | 06-03-2010 |
Hsin-Hsien Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090160653 | Anti-metal RFID tag and manufacturing method thereof - An anti-metal radio frequency identification (RFID) tag and a manufacturing method thereof are described. The anti-metal RFID tag includes a substrate having a first surface and a second surface on an opposite side thereof; a planar integral antenna formed on the first surface of the substrate; a RFID transceiver chip (i.e., RFID chip) disposed on the surface of the substrate and coupled to a signal feed point of the planar integral antenna. The flexible planar integral antenna and substrate are folded and then fixed by a fixing mechanism to form an anti-metal RFID tag with a feed-in structure, a RFID transceiver chip, and a radiator on one side, and a ground plane on the opposite side. A spacer is further sandwiched in the center of the folded structure, which is helpful for improving the antenna gain of the anti-metal RFID tag. | 06-25-2009 |
| 20100116893 | RFID TAG - A radio frequency identification (RFID) tag including a substrate, an RFID chip, a chip contact part, a folding circuit and a radiation part is provided. The chip contact part is formed on the substrate and electrically coupled to the RFID chip. The folding circuit is formed on the substrate and electrically coupled to the chip contact part. The folding circuit has a winding part, which forms a hollow region, for compensating the antenna electric length. The radiation part is formed on the substrate and electrically coupled to the folding circuit, wherein one terminal of the winding part of the folding circuit is open, and the other terminal is electrically coupled to the radiation part. At least one of the folding circuit and the radiation part is asymmetric to the chip contact part. | 05-13-2010 |
| 20110134622 | Wireless Communication Apparatus - A wireless communication apparatus in one embodiment includes a bag body and a radio frequency device. The bag body has at least a first slot, which extends to an edge of the bag body. The radio frequency device including a wireless integrated circuit chip is for radio-frequency signal transmission or receiving, and is disposed across a portion of the first slot and coupled to two connection ends of the bag body so that the bag body between the two connection ends serves as an inductance circuit. The inductance circuit of the two connection ends of the bag body is based on metallic material. An impedance of the inductance circuit is for conjugate matching with that of the radio frequency device and is determined according to a plurality of geometric parameters including: a distance from the edge to the wireless integrated circuit chip, and size of the first slot. | 06-09-2011 |
| 20130044401 | PROTECTION COMPONENT AND PROTECTION DEVICE USING THE SAME - A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions. | 02-21-2013 |
Jen-Chun Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090002239 | MICRO-STRIP ANTENNA WITH L-SHAPED BAND-STOP FILTER - A micro-strip antenna includes an L-shaped coupler, a set of micro-strip antennas, and an L-shaped band-stop filter. The set of micro-strip antennas includes at least one rectangular micro-strip antenna unit and a micro-strip line. The rectangular micro-strip antenna unit is coupled to the micro-strip line. The micro-strip line is coupled to the first end of the coupler. The band-stop filter is disposed along a corner of the rectangular micro-strip antenna unit, and is disposed between the antenna unit and the coupler without being physically connected to the antenna unit and the coupler. The width, length, and position of the L-shaped band-stop filter can be determined for the specific band-stop frequency and to optimize its coupling extent with the L-shaped coupler. | 01-01-2009 |
| 20100238084 | Dual-band Planar Micro-Strip Antenna - To meet the requirements including dual-band, a high gain, and a broadside radiation formation, a dual band planar micro-strip antenna utilizing antenna array is provided. One array element includes a rectangle-shaped micro-strip antenna and an arrow-shaped micro-strip antenna. A first resonant frequency is determined by a length of the rectangle-shaped micro-strip antenna. Slots are dug for satisfying a second resonance frequency. Curved surfaces of the arrow-shaped micro-strip antenna designed according to an ellipse equation so that a frequency resonance is reached under both the first resonant frequency and a second resonant frequency, and a broadside radiation formation is thus generated. A T-shaped jointer distributes power between antenna elements according to the output impedances of the antenna elements. An L-shaped band-stop filter located on the T-shaped jointer is utilized to suppress frequency resonance resulted from multiples of the first resonant frequency. | 09-23-2010 |
Jen-Yu Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120231063 | DRESSING COMPRISING ACTIVE COMPONENTS OF CENTELLA ASIATICA AND USE OF THE SAME - Provided is a dressing, comprising (a) a substrate layer and (b) an active layer, which is a nanofiber layer and comprises: (b1) at least one of gelatin and collagen; (b2) polyvinyl alcohol (PVA); and (b3) at least one of asiaticoside and a | 09-13-2012 |
Jer-Liang Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080266671 | OPTICAL AXIS ORIENTATING DEVICE FOR LIQUID LENS - The invention provides an optical axis orientating device for a liquid lens. The optical axis orientating device includes a transparent substrate, a symmetric electrode structure, and an insulating layer. The electrode structure is capable of supplying an electric field and defines a central axis. The insulating layer provides an optical axis orientating structure symmetric with respect to the central axis. In particular, at a rest state, an optical axis of the liquid lens and the central axis of electrode are substantially coaxial. | 10-30-2008 |
| 20090039826 | SOLAR ENERGY CHARGING/DISCHARGING SYSTEM AND CHARGING/DISCHARGING METHOD THEREOF - The invention discloses a solar energy charging/discharging system and a charging/discharging method thereof. The solar energy charging/discharging system according to the invention comprises a solar cell, a super-capacitor, and a switch. The solar cell is used for collecting solar energy and converting the solar energy into electrical energy. The super-capacitor is coupled to the solar cell. The super-capacitor and the solar cell are coupled to a load through the switch. The super-capacitor is selectively charged/discharged according to a threshold voltage. | 02-12-2009 |
| 20130069057 | WAFER WITH HIGH RUPTURE RESISTANCE - A wafer with high rupture resistance includes a plurality of surfaces, wherein the surfaces include a largest surface having a largest area than others and a side surface connected to the fringe of the largest surface. The side surface forms a nanostructured layer thereon to assist the stress dispersion of the wafer. Accordingly, the wafer is provided with a high rupture resistance so as to prevent the wafer from damages during semiconductor or other processes. | 03-21-2013 |
Jer-Liang Andrew Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100035022 | Substrate with High Fracture Strength - The invention discloses a substrate with high fracture strength. The substrate according to the invention includes a plurality of nanostructures. The substrate has a first surface, and the nanostructures are protruded from the first surface. By the formation of the nanostructures, the fracture strength of the substrate is enhanced. | 02-11-2010 |
Kung-Chen Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20130009316 | Apparatus and Methods for Dicing Interposer Assembly - Methods and apparatus for performing dicing of die on wafer interposers. Methods are disclosed that include receiving an interposer assembly including one or more integrated circuit dies mounted on a die side of an interposer substrate and having scribe areas defined in spaces between the integrated circuit dies, the interposer having an opposite side for receiving external connectors; mounting the die side of the interposer assembly to a tape assembly, the tape assembly comprising an adhesive tape and preformed spacers disposed between and filling gaps between the integrated circuit dies; and sawing the interposer assembly by cutting the opposite side of the interposer in the scribe areas to make cuts through the interposer, the cuts separating the interposer into one or more die on wafer assemblies. Apparatuses are disclosed for use with the methods. | 01-10-2013 |
| 20130119533 | Package for Three Dimensional Integrated Circuit - A wafer level package includes a semiconductor die bonded on a supporting wafer. The semiconductor die has at least a step recess at its substrate. An underfill layer is formed between the semiconductor die and the supporting wafer. Moreover, the height of the underfill layer is limited by the step recess. During a fabrication process of the wafer level package, the step recess helps to reduce the stress on the wafer level package. | 05-16-2013 |
| 20130122689 | Methods for De-Bonding Carriers - A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape. | 05-16-2013 |
Kwei-Tin Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20130101924 | OPTICAL PROXIMITY CORRECTION PHOTOMASK - An optical proximity correction (OPC) photomask is provided. The photomask includes two opening patterns and a pair of scattering bar patterns. The two patterns are arranged on a substrate along a first direction and separated from each other by a predetermined distance. The pair of scattering bar patterns is arranged on the substrate along a second direction perpendicular to the first direction and adjacent to two opposing sides of each opening pattern. Each scattering bar pattern does not overlap with the opening patterns on the first and second directions as viewed from a cross sectional perspective. A phase shift of 180° exists between each opening pattern and each scattering bar pattern. | 04-25-2013 |
Ping-Chun Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090283841 | SCHOTTKY DEVICE - An integrated circuit structure has a metal silicide layer formed on an n-type well region, a p-type guard ring formed on the n-type well region and encircling the metal silicide layer. The outer portion of the metal silicide layer extends to overlap the inner edge of the guard ring, and a Schottky barrier is formed at the junction of the internal portion of the metal silicide layer and the well region. A conductive contact is in contact with the internal portion and the outer portion of the metal silicide layer. | 11-19-2009 |
| 20120086099 | SCHOTTKY DIODE - An integrated circuit device and method for fabricating the integrated circuit device is disclosed. The integrated circuit device includes a substrate, a diffusion source, and a lightly doped diffusion region in contact with a conductive layer. A junction of the lightly doped diffusion region with the conductive layer forms a Schottky region. An annealing process is performed to form the lightly doped diffusion region. The annealing process causes dopants from the diffusion source (for example, an n-well disposed in the substrate) of the integrated circuit device to diffuse into a region of the substrate, thereby forming the lightly doped diffusion region. | 04-12-2012 |
Ping-Hsiang Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090193632 | ACCESSORY CONNECTING MEANS FOR BICYCLE SADDLE - An accessory connecting means for a bicycle saddle includes a first connecting member, a second connecting member and a latching apparatus. The first connecting member includes a fixing portion for fixation to the bicycle saddle, and a first engaging portion extending downward from a lower side of the fixing portion. The second connecting member includes a coupling portion removably coupled with the accessory, and a second engaging portion extending upwardly from an upper side of the coupling portion to releasably engage with the first engaging portion. The latching apparatus is disposed between the first and second engaging portions in such a way that the first and second engaging portions can be interlocked with each other at the time of engagement and quickly released from each other at the time of disengagement. | 08-06-2009 |
Po-Chun Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120228655 | LIGHT EMITTING DIODE WITH LARGE VIEWING ANGLE AND FABRICATING METHOD THEREOF - A light emitting diode includes a substrate, a plurality of pillar structures, a filler structure, a transparent conductive layer, a first electrode, and a second electrode. These pillar structures are formed on the substrate. Each of the pillar structures includes a first type semiconductor layer, an active layer, and a second type semiconductor layer. The first type semiconductor layers are formed on the substrate. The pillar structures are electrically connected with each other through the first type semiconductor layers. The filler structure is formed between the pillar structures. The filler structure and the second type semiconductor layers of the pillar structures are covered with the transparent conductive layer. The first electrode is in contact with the transparent conductive layer. The second electrode is in contact with the first type semiconductor layer. | 09-13-2012 |
Shih-Chang Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120177942 | COMPOSITE STRUCTURE AND METHOD FOR MAKING THE SAME - A composite structure for an electronic device includes: a metallic base part made from a metallic material and having at least one bonding region; at least one porous protrusion made from a sintered metal powder and bonded to and protruding from the bonding region; and at least one feature molded over the porous protrusion. | 07-12-2012 |
Shih-Yuan Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120234955 | FISHING REEL - The fishing reel has a body and a deceleration controller. The body has a magnetic spool and a side cover. The deceleration controller is mounted on the side cover and has a mounting tube, a moving shaft, a magnetic assembly and a switching button. The mounting tube is mounted through the side cover and has an inner thread. The moving shaft is movably mounted through the mounting tube and has an inside end, an outside end, an outer surface and a thread section. The thread section is formed in the outer surface of the moving shaft and screwed with the inner thread of the mounting tube. The magnetic assembly is securely mounted on the inside end of the moving shaft. The switching button is mounted securely on the outside end of the moving shaft to turn the moving shaft moveable inwardly or outwardly relative to the magnetic spool. | 09-20-2012 |
Shu-Tang Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20130126932 | PACKAGE OF ENVIRONMENTAL SENSITIVE ELECTRONIC ELEMENT - A package of an environmental sensitive electronic element including a first substrate, a second substrate, an environmental sensitive electronic element, a flexible structure layer and a filler layer is provided. The environmental sensitive electronic element is disposed on the first substrate and located between the first substrate and the second substrate. The environmental sensitive electronic element includes an anode layer, a hole injecting layer, a hole transporting layer, an organic light emitting layer, a cathode layer and an electron injection layer. The flexible structure layer is disposed on the environmental sensitive electronic element and includes a soft layer, a trapping layer and a protective layer. The material of the trapping layer is the same as the material of the electron injection layer. The filler layer is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive electronic element and the flexible structure layer. | 05-23-2013 |
Ta-Wei Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20130044068 | TOUCH DISPLAY PANEL - A touch display panel including a display panel and a touch panel is provided. The display panel includes a shielding pattern and a plurality of pixels separated by the shielding pattern and including multiple edge directions. The touch panel is disposed on the display panel and includes a plurality of first sensing series, a plurality of second sensing series and a plurality of dielectric patterns. Each dielectric pattern is disposed between each first sensing series and each second sensing series intersected therewith, and includes multiple edge direction non-parallel to the edge direction of the pixel. | 02-21-2013 |
Tung-Sung Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20130062390 | TRIGGER ASSEMBLY FOR SWITCHING ONE SHOOT MODE OR REPEAT SHOOT MODE - A trigger assembly for switching one shoot mode or repeat shoot mode includes a trigger, a switch, a fixing element, a trigger plate and a torsion spring. When a user wants to switch the shoot modes of the nail gun, the user turns the switch so that the fixing element moves along the curved track of the switch and the fixing element drives the trigger plate to move on a protrusion or on a through hole simultaneously. After the user presses the trigger, the trigger plate is resisted by the protrusion so that the nail gun is in one shoot mode. In addition, when the trigger plate is vibrating on the through hole, the nail gun is in repeat shoot mode. | 03-14-2013 |
Wei-Hao Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090179710 | Electromagnetic interference eliminating apparatus - An electromagnetic interference eliminating apparatus includes a multi-stage filter that is composed of inductors, capacitors and resistors, and an active filter. The multi-stage filter receives an input signal and provides an eliminating band to eliminate the noise in the input signal. The active filter is connected with the multi-stage filter for buffering the input signal that has been eliminated and exactly outputting an output signal. | 07-16-2009 |
| 20090244877 | PCB layout structrue for suppressing EMI and method thereof - A PCB layout structure for suppressing EMI and a method thereof is disclosed. The PCB layout structure for suppressing EMI includes a multi-layer PCB, a plurality of electric grids, and a plurality of conductive vias. The multi-layer PCB has a plurality of signal layers and a grounding layer. Each of the signal layers is disposed with a plurality of signal lines. The plurality of electric grids are disposed on each of the signal layers and cover the signal lines on each of the signal layers. The plurality of conductive vias are located between the layers of the multi-layer PCB to electrically connect the grounding layer with the electric grids on each of the signal layers. Thereby, electromagnetic waves of a specific wavelength are shielded by appropriately choosing the dimensions of the electric grids. | 10-01-2009 |
| 20120062341 | MICRO BAND-PASS FILTER - A micro band-pass filter is disclosed. The micro band-pass filter includes a first resonator having a first inter-digital unit and a second inter-digital unit, which is connected to a first wavelength-impedance converter, on two ends thereof, and a second resonator having a third inter-digital unit and a fourth inter-digital, which is connected to a second wavelength-impedance converter unit on two ends thereof. The second inter-digital unit is adapted to face the third inter-digital unit when forming a first inter-digital coupling structure along with the third inter-digital unit, and the first inter-digital unit is adapted to face the fourth inter-digital unit when forming a second inter-digital coupling structure. | 03-15-2012 |
| 20120062342 | MULTI BAND-PASS FILTER - A multi band-pass filter includes a first resonator and a second resonator. The first resonator has a first frequency pass band and a second frequency pass band. Moreover, the second resonator is electromagnetically coupled to another end of the first resonator. The second resonator has a third frequency pass band and a fourth frequency pass band, wherein the third frequency pass band overlaps (or is congruous with) the first frequency pass band and the fourth frequency pass band overlaps the second frequency pass band. | 03-15-2012 |
Yen-Cheng Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120298307 | ANTI-VIBRATING TAPE DISPENSER OF CARTON SEALING MACHINE - An anti-vibrating tape dispenser of a carton sealing machine includes a stand erected on the carton sealing machine, a fixed shaft extended transversally from the stand, a sleeve provided for loading a tape and coaxially sheathed on the periphery of the fixed shaft, a slide mechanism installed on the stand and below the sleeve and including a slide rail slidably installed on a fixed rail, an abutting rod fixed onto the slide rail and extended in the same direction of the fixed shaft, an abutting roller sheathed on the abutting rod and abutted against the external periphery of the tape roller. As the external diameter of the tape roller varies, the abutting roller slides along the slide rail to abut against the external periphery of tape roller normally, and the abutting roller includes one-way bearings for limiting the abutting roller to rotate round the abutting rod in a direction only. | 11-29-2012 |
Yen Ting Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120086787 | OPTICAL IMAGING LENS SYSTEM WITH DOUBLE OPTICAL PATHS - The present invention provides an optical imaging lens system with double optical paths, comprising: the first optical subsystem; the second optical subsystem having a back focal length equal to that of the first optical subsystem; an optical path selector selectively having a light reflection state or a light passing state; the first reflector set disposed at an image side of the first optical subsystem for directing light from the first optical subsystem to the optical path selector; and the second reflector set disposed at an image side of the second optical subsystem for directing light from the second optical subsystem to the optical path selector. In the present invention, the optical path selector can be controlled to have the light reflection state or the light passing state selectively, so that an image coming from the first optical subsystem or from the second optical subsystem is captured. | 04-12-2012 |
Yu-Ju Yeh, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120303473 | METHOD FOR TRADING AND TRIAL RUNNING INTEGRATED CIRCUIT DESIGN CODE - A method for trading and trial running an integrated circuit design code is provided. In the method, the integrated circuit design code is converted to a netlist, which is then trial ran and traded between a buyer and a seller on a network platform. The buyer raises a procurement request for an integrated circuit design code on the network platform, and the seller synthesizes the integrated circuit design code to the netlist and completes a trade with the buyer on the network platform. Alternatively, the buyer raises a trial run request for the netlist described by the seller on the network platform, and the seller encrypts the netlist to an encrypted netlist for the trial sampling of the buyer. Accordingly, a trade for the integrated circuit design code is achieved via the network platform for promoting cloud computing, competitiveness and affordability of the industry. | 11-29-2012 |