Patent application number | Description | Published |
20080284309 | Nitride Sintered Body and Method for Manufacturing Thereof - An insulating material high both in thermal conductivity and light reflectance, and a submount high in heat radiatability for mounting an LED element thereon, capable of raising a light utilization factor and quickly radiating heat generated from the element. For example, used as a substrate material of a submount is a nitride sintered body having a reflectance of light in the wavelength region of from 350 nm to 800 nm of 50% or more and a reflectance of light with a wavelength of 700 nm of 60% or more, obtained by sintering a preform consisting of a composition containing 100 parts by mass of aluminum nitride powder and 0.5 to 10 parts by mass of a compound containing an alkaline earth metal such as 3CaO×Al2O3 in an inert atmosphere containing a specific quantity of carbon vapor, or by burning a coat of a nitride paste applied on a base substrate having a heat resistance at a predetermined temperature. | 11-20-2008 |
20100000768 | LEAD-EMBEDDED METALLIZED CERAMICS SUBSTRATE AND PACKAGE - A metallized ceramics substrate including: a ceramics body; a wiring pattern formed on one surface of the ceramics body; and a lead electrically-connected to the wiring pattern. The ceramics body has a through-hole, the lead penetrates the through-hole and sticks out from another surface of the ceramics body, and the lead is fixed by filling an electroconductive filler between the lead and the through-hole for keeping airtightness. The metallized ceramics substrate does not cause a problem of interlayer peeling and is excellent in airtightness and electric conductivity. | 01-07-2010 |
20100012368 | CERAMIC SUBSTRATE MANUFACTURING METHOD AND CERAMIC SUBSTRATE - A method for manufacturing a ceramic substrate having a via hole(s) and a surface wiring pattern electrically connected to the via hole(s). The method includes: preparing a sintered ceramic substrate having a via hole(s); forming over the sintered ceramic substrate a sintered ceramic layer having a hole(s) or opening(s) whose bottom is configured to be at least a part of an exposed end surface of the via hole(s) by post-firing method; forming inside the hole(s) or opening(s) a conductive portion which electrically connects the surface of the sintered ceramic layer and the via hole(s); and forming over the surface of the sintered ceramic layer a surface wiring pattern electrically connected to the conductive portion. | 01-21-2010 |
20100015468 | METHOD FOR MANUFACTURING METALLIZED ALUMINUM NITRIDE SUBSTRATE - A method for manufacturing metallized aluminum nitride substrate. The method includes: Step A for forming a high-melting point metal layer over a sintered aluminum nitride substrate; Step B for forming over the high-melting point metal layer an intermediate metal layer of at least one selected from the group of: nickel, copper, copper-silver, copper-tin, and gold by plate processing; and Step C for forming a surface metal layer containing silver as a main component over the intermediate metal layer by coating a silver paste whose glass component content is 1 mass % or less and firing under nonoxidizing atmosphere. By this method, it is capable of forming a glass component-free silver layer which is adhered at a high degree of adhesion strength onto the high-melting point metal layer formed over the aluminum nitride substrate as a top face by thick-film method using a silver paste which makes thick-membrane forming easier. | 01-21-2010 |
20100065310 | METHOD FOR MANUFACTURING METALLIZED CERAMIC SUBSTRATE CHIP - A method for manufacturing a substrate chip including the steps of: setting the thickness of at least a part of a metal wiring pattern unit provided on the raw substrate to be 0.1 μm to 5 μm; forming a groove for creating at least a crack in the surface of the ceramic substrate along a planned cutting line which passes through the part of the metal wiring pattern unit by using a cutting wheel having a cutter blade being formed into substantially V shape in cross section along the circumferential portion of the disk rotating wheel; and cutting the raw substrate by giving load from just behind of the groove. When manufacturing metallized ceramic substrate chips by cutting (dividing) the ceramic substrate on the surface of which wiring patterns made of a metal film is formed, the method is capable of effectively using the base material, inhibiting defects in the metallized portion, and efficiently manufacturing the substrate chips in high yield. | 03-18-2010 |
20100178461 | METHOD FOR FABRICATING METALLIZED CERAMICS SUBSTRATE, METALLIZED CERAMICS SUBSTRATE FABRICATED BY THE METHOD, AND PACKAGE - A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers. | 07-15-2010 |
20100259160 | NITRIDE SINTERED BODY AND METHOD FOR MANUFACTURING THEREOF - An insulating material high both in thermal conductivity and light reflectance, and a submount high in heat radiatability for mounting an LED element thereon, capable of raising a light utilization factor and quickly radiating heat generated from the element. For example, used as a substrate material of a submount is a nitride sintered body having a reflectance of light in the wavelength region of from 350 nm to 800 nm of 50% or more and a reflectance of light with a wavelength of 700 nm of 60% or more, obtained by sintering a preform consisting of a composition containing 100 parts by mass of aluminum nitride powder and 0.5 to 10 parts by mass of a compound containing an alkaline earth metal such as 3CaO×Al2O3 in an inert atmosphere containing a specific quantity of carbon vapor, or by burning a coat of a nitride paste applied on a base substrate having a heat resistance at a predetermined temperature. | 10-14-2010 |
20120174390 | METHOD FOR MANUFACTURING METALLIZED CERAMIC SUBSTRATE CHIP - The present invention provides a method for manufacturing a substrate chip including the steps of: setting the thickness of at least a part of a metal wiring pattern unit provided on the raw substrate to be 0.1 μm to 5 μm; forming a groove for creating at least a crack in the surface of the ceramic substrate along a planned cutting line which passes through the part of the metal wiring pattern unit by using a cutting wheel having a cutter blade being formed into substantially V shape in cross section along the circumferential portion of the disk rotating wheel; and cutting the raw substrate by giving load from just behind of the groove. | 07-12-2012 |
20130146340 | VIA-HOLED CERAMIC SUBSTRATE, METALIIZED VIA-HOLED CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME - A via-holed ceramic substrate can be manufactured in a simple method by providing a via-holed ceramic substrate comprising: a sintered ceramic substrate; an electroconductive via formed in the sintered ceramic substrate, the electroconductive via having an electroconductive metal closely filled in a through-hole, the electroconductive metal containing a metal (A) having a melting point of 600° C. to 1100° C., a metal (B) having a melting point higher than the melting point of the metal (A), and an active metal; and an active layer formed in the interface between the electroconductive via and the sintered ceramic substrate. | 06-13-2013 |
20130186675 | METALLIZED VIA-HOLED CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURE THEREOF - The present invention provides a metallized via-holed ceramic substrate having (1) a sintered ceramic substrate, (2) an electroconductive via formed in the sintered ceramic substrate, having an electroconductive metal closely filled in a through-hole of the sintered ceramic substrate, wherein the electroconductive metal contains a metal (A) with melting point of 600° C. to 1100° C., a metal (B) with higher melting point than the metal (A), and an active metal, (3) a wiring pattern on at least one face of the sintered ceramics substrate, having an electroconductive surface layer and a plating layer thereon, wherein the electroconductive surface layer consists of an electroconductive metal containing the metal (A), the metal (B), and an active metal, (4) an active layer formed in the interface between the electroconductive via and the sintered ceramic substrate, and (5) an active layer formed in the interface between the electroconductive surface layer and the sintered ceramic substrate. | 07-25-2013 |
20130256014 | METALLIZED SUBSTRATE, METAL PASTE COMPOSITION, AND METHOD FOR MANUFACTURING METALLIZED SUBSTRATE - The present invention provides: a method for manufacturing a metallized substrate by which a fine pattern can be formed more easily; a metallized substrate manufactured by the method; and a metal paste composition to be used in the method. The metallized substrate has: a sintered nitride ceramic substrate ( | 10-03-2013 |
Patent application number | Description | Published |
20100167054 | BURNER FOR PRODUCTION OF INORGANIC SPHEROIDIZED PARTICLE - A burner for production of inorganic spheroidized particles according to the present invention includes a raw material powder supply path that supplies raw material powder by using oxygen or an oxygen-enriched air as a carrier gas; a powder diffusion plate having a plurality of fine holes, which is provided at a downstream end of the raw material powder supply path; a raw material diffusion chamber that is formed in a diffusion pipe provided at a downstream end of the powder diffusion plate; a fuel supply path disposed around the outer circumference of the raw material powder supply path; an oxygen supply path disposed around the outer circumference of the fuel supply path; and a combustion chamber disposed at a downstream side of the raw material diffusion chamber, which has an inside diameter increasing along the downstream direction and communicates with the fuel supply path and the oxygen supply path. | 07-01-2010 |
20110133353 | METHOD FOR MANUFACTURING INORGANIC SPHEROIDIZED PARTICLES - A method for producing inorganic spheroidized particles according to the present invention includes a step of producing the inorganic spheroidized particles by means of a diffusion type burner ( | 06-09-2011 |
20110135775 | BURNER FOR PRODUCING INORGANIC SPHERICAL PARTICLES - A burner for production of inorganic spheroidized particles according to the present invention includes a first raw material supply path ( | 06-09-2011 |
20120328994 | METHOD FOR BURNING BURNER - The object of the present invention is to provide a method for burning a burner which has NOx reduction effects and has practical value, and a device therefore; the present invention provide A method for burning a burner in a heating furnace including a step of: periodically changing at least one of a flow rate of a fuel fluid and a flow rate of an oxidizing agent fluid which are supplied to the burner while periodically changing an oxygen concentration in the oxidizing agent fluid, thereby an oxygen ratio which is calculated by dividing an amount of oxygen supplied by a theoretical necessary amount of oxygen is periodically changed, and the periodical change of the oxygen ratio is made different from the periodical change of the oxygen concentration to cause combustion in periodically vibrational conditions. | 12-27-2012 |
20130095436 | BURNER COMBUSTION METHOD - A burner combustion method is employed in which at least two burners ( | 04-18-2013 |
20130309617 | BURNER COMBUSTION METHOD - The present invention provides a burner combustion method for supplying and combusting an oxidant stream and a fuel stream, wherein the oxidant stream is composed of a primary oxidant stream jetted from around the periphery of the fuel stream or from a position near the fuel stream, and a plurality of secondary oxidant streams, and by periodically changing the flow rate of at least one of the primary oxidant stream and the plurality of secondary oxidant streams, and also causing a periodic change in the oxygen concentration within the oxidant stream, causing a periodic change in the oxygen ratio which is calculated by dividing the supplied amount of oxygen, supplied by the oxidant stream, by the theoretically required amount of oxygen, and providing a difference between the periodic changes in the oxygen concentration and the oxygen ratio, the combustion state adopts a periodic oscillating state. | 11-21-2013 |