Patent application number | Description | Published |
20110317965 | OPTICAL SUBASSEMBLY WITH OPTICAL DEVICE HAVING CERAMIC PACKAGE - An optical subassembly (OSA) with a newly arranged optical device is disclosed. The OSA provides a ceramic package that installs a semiconductor optical device, a joint portion welded to a lid of the ceramic package, and an optical coupling portion that receives an external optical fiber. In the OSA, the seal ring put between the top of the multi-layered ceramic package and the lid is isolated from the optical device; accordingly, the lid, the joint portion and the optical coupling portion are electrically isolated from the semiconductor optical device even when the OSA is installed in an optical apparatus such as an optical transceiver. | 12-29-2011 |
20120045183 | OPTICAL MODULE WITH CERAMIC PACKAGE - An optical module with an arrangement is disclosed in which the module has the LD, the TEC, and the lens with the lens carrier also mounted on the TEC. The signal light from the LD is concentrated by the lens and reflected by the mirror each assembled with the lens carrier mounted on the TEC. The TEC is mounted on the bottom metal that covers the bottom of the ceramic package, the first layer of which is widely cut to set the TEC therein. The FPC is coupled in at least two edges of the first ceramic layer left from the cut. | 02-23-2012 |
20120288239 | OPTICAL MODULE WITH DEVICE UNIT ELECTRICALLY ISOLATED FROM OPTICAL RECEPTACLE - An optical module is disclosed where an optical coupling efficiency between an optical device and an external fiber may be improved. The optical module includes an optical receptacle and a device unit assembled with the optical receptacle only via a stub as forming a gap to isolate these two components. The gap is filled with insulating resin or tightly covered by an insulating ring to reinforce the stub to be hard for an increased moment by the optical assemblies in the device unit. | 11-15-2012 |
20130148966 | OPTICAL MODULE HAVING A PLURALITY OF OPTICAL SOURCES - An optical module that outputs a wavelength multiplexed optical signal is disclosed. The optical module provides at least first to third optical source, a wavelength multiplexer, a polarization rotator, and a polarization multiplexer. The optical sources each outputting first to third optical signals with a wavelength different from others. The wavelength multiplexer multiplexes the first optical signal with the third optical signal. The polarization rotator rotates the polarization vector of one of the multiplexed first and third optical signals and the second signal by substantially 90°. The polarization multiplexer multiplexes the polarization rotated optical signal with the second optical signal. | 06-13-2013 |
20130148970 | RECEIVER OPTICAL MODULE FOR RECEIVING WAVELENGTH MULTIPLEXED OPTICAL SIGNALS AND METHOD TO ASSEMBLE THE SAME - A receiver optical module to facilitate the assembling is disclosed. The receiver optical module includes an intermediate assembly including the optical de-multiplexer and the optical reflector each mounted on the upper base, and the lens and the PD mounted on the sub-mount. The latter assembly is mounted on the bottom of the housing; while, the former assembly is also mounted on the bottom through the lower base. The upper base is apart from the bottom and extends in parallel to the bottom to form a surplus space where the amplifying circuit is mounted. | 06-13-2013 |
20130279862 | OPTICAL TRANSCEIVER IMPLEMENTING WITH FLEXIBLE PRINTED CIRCUIT CONNECTING OPTICAL SUBASSEMBLY TO CIRCUIT BOARD - An optical transceiver is disclosed, where the optical transceiver includes an optical subassembly (OSA) with a bottom plate for dissipating heat and connected to an electronic circuit with a flexible printed circuit (FPC). The FPC is soldered with the side electrodes of the OSA as forming a solder fillet in the plane electrode, or the FPC is soldered with the plane electrodes of the OSA as forming the solder fillet in the side electrodes, and leaving a limited room for receiving the curved FPC in peripheries of the OSA. | 10-24-2013 |
20130292646 | LIGHT RECEIVING DEVICE, OPTICAL DEVICE, AND METHOD FOR PRODUCING LIGHT RECEIVING DEVICE - A light receiving device includes a microlens | 11-07-2013 |
20140133862 | RECEIVER OPTICAL MODULE INSTALLING OPTICAL DEMULTIPLEXER AND METHOD TO PRODUCE OPTICAL DEMULTIPLEXER - A receiver optical module to receive a wavelength multiplexed light is disclosed. The optical module installs an optical demultiplexer to demultiplex the wavelength multiplexed light. The optical demultiplexer includes a wavelength selective filters each supported by a base substrate. A feature of the base substrate is that the base substrate in the plane shape thereof is a parallelogram with two sides forming an angle substantially equal to an incident angle of the wavelength multiplexed light input to the wavelength selective filter. | 05-15-2014 |
20140215816 | METHOD TO ASSEMBLE TRANSMITTER OPTICAL SUBASSEMBLY - A method to assemble a transmitter optical module is disclosed, where the optical module installs two lenses, one of which concentrates an optical beam emitted from a laser diode, while, the other collimates the optical beam concentrated by the former lens. The method has a feature that the first lens is firstly positioned in a point to collimate the optical beam coming from the laser diode, then, moved to a point, which is apart from the former point with respect to the laser diode, to concentrate the optical beam. The process performs the steps to position the lens by a jig to extract the optical beam passing through the first lens outside of the housing. | 08-07-2014 |
20140346323 | RECEIVER OPTICAL MODULE FOR RECEIVING WAVELENGTH MULTIPLEXED OPTICAL SIGNALS - A receiver optical module to facilitate the assembling is disclosed. The receiver optical module includes an intermediate assembly including the optical de-multiplexer and the optical reflector each mounted on the upper base, and the lens and the PD mounted on the sub-mount. The latter assembly is mounted on the bottom of the housing; while, the former assembly is also mounted on the bottom through the lower base. The upper base is apart from the bottom and extends in parallel to the bottom to form a surplus space where the amplifying circuit is mounted. | 11-27-2014 |