Patent application number | Description | Published |
20090142015 | OPTICAL MODULATORS - An optical modulator | 06-04-2009 |
20100156241 | METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE AND COMPOSITE SUBSTRATE - A supporting substrate and a piezoelectric substrate are prepared. A surface of the supporting substrate is bonded to the backside of the piezoelectric substrate with an organic adhesive layer interposed therebetween to form a laminated substrate. Subsequently, a peripheral surface of the laminated substrate is ground such that a peripheral surface of the piezoelectric substrate, a peripheral surface of the organic adhesive layer, and a peripheral surface of the supporting substrate on the side of the organic adhesive layer are made flush with each other. Subsequently, the surface of the piezoelectric substrate is polished to reduce the thickness of the piezoelectric substrate and performing mirror polishing of the surface. | 06-24-2010 |
20100167215 | COMPOSITE SUBSTRATE AND METHOD FOR FORMING METAL PATTERN - A composite substrate | 07-01-2010 |
20100244631 | COMPOSITE SUBSTRATE, ELASTIC WAVE DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE - In a composite substrate | 09-30-2010 |
20100329601 | OPTICAL WAVEGUIDE DEVICE - An optical waveguide device includes a substrate of a ferroelectric material, at least a pair of electrodes | 12-30-2010 |
20110041987 | METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE - A method for manufacturing a composite substrate according to the present invention includes a formation step of forming a structural element portion on a front surface of a first substrate, a grinding step of fixing the first substrate and grinding a back surface of the first substrate, and a bonding step of bonding a second substrate to the ground back surface with an adhesion layer composed of an adhesive. In such a manner, before forming the adhesion layer, the handling properties of which are affected by heating, and before grinding the first substrate, the strength of which is decreased by grinding, a process of forming the structural element portion, including a heating step, is performed. Furthermore, a piezoelectric substrate may be used as the first substrate, and a supporting substrate which supports the piezoelectric substrate may be used as the second substrate. | 02-24-2011 |
20110157673 | OPTICAL MODULATOR - An optical modulator includes an optical modulation substrate, an electrical length adjusting substrate, a package containing the substrates, and a plurality of input ports for inputting high frequency electrical signals. The optical modulation substrate includes a substrate body made of an electro-optic material, a ground electrode and a plurality of signal electrodes provided on the substrate body, optical waveguides propagating lights interacting with the signal electrodes, respectively, and electrode input ports inputting the high frequency electrical signals into the signal electrodes, respectively. The signal electrode includes an interacting part, an input end part provided between the electrode input port and interacting part, and a terminal part. The electrical length adjusting substrate includes conductive lines connected to the input ports for inputting the high frequency electrical signals, respectively. The conductive lines have electrical lengths different from each other for adjusting the phase differences among the ports. | 06-30-2011 |
20110262071 | BRANCHED OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE SUBSTRATE AND OPTICAL MODULATOR - An optical waveguide is formed on a ferroelectric substrate having a thickness of 20 μm or less by diffusion of a dopant or ion exchange. The optical waveguide has a non-branched section | 10-27-2011 |
20120086312 | COMPOSITE SUBSTRATE MANUFACTURING METHOD AND COMPOSITE SUBSTRATE - According to a composite substrate manufacturing method of the present invention, (a) a piezoelectric substrate having minute asperities formed in a rear surface thereof, and a support substrate having a smaller thermal expansion coefficient than the piezoelectric substrate are prepared, (b) a filler is applied to the rear surface | 04-12-2012 |
20120273117 | COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A supporting substrate and a piezoelectric substrate are prepared. A surface of the supporting substrate is bonded to the backside of the piezoelectric substrate with an organic adhesive layer interposed therebetween to form a laminated substrate. Subsequently, a peripheral surface of the laminated substrate is ground such that a peripheral surface of the piezoelectric substrate, a peripheral surface of the organic adhesive layer, and a peripheral surface of the supporting substrate on the side of the organic adhesive layer are made flush with each other. Subsequently, the surface of the piezoelectric substrate is polished to reduce the thickness of the piezoelectric substrate and performing mirror polishing of the surface. | 11-01-2012 |
20140191373 | Composite Wafer and Method for Manufacturing the Same - A composite wafer | 07-10-2014 |
20140210317 | Composite Substrate - A composite substrate according to the present invention includes a piezoelectric substrate that is a single-crystal lithium tantalate or lithium niobate substrate, a support substrate that is a single-crystal silicon substrate, and an amorphous layer joining together the piezoelectric substrate and the support substrate. The amorphous layer contains 3 to 14 atomic percent of argon. The amorphous layer includes, in order from the piezoelectric substrate toward the composite substrate, a first layer, a second layer, and a third layer. The first layer contains a larger amount of a constituent element (such as tantalum) of the piezoelectric substrate than the second and third layers. The third layer contains a larger amount of a constituent element (silicon) of the support substrate than the first and second layers. The second layer contains a larger amount of argon than the first and third layers. | 07-31-2014 |