Patent application number | Description | Published |
20080275698 | EXCITATION VECTOR GENERATOR, SPEECH CODER AND SPEECH DECODER - A speech encoder includes an adaptive codebook that generates an adaptive codevector representing a pitch component, a random codebook that generates a random codevector representing a random component, and a synthesis filter that generates a synthetic speech signal by being excited by the adaptive codevector and the random codevector. The random codebook includes an input vector provider configured to provide an input vector, and an excitation vector generator configured to generate an excitation vector as the random codevector by dispersing the input vector by using a fixed pattern. A length of the fixed pattern is shorter than a length of a sub-frame. | 11-06-2008 |
20090012781 | SPEECH CODER AND SPEECH DECODER - A speech coder includes a seed storage that stores a plurality of seeds used as an initial state of oscillation. An oscillator generates different vector sequences in accordance with values of the seeds stored in the seed storage and outputs the vector sequences as excitation vectors. A linear predictive coding synthesis filter receives, as input, the excitation vectors synthesizes the excitation vectors, and outputs a synthesized speech. The seed storage stores the plurality of seeds prepared in advance as the initial state of oscillation such that the vector sequences generated in the oscillator serve as effective excitation vectors from which the synthesized speech can be generated when the vector sequences are input to the linear predictive coding synthesis filter the oscillator receives, the seeds from the seed storage, generates, using the input seeds, vector sequences that serve as the effective excitation vectors from which the synthesized speech can be generated in the linear predictive coding synthesis filter, and outputs the vector sequences. | 01-08-2009 |
20100324892 | EXCITATION VECTOR GENERATOR, SPEECH CODER AND SPEECH DECODER - A code excited linear prediction type speech coder, which includes a seed storage that stores seeds used as an initial state of oscillation, and an oscillator that generates different vector sequences in accordance with values of the seeds stored in the seed storage and outputs the vector sequences as excitation vectors. The speech coder also includes a linear predictive coding synthesis filter that receives, as input, the excitation vectors, which are the vector sequences generated in accordance with the values of the seeds, that synthesizes the excitation vectors, and that outputs a synthesized speech. | 12-23-2010 |
Patent application number | Description | Published |
20100320623 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A multi-pin semiconductor device with improved reliability. In a multi-pin BGA, a plurality of wires for electrically coupling a semiconductor chip and a wiring substrate include a plurality of short and thin first wires located in an inner position and a plurality of second wires longer and thicker than the first wires. Since resin flows in from between thin first wires during resin molding, the resin pushes out air, thereby suppressing formation of voids. The reliability of the multi-pin BGA is thus improved. | 12-23-2010 |
20110074019 | SEMICONDUCTOR DEVICE - To improve reliability of a semiconductor device in which wire bonding using a wire made of copper is performed. A semiconductor device is configured so that one of end parts (wide width part) of a copper wire is joined via a bump on a pad (electrode pad) formed over a main surface (first main surface) of a semiconductor chip of the semiconductor device. The bump is made of gold, which is a metal material having a hardness lower than that of copper, and the width of the bump is narrower than the width of the wide width part of the wire. | 03-31-2011 |
20110076800 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - The reliability of a semiconductor device is improved. A sealing resin (sealed body) is formed between a sub-substrate (first base member) and a base substrate (second base member) that are provided individually and distinctly to be integrated therewith, and then, the sub-substrate is electrically coupled to the second base member. As a means for electrically coupling the sub-substrate to the base substrate, lands (first lands) formed on the sub-substrate and lands (second lands) formed on the base substrate are disposed such that the respective positions thereof are aligned. After through holes are formed from the lands of the sub-substrate toward the lands of the base substrate, a solder member (conductive member) is formed in each of the through holes. | 03-31-2011 |
20110201155 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - To provide a technology capable of preventing the deterioration of the reliability of semiconductor devices caused by the gasification of a part of components of the material constituting a wiring substrate. | 08-18-2011 |
20120061850 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - To achieve a reduction in cost of a semiconductor device, in a common board (a wiring board), a plurality of bonding leads each extend toward the center of the board, and a solder resist film as a die bonding region supporting a minimum chip is coated with a die bonding material. With this, even when a first semiconductor chip as a large chip is mounted, wire bonding can be performed without causing the die bonding material to cover the bonding leads. Thus, development cost can be reduced to reduce the cost of the semiconductor device (LGA). | 03-15-2012 |
20120081702 | METHOD OF INSPECTING SEMICONDUCTOR DEVICE - Reliability of a semiconductor device is improved. In a flatness inspection of BGA (semiconductor device), there is formed a flatness standard where a permissible range in the direction of (+) of flatness at normal temperature is smaller than a permissible range in the direction of (−). With use of the above flatness standard, a flatness inspection of the semiconductor device at normal temperature is performed to determine whether the mounted item is non-defective or defective. With the above process, defective mounting caused by a package warp when heated during reflow soldering etc. is reduced and reliability of BGA is improved. At the same time, flatness management of a substrate-type semiconductor device with better consideration of a mounting state can be performed. | 04-05-2012 |
20130065364 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - To provide a technology capable of preventing the deterioration of the reliability of semiconductor devices caused by the gasification of a part of components of the material constituting a wiring substrate. | 03-14-2013 |
20140073068 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a semiconductor device having improved reliability. In the semiconductor device in an embodiment, a mark is provided correspondingly to the bonding area of a belt-like wiring exposed from an opening provided in a solder resist. As a result, in an alignment step for the wire bonding area, the coordinate position of the wire bonding area can be adjusted using not the end portion of the opening formed in the solder resist, but the mark formed correspondingly to the wire bonding area as a reference. Also, in the semiconductor device in the embodiment, the mark serving as a characteristic pattern is formed. This allows the wire bonding area to be adjusted based on camera recognition. | 03-13-2014 |
20140175678 | Semiconductor Device and Method of Manufacturing the Same - To achieve a reduction in cost of a semiconductor device, in a common board (a wiring board), a plurality of bonding leads each extend toward the center of the board, and a solder resist film as a die bonding region supporting a minimum chip is coated with a die bonding material. With this, even when a first semiconductor chip as a large chip is mounted, wire bonding can be performed without causing the die bonding material to cover the bonding leads. Thus, development cost can be reduced to reduce the cost of the semiconductor device (LGA). | 06-26-2014 |
20140273353 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - To improve reliability of a semiconductor device in which wire bonding using a wire made of copper is performed. A semiconductor device is configured so that one of end parts (wide width part) of a copper wire is joined via a bump on a pad (electrode pad) formed over a main surface (first main surface) of a semiconductor chip of the semiconductor device. The bump is made of gold, which is a metal material having a hardness lower than that of copper, and the width of the bump is narrower than the width of the wide width part of the wire. | 09-18-2014 |
Patent application number | Description | Published |
20080316649 | METHOD FOR PRODUCING MAGNETIC RECORDING MEDIUM, MAGNETIC RECORDING MEDIUM PRODUCED BY THE PRODUCTION METHOD, AND MOLD STRUCTURE FOR USE IN THE PRODUCTION METHOD - The present invention provides a method for producing a magnetic recording medium having servo areas and data areas using a mold structure having a plurality of convex portions, the method, including: forming an imprint resist layer on a surface of a substrate for the magnetic recording medium, forming a convexo-concave resist pattern in the formed imprint resist layer by pressing the plurality of convex portions of the mold structure against the imprint resist layer, and transferring magnetism to the servo areas in the magnetic recording medium by applying a magnetic field to the servo areas via the mold structure. | 12-25-2008 |
20090002886 | METHOD FOR PRODUCING MAGNETIC RECORDING MEDIUM, MAGNETIC RECORDING MEDIUM PRODUCED BY THE PRODUCTION METHOD, AND MOLD STRUCTURE FOR USE IN THE PRODUCTION METHOD - The present invention provides a method for producing a magnetic recording medium having servo areas and data areas using a mold structure. The method includes at least forming an imprint resist layer on a substrate surface of a magnetic recording medium, forming a convexo-concave pattern in the imprint resist layer by pressing convex portions of the mold structure against the imprint resist layer, and transferring magnetism to the servo areas in the magnetic recording medium by applying a magnetic field via the mold structure, wherein the imprint resist layer is formed only on areas of the substrate surface corresponding to the data areas in the magnetic recording medium, and the magnetic field is applied to areas of the substrate surface corresponding to the servo areas, with the areas of the substrate surface corresponding to the servo areas being in contact with convex portions of the mold structure. | 01-01-2009 |
20090039560 | APPARATUS AND METHOD FOR MANUFACTURING MAGNETIC RECORDING MEDIUM - The present invention provides an apparatus for manufacturing a magnetic recording medium including, a mold structure formed of a disc-shaped substrate having on a surface thereof a concavo-convex pattern having convex portions which correspond to a servo area and a data area of a magnetic recording medium; and an imprinting and magnetic field applying unit which transfers a concavo-convex pattern on the basis of the concavo-convex pattern of the mold structure into an imprint resist layer that is made of an imprint resist composition and that is formed on a magnetic layer of a magnetic recording medium base by pressing the mold structure against the imprint resist layer, and which transfers magnetism to the servo area by application of a magnetic field via the mold structure. | 02-12-2009 |