Patent application number | Description | Published |
20090056767 | Surface treatment apparatus - A surface treating jig of the present invention includes a treatment solution collecting section having (i) a ring-like groove formed on a surface (a) facing to a surface (a) to be treated of a semiconductor wafer and (ii) a through hole for collecting the treatment solution, the through hole formed so as to be continuous with the ring-like groove. With this arrangement, the present invention provides a surface treatment apparatus that prevents the treatment solution from spattering to a surface other than the surface (a) to be treated, and thereby, treatment with the treatment solution can be performed only with respect to the target surface. | 03-05-2009 |
20090139662 | SEPARATING DEVICE - A separating device according to the present invention separates a support plate ( | 06-04-2009 |
20090218050 | Treatment liquid permeation unit and treating apparatus - A treatment liquid permeation unit ( | 09-03-2009 |
20090314438 | Supporting plate peeling apparatus - A supporting plate peeling apparatus in accordance with the present invention has removal means for removing an adhesive agent remaining on a side of a wafer from which a supporting plate has been peeled off, which adhesive agent is removed after (i) a supporting plate which supports a wafer reduced in thickness has been peeled off from the wafer and (ii) the side from which the supporting plate has been peeled off is washed with a washing liquid. The supporting plate peeling apparatus in accordance with the present invention is a supporting plate peeling apparatus which can remove the adhesive agent that remains on the side of the wafer from which the supporting plate has been peeled off that could not be completely removed just by the washing liquid, and which allows satisfactory completion of a peeling step. Hence, a supporting plate peeling apparatus is provided, which peels off a supporting plate for supporting a wafer, while not causing the side of the wafer from which the support plate has been peeled off to deteriorate. | 12-24-2009 |
20100000680 | SEPARATING APPARATUS AND SEPARATING METHOD - A separating apparatus according to the present invention includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes | 01-07-2010 |
20110259527 | STRIPPING DEVICE AND STRIPPING METHOD - A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate. | 10-27-2011 |
20130000852 | STRIPPING DEVICE AND STRIPPING METHOD - A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate. | 01-03-2013 |
20140332149 | METHOD FOR PROCESSING MOLD MATERIAL AND METHOD FOR MANUFACTURING STRUCTURAL BODY - A method for processing a mold material which includes a heating step of heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer. | 11-13-2014 |