Yasuhiro Kitamura
Yasuhiro Kitamura, Chiryu-City JP
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20090127624 | Semiconductor device having soi substrate and method for manufacturing the same - A semiconductor device includes: a SOI substrate including a support layer, a first insulation film and a SOI layer; a first circuit; a second circuit; and a trench separation element. The SOI substrate further includes a first region and a second region. The first region has the support layer, the first insulation film and the SOI layer, which are stacked in this order, and the second region has only the support layer. The trench separation element penetrates the support layer, the first insulation film and the SOI layer. The trench separation element separates the first region and the second region. The first circuit is disposed in the SOI layer of the first region. The second circuit is disposed in the support layer of the second region. | 05-21-2009 |
20100295170 | SEMICONDUCTOR DEVICE - A semiconductor device includes a multilayer wiring substrate and a double-sided multi-electrode chip. The double-sided multi-electrode chip includes a semiconductor chip and has multiple electrodes on both sides of the semiconductor chip. The double-sided multi-electrode chip is embedded in the multilayer wiring substrate in such a manner that the double-sided multi-electrode chip is not exposed outside the multilayer wiring substrate. The electrodes of the double-sided multi-electrode chip are connected to wiring layers of the multilayer wiring substrate. | 11-25-2010 |
20110068387 | Semiconductor device including vertical transistor and horizontal transistor and method of manufacturing the same - A semiconductor device includes a semiconductor substrate, a vertical transistor, a horizontal transistor, a lead, wire-bonding pads, and penetrating electrodes. The semiconductor substrate has first and second surfaces and includes a first surface portion adjacent to the first surface. The vertical transistor includes first and second electrodes on the first surface and a third electrode on the second surface. The horizontal transistor includes first, second, and third electrodes on the first surface. The vertical transistor and the horizontal transistor further include PN junction parts in the first surface portion. The lead is disposed to the first surface and is electrically coupled with the first electrode of the vertical transistor. The wire-bonding pads are disposed on the second surface. The second electrode of the vertical transistor and the first to third electrodes of the horizontal transistor are electrically coupled with the wire-boding pads through the penetrating electrodes. | 03-24-2011 |
20110248380 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - In a manufacturing method for a semiconductor device having a coil layer part on a substrate, two support substrates each having a flat surface are prepared, and a component member is formed on the flat surface of each of the support substrates. The component member includes a wiring portion having a predetermined pattern and an insulation film surrounding the wiring portion. The wiring portion is provided with a connecting portion exposing from the insulation film. A coil layer part is formed by opposing and bonding the component members formed on the support substrates to each other while applying pressure in a condition where the flat surfaces of the support substrates are parallel to each other. A coil is formed in the coil layer part by connecting the wiring portions through the connecting portions. | 10-13-2011 |
20120080772 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a substrate, a first single conductor, a single insulator, and a second single conductor. The substrate includes first and second regions located adjacent to each other. The first region has blind holes, each of which has an opening on a front surface of the substrate. The second region has a through hole penetrating the substrate. A width of each blind hole is less than a width of the through hole. The first single conductor is formed on the front surface of the substrate in such a manner that an inner surface of each blind hole and an inner surface of the through hole are covered with the first single conductor. The single insulator is formed on the first single conductor. The second single conductor is formed on the single insulator and electrically insulated form the first single conductor. | 04-05-2012 |
20120302036 | SEMICONDUCTOR DEVICE HAVING SOI SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes: a SOI substrate including a support layer, a first insulation film and a SOI layer; a first circuit; a second circuit; and a trench separation element. The SOI substrate further includes a first region and a second region. The first region has the support layer, the first insulation film and the SOI layer, which are stacked in this order, and the second region has only the support layer. The trench separation element penetrates the support layer, the first insulation film and the SOI layer. The trench separation element separates the first region and the second region. The first circuit is disposed in the SOI layer of the first region. The second circuit is disposed in the support layer of the second region. | 11-29-2012 |
Yasuhiro Kitamura, Chiriyu-City JP
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20090057812 | Semiconductor device having multiple element formation regions and manufacturing method thereof - In a manufacturing of a semiconductor device, at least one of elements is formed in each of element formation regions of a substrate having a main side and a rear side, and the substrate is thinned by polished from a rear side of the substrate, and then, multiple trenches are formed on the rear side of the substrate, so that each trench reaches the main side of the substrate. After that, an insulating material is deposited over an inner surface of each trench to form an insulating layer in the trench, so that the element formation regions are isolated. Thereby, generation of cracks and structural steps in the substrate and separation of element formation regions from the substrate can be suppressed. | 03-05-2009 |
Yasuhiro Kitamura, Fukaya-Shi JP
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20120062859 | POLISHING DEVICE, POLISHING METHOD, EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD - An exposure apparatus includes a projection optical system and a liquid supply device. The projection optical system includes an image plane side optical member, which is arranged in an optical path of exposure light, and a lens barrel, which supports the image plane side optical member. The liquid supply device polishes the image plane side optical member in a state supported by the lens barrel to change the shape of the image plane side optical member. | 03-15-2012 |
Yasuhiro Kitamura, Fukaya JP
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20120224172 | Optical components for use in measuring projection lens distortion or focus of an optical imaging system that images a substrate - New and useful optical components are provided, for use in measuring projection lens characteristics of an optical imaging system that images a substrate. The optical components comprise an array of full NA imagers located at the substrate plane, and a relay system for imaging the imagers to a detector that is remote from the substrate. | 09-06-2012 |
Yasuhiro Kitamura, Kawasaki JP
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20130036336 | TRANSMITTING DEVICE, TRANSCEIVER SYSTEM, AND CONTROL METHOD - An I/O controller | 02-07-2013 |
20130290768 | ARITHMETIC PROCESSING DEVICE, METHOD FOR CONTROLLING ARITHMETIC PROCESSING DEVICE, AND SYSTEM - An arithmetic processing device includes: a communicating unit that communicates with another arithmetic processing device; a clock controller that requests a change in the frequency of a clock signal; a sequence controller that instructs the other arithmetic processing device to change the amount of data to be transmitted by the other arithmetic processing device to the arithmetic processing device per unit time when the sequence controller is requested by the clock controller to change the frequency of the clock signal; and a control circuit that changes the amount of data to be transmitted by the communicating unit to the other arithmetic processing device per unit time when the other arithmetic processing device instructs the arithmetic processing device to change the amount of data to be transmitted by the arithmetic processing device to the other arithmetic processing device per unit time. | 10-31-2013 |
Yasuhiro Kitamura, Aichi JP
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20150101900 | SUSPENSION DEVICE - A suspension device includes a partition wall body which partitions the outside of a hollow pipe into a working chamber and a reservoir first chamber, a first piston which partitions the working chamber into an extension-side first chamber and a contraction-side first chamber, a first flow passage which allows communication between the extension-side first chamber and the reservoir first chamber, an extension-side second chamber which communicates with the extension-side first chamber, a second piston which partitions the interior of the hollow pipe into a contraction-side second chamber and a reservoir second chamber, a first damping flow passage which allows communication between an extension-side chamber and a contraction-side chamber, and a second damping flow passage which allows communication between the contraction-side chamber and a reservoir. A cross-sectional area of the extension-side second chamber is larger than that of the hollow pipe. | 04-16-2015 |
Yasuhiro Kitamura, Kyoto-Shi JP
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20150227128 | CONTROL DEVICE AND COMMUNICATION CONTROL METHOD - Provided is a PLC capable of changing a value of set information to be used in utilization of a communication protocol such as an FTP also during execution of a control program. A PLC includes a control program executing part configured to execute a control program, an acquiring part configured to acquire data from a field apparatus, a communicating part configured to make a communication with a server device by using the FTP, and a variable memory configured to store a variable to be used in utilization of the FTP and a value of the variable correspondingly to each other. The control program includes an instruction for transmitting data to the server device with the variable as an input variable. The PLC transmits the data to the server device based on the value of the variable when the instruction is started in order to execute the control program. | 08-13-2015 |