Patent application number | Description | Published |
20100151231 | BONDED BODY AND BONDING METHOD - A bonded body according to the present invention comprises a first object comprised of a first substrate and a first bonding film formed on the first substrate and a second object comprised of a second substrate and a second bonding film formed on the second substrate. The first and second bonding films contain a Si-skeleton constituted of constituent atoms containing silicon atoms and elimination groups bonded to the silicon atoms of the Si-skeleton. The Si-skeleton includes siloxane (Si—O) bonds. The constituent atoms are bonded to each other. When an energy is applied to at least a part region of the surface of each of the first and second bonding films, the elimination groups existing in the vicinity of the surface within the region are removed from the silicon atoms of the Si-skeleton so that each region develops a bonding property with respect to the other film to thereby bond the first and second objects together through the first and second bonding films. | 06-17-2010 |
20100193120 | BONDING METHOD, BONDED BODY, DROPLET EJECTION HEAD, AND DROPLET EJECTION APPARATUS - A bonding method of manufacturing a bonded body is provided. The bonding method comprises: after providing a first object on which a first plasma polymerization film is formed on a first base member, and the first plasma polymerization film having a surface, selectively applying an energy to a part of a predetermined region of the surface of the first plasma polymerization film to activate the part of the predetermined region of the surface of the plasma polymerization film; after providing a second object having a surface; and bonding the surface of the second object and the surface of the activated first plasma polymerization film so that the surface of the first plasma polymerization film is partially bonded to the surface of the second object at the part of the predetermined region to obtain the bonded body. | 08-05-2010 |
20100200144 | BONDING METHOD, BONDED BODY, DROPLET EJECTION HEAD, AND DROPLET EJECTION APPARATUS - A bonding method of manufacturing a bonded body is provided. The bonding method comprises: after providing a first object in which a plasma polymerization film having a surface is formed on a base member, applying an energy to the surface of the plasma polymerization film to activate the surface; after providing a second object having a surface to be bonded to the surface of the plasma polymerization film of the first object and no plasma polymerization film onto the surface of the second object, bonding the surface of the second object and the surface of the activated plasma polymerization film so that the surface of the plasma polymerization film is bonded to the surface of the second object to obtain the bonded body. | 08-12-2010 |
20100323192 | BASE MEMBER INCLUDING BONDING FILM, BONDING METHOD AND BONDED BODY - A base member including a bonding film comprises a substrate; and
| 12-23-2010 |
20100323193 | BASE MEMBER INCLUDING BONDING FILM, BONDING METHOD AND BONDED BODY - A base member including a bonding film comprises a substrate; and
| 12-23-2010 |
Patent application number | Description | Published |
20100098954 | OPTICAL ELEMENT AND OPTICAL ELEMENT MANUFACTURING METHOD - An optical element includes: first and second optical components, at least one of the first and second optical components having a light transmission characteristic; and a bonding film bonding the first and the second optical components together, the bonding film being formed by plasma polymerization and including an Si skeleton having a random atomic structure including a siloxane (Si—O) bond and a leaving group binding to the Si skeleton. The first and second optical components are bonded together by the adhesive properties of the bonding film which are provided by applying energy to at least a part of the bonding film to eliminate the leaving group from the Si skeleton at a surface of the bonding film. Preferably, an average thickness of the bonding film is equal to or less than a wavelength of light passing through the optical component having the light transmission characteristic. | 04-22-2010 |
20100101719 | OPTICAL ELEMENT AND METHOD FOR PRODUCING SAME - An optical element includes a first optical component and a second optical component each having light transmission properties; and a bonding film bonding together the first and the second optical components. The bonding film is formed by plasma polymerization and includes an Si skeleton having a random atomic structure including a siloxane (Si—O) bond and leaving groups binding to the Si skeleton. The first and the second optical components are bonded together by the bonding film having adhesive properties provided by applying energy to at least a part of the bonding film to eliminate the leaving groups from the Si skeleton at a surface of the bonding film. Additionally, the bonding film is formed so as to have approximately the same refractive index as that of at least one of the first and the second optical components by adjusting a film forming condition of the plasma polymerization. | 04-29-2010 |
20100104878 | BONDING METHOD, BONDED STRUCTURE, AND OPTICAL ELEMENT - A bonding method includes forming a bonding film on a surface of a base member by plasma polymerization, the bonding film including an Si skeleton of a random atomic structure including a siloxane (Si—O) bond and leaving groups binding to the Si skeleton; applying UV light to the bonding film to eliminate the leaving groups at the surface of the bonding film from the Si skeleton so as to provide adhesion properties to the bonding film, an accumulated amount of the UV light being adjusted to control a refractive index of the bonding film; and bonding the base member and an object together via the bonding film to obtain a bonded structure. | 04-29-2010 |
Patent application number | Description | Published |
20090115818 | DROPLET EJECTION HEAD AND DROPLET EJECTION APPARATUS - A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and one surface contacting the bonding film, the nozzle plate is bonded to the substrate through the bonding film to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding film containing an Si-skeleton constituted of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding film. | 05-07-2009 |
20090115823 | DROPLET EJECTION HEAD AND DROPLET EJECTION APPARATUS - A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and a second bonding film on one surface, the first and second films being bonded together to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding films contain an Si-skeleton of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding films. | 05-07-2009 |
20090246537 | BONDING METHOD, BONDED STRUCTURE, LIQUID DROPLET DISCHARGING HEAD, AND LIQUID DROPLET DISCHARGING APPARATUS - A bonding method includes a first process that includes plasmatizing a first gas including a raw gas containing a siloxane (Si—O) bond at a reduced-pressure atmosphere, substituting the first gas by a second gas mainly including an inert gas, and plasmatizing the second gas to form a first plasma polymerized film on at least a part of a base member so as to obtain a first bonded object including the base member and the plasma polymerized film and a second process that includes preparing a second bonded object that is to be bonded to the first bonded object and pressing the first and the second bonded objects against each other such that a surface of the first plasma polymerized film is closely contacted to a surface of the second bonded object to bond the objects together. | 10-01-2009 |
20100013891 | NOZZLE PLATE, METHOD FOR MANUFACTURING NOZZLE PLATE, DROPLET DISCHARGE HEAD, METHOD FOR MANUFACTURING DROPLET DISCHARGE HEAD, AND DROPLET DISCHARGE DEVICE - A nozzle plate, comprising: a nozzle discharging a liquid as droplets; a liquid-repellent film preventing attachment of the liquid on one surface of the nozzle plate; and a first bonding film formed on the other surface of the nozzle plate and bonded with a substrate. In the nozzle plate, the liquid-repellant film and the first bonding film are plasma polymerized films having a Si skeleton, the Si skeleton including a siloxane (Si—O) bond and having a random atomic structure, and an alkyl group bonded with the Si skeleton. Further, the alkyl group existing around a surface of the first bonding film is eliminated from the Si skeleton by an application of energy, which is applied to a region of at least a part of the first bonding film, so as to develop adhesiveness with respect to the substrate in the region of the surface of the first bonding film. | 01-21-2010 |
20100026760 | NOZZLE PLATE, METHOD FOR MANUFACTURING NOZZLE PLATE, DROPLET DISCHARGE HEAD, AND DROPLET DISCHARGE DEVICE - A nozzle plate includes: a nozzle for discharging a liquid as droplets; a liquid-repellent film suppressing attachment of the droplets on one surface of the nozzle plate; and a first bonding film formed on the other surface of the nozzle plate and bonded with a substrate. In the nozzle plate, the liquid-repellent film includes a first plasma polymerized film having a Si skeleton, which includes a siloxane (Si—O) bond and has a random atomic structure, and an elimination group bonded with the Si skeleton. Further, the elimination group existing around a surface of the first plasma polymerized film is eliminated from the Si skeleton by applying energy to a region of at least a part of the first plasma polymerized film so as to generate reactivity, on the region of the first plasma polymerized film, with a coupling agent having liquid repellency with respect to the droplets, and the first plasma polymerized film is bonded with the coupling agent by the reactivity so as to form the liquid-repellent film. The first bonding film is a second plasma polymerized film having a Si skeleton, which includes a siloxane (Si—O) bond and has a random atomic structure, and an elimination group bonded with the Si skeleton. The elimination group existing around a surface of the second plasma polymerized film constituting the first bonding film is eliminated from the Si skeleton by applying energy to a region of at least a part of the second polymerized film, so as to develop in the region of the surface of the second polymerized film adhesiveness with respect to the substrate. | 02-04-2010 |