Patent application number | Description | Published |
20090159631 | TENSION CONTROL FOR A SHEET MATERIAL FEEDER - A sheet material feeder includes a sheet material web, a vacuum box applying a tension force to a portion of the sheet material web extending into the vacuum box by applying a first vacuum force on the sheet material web, a first drive feeding the sheet material web into the vacuum box, a second drive pulling the sheet material web out of the vacuum box, and a system for applying a braking force to the sheet material web proximate to the vacuum box only during a decelerating movement of the sheet material web at the second drive. | 06-25-2009 |
20090165612 | AIR TEMPERATURE NORMALIZATION IN PAPER CUTTING SYSTEM - A paper cutting system includes a cutting assembly, a transport moving a web through the cutting assembly, a vacuum plenum utilizing a vacuum source to control the web moving through the cutting assembly, an air source providing purge air to the cutting assembly for removal of debris, and a heat exchanger normalizing a temperature of the purge air with respect to a temperature of ambient air prior to the purge air reaching the cutting assembly. The heat exchanger may be operated using the vacuum source. | 07-02-2009 |
20090165622 | METHOD AND APPARATUS FOR MINIMIZING FORCES ON A WEB - A method of controlling a web in, for example, a web cutter that minimizes the destructive forces that are experienced by the web. The method includes providing a motor system for driving a web handling mechanism structured to move the web, wherein the motor system includes a motor and a motor control subsystem having a digital filter (such as a PID controller or some other suitable closed loop controller), detuning the digital filter, and using the motor system having the detuned digital filter to drive the web handling mechanism. | 07-02-2009 |
20090167231 | System and method for controlling electric motors to simulate a mechanical differential - System and methods of controlling a plurality of motors based on a motor motion attribute, such as rotor position, velocity, or acceleration, which simulate the properties of a mechanical differential, including a pure differential, a limited slip differential, and/or a locking differential. The method may be employed in a number of applications, including, without limitation, a paper handling system, such as an inserter, to control the nips of a pinless cutter of an inserter, and in a vehicle. | 07-02-2009 |
20100122514 | ENVELOPE TRANSPORT - An apparatus includes a first feed path configured to transport an envelope from an input at an envelope supply to an insertion location, and a second feed path configured to transport the envelope with a mail piece insert therein from the insertion location to an output. The first and second feed paths intersect at an intersection spaced from the insertion location. The paths are angled relative to each other at the intersection. | 05-20-2010 |
Patent application number | Description | Published |
20120061205 | SYSTEM FOR CONTROLLING A DRIVE BELT IN A MAILPIECE FEEDER - A system for conveying mailpieces along a feed path including first and second conveyances. A first conveyance is operative to convey mailpieces along the feed path and includes a singulating and drive belt. The singulating and drive belts define a throat or singulating a mailpiece from the stack of mailpieces. A second conveyance accepts mailpieces from the first conveyance and conveys singulated mailpiece downstream of the first conveyance. The system further includes a series of sensors extending from the first to the second conveyance for issuing a gap signal indicative of the relative spacing between sequential mailpieces along the feed path. Additionally, the system includes a means to vary the velocity of the drive belt based upon the location of the gap signal along the series of sensors. | 03-15-2012 |
20120063875 | METHOD AND APPARATUS FOR EDGE JUSTIFICATION OF MAIL ITEMS - An edge justification device for a mail processing machine. The device shifts the mailpiece from bottom edge justified to top edge justified. The amount of shift is determined as a function of the height of the mail piece. One embodiment solves the problem of switching from bottom to top registration by having a series of steerable nips, which are arranged in line, parallel to the mail flow direction. As the mail piece travels though the justifier, the nips will rotate to impart a lateral velocity to the mail piece, shifting it over to properly justify it. In a further embodiment, the nips of the justification device are not steerable. Rather, a whole nip assembly that is transporting the mail piece is moved laterally to switch from bottom to top justification. | 03-15-2012 |
20120063876 | SYSTEM FOR CONTROLLING A SINGULATING BELT IN A MAILPIECE FEEDER - A system for conveying mailpieces along a feed path includes a plurality of conveyances. A first conveyance is operative to convey mailpieces along the feed path and includes a singulating and drive belt. The singulating and drive belts define a throat for singulating a mailpiece from the stack of mailpieces. A second conveyance accepts mailpieces from the first conveyance and conveys singulated mailpiece downstream of the first conveyance. The system further includes a series of sensors extending from the first to the second conveyance for issuing a gap signal indicative of the relative spacing between sequential mailpieces along the feed path. Additionally, the system includes a means, responsive to the gap signal, for developing a variable opposing force between the singulating and drive belts to optimize singulation of mailpieces along the feed path. | 03-15-2012 |
20120063877 | SYSTEM FOR CONTROLLING MAILPIECE CONVEYANCE IN A MAILPIECE FEEDER - A system for conveying mailpieces along a conveyance path and singulating a mailpiece from a stack of mailpieces along the conveyance path. The system includes a first conveyance for conveying mailpieces at a variable velocity and a second conveyance, downstream of the first conveyance, for conveying mailpieces at a constant velocity along the conveyance path. A series of optical sensors extends from the first to the second conveyance and is operative to issue a gap signal indicative of the relative spacing between sequential mailpieces along the conveyance path. A processor is responsive to the gap signal and is operative to control the first conveyance to decrease the relative spacing between sequential mailpieces when the gap signal exceeds a threshold value. | 03-15-2012 |
20130168205 | Accumulator for a Sheet Handling System - An apparatus for accumulating sheet material in a sheet handling system including a first conveyance, a second conveyance, an auxiliary conveyance and a processor to control the conveyances based upon a selected operating mode. The first conveyance receives singulated sheets and conveys the sheets to an accumulator station to produce completed collations. The second conveyance is operative to dispense completed collations from the accumulator station and, receives the completed collations from the first conveyance, in one operating mode, and from the auxiliary conveyance in another operating mode when the first conveyance is inoperative. The processor is responsive to a next collation signal, to control the conveyances based upon a selected one of the operating modes. | 07-04-2013 |
20130168914 | SYSTEM AND METHOD FOR MINIMIZING THE CONVEYANCE FEED PATH OF A SHEET MATERIAL HANDLING SYSTEM - A method for operating a sheet handling system including the steps of: determining a location of a next collation mark on select sheets of the stack of material, selecting an operating mode based upon the proximity of the next collation mark relative to a leading or trailing edge of each of the select sheets, processing the singulated sheets in a first operating mode when the next collation mark is proximal to the leading edge of each of the select sheets, and in a second operating mode, when the next collation mark is proximal to a trailing edge of each of the select sheets. Each of the select sheets is buffered to change the spatial relationship between each of the select sheet and each completed collation of sheets along the feed path. By selectively processing the sheets based upon the location of the next collation mark, the conveyance feed path is minimized. | 07-04-2013 |
20130168918 | VACUUM ROLLER ASSEMBLY - A vacuum roller assembly adapted to singulate a sheet from a stack of sheets. The vacuum roller assembly comprising a stationary inner plenum having a substantially linear plenum slot disposed in fluid communication with the vacuum source and a rotating vacuum roller disposed over the stationary inner plenum and rotating about a rotational axis. The vacuum roller includes a plurality of apertures disposed in fluid communication with the substantially linear plenum slot and about the periphery in at least one region of the roller. Furthermore, each of the apertures is substantially slot-shaped and defines a major axis. The major axis is off-axis with respect to the substantially liner plenum slot of the inner plenum to reduce audible noise levels produced by the rotating vacuum roller as air flows through each rotating aperture into the stationary linear plenum slot. | 07-04-2013 |
Patent application number | Description | Published |
20090133013 | Creating Virtual Applications - Embodiments are provided to create a virtual application or suite of virtual applications. In an embodiment, a system is configured to create a virtual package which includes information that can be used in a hosted virtual application environment. The system can provide bits of a virtual package based in part on user demand for an application or certain application functionality. In one embodiment, a system includes a sequencer component which can create a virtual package which includes information associated with setup-time and run-time changes made to a computing device. The sequencer component can use a number of extensible markup language (XML) files to create the virtual package. Other embodiments are available. | 05-21-2009 |
20130311600 | EVENT-RESPONSIVE DOWNLOAD OF PORTIONS OF STREAMED APPLICATIONS - Disclosed here are implementations involving an application program that includes an event handling portion. The event handling portion monitors for an event associated with execution of an initial portion of the application program downloaded with the event handling portion that involves an additional portion of the application program not yet downloaded. In response to detecting the event, the execution of the initial portion of the application program is paused by the event handler and downloading of the additional portion is initiated. Upon downloading the additional portion of the application program, execution of the initial portion of the application program can resume. | 11-21-2013 |
20140379851 | AGGREGATING CONTENT FROM DIFFERENT CONTENT SOURCES AT A CLOUD SERVICE - A cloud service stores and aggregates content that is obtained from different content sources using different protocols. For example, the content may include electronic messages, calendar information, contacts, social network content, feed data, search results, and the like. The cloud service aggregates content for each user based on the user's configuration settings. The cloud service may perform processing on the aggregated content before it is delivered and displayed to the user on the client device. For example, one or more views may be generated and stored by the cloud service before the view is requested from the client. Changes made to the aggregated content on the client may be synchronized with the content source. Searches may be made across all or a portion of the different content sources that are aggregated for a user. | 12-25-2014 |
20160099995 | AGGREGATING CONTENT FROM DIFFERENT CONTENT SOURCES AT A CLOUD SERVICE - A cloud service stores and aggregates content that is obtained from different content sources using different protocols. For example, the content may include electronic messages, calendar information, contacts, social network content, feed data, search results, and the like. The cloud service aggregates content for each user based on the user's configuration settings. The cloud service may perform processing on the aggregated content before it is delivered and displayed to the user on the client device. For example, one or more views may be generated and stored by the cloud service before the view is requested from the client. Changes made to the aggregated content on the client may be synchronized with the content source. Searches may be made across all or a portion of the different content sources that are aggregated for a user. | 04-07-2016 |
Patent application number | Description | Published |
20090249324 | VIRTUALIZED APPLICATION IMAGE PATCHING - Virtual applications are automatically kept up to date with the current version of a virtual application. Instead of the client having to obtain the entire version of the current virtual application, the client obtains the portions of the current virtual application that are changed from its version of the virtual application. After obtaining the changes needed to update its version of the virtual application, the client integrates those changes into its version of the virtual application. | 10-01-2009 |
20100312865 | ASYNCHRONOUS UPDATE OF VIRTUALIZED APPLICATIONS - A determination is made as to whether an updated image for an outdated virtualized application is available on a server. If it is determined that the updated image is available, then a background download operation configured to retrieve the updated image from the server is initiated. Another determination is made as to whether the outdated virtualized application is being utilized. After the background download operation is complete, if it is determined that the outdated virtualized application is not being utilized, then the outdated virtualized application is transformed to a current virtualized application by replacing at least a portion of the outdated virtualized application with the updated image. The outdated virtualized application and the current virtualized application are configured to be executed on the computer without installation on a computer. | 12-09-2010 |
20100318988 | MITIGATING USER INTERRUPTION FOR PARTIALLY DOWNLOADED STREAMED AND VIRTUALIZED APPLICATIONS. - Technologies are described herein for mitigating user interruption for partially downloaded or streamed virtual applications from a network, such as the Internet. A memory abstraction module can monitor page faults related to memory requests. A page fault may result from a memory request to load code that is not currently available and may trigger the retrieval of code from the network. A monitoring module may identify the quantity or frequency of page faults resulting in code fetches over the network. When the quantity or frequency of fetches over the network exceeds one or more thresholds, an indication of potential delay may be provided to the user. Modified code within an application can trigger download of a collection of code related to specific functionality within the application referred to as wrapped functionality. The user may be provided with a cancel button, or other mechanism, to abort the wrapped download. | 12-16-2010 |
20150347979 | SOCIAL CALENDAR EVENT SHARING - Social calendar event sharing is described. An event associated with a personal calendar can be shared as a link to a subscription to the event. One instance of the event details can be managed by a social calendar event sharing service that receives the event details, stores the event details associated with the personal calendar of the event organizer, and generates the link. The link can be used by anyone to access the event details and add the event their own personal calendars. The event details are provided as a subscription to the event so that an update to the event can be propagated to the subscribers that have added the event to their calendars. | 12-03-2015 |
Patent application number | Description | Published |
20110022090 | SPINOUS PROCESS FUSION IMPLANTS - A bone plate assembly including at least one bone plate, polyaxially adjustable fixation elements and a polyaxially adjustable locking mechanism. A first plate includes at least one polyaxial element for lockable connection with a fixation pad, and a connection feature which allows the plate to translate and polyaxially rotate relative to the locking mechanism. A second plate includes at least one polyaxial element for connection with a fixation pad and a connection feature for non-rotatable connection with the locking mechanism. The locking mechanism allows translation and polyaxial adjustment of the first plate relative to the second plate and locks the first and second plates via a taper lock. The fixation pad includes a deflectable spacer configured to prevent premature locking of the pad. Methods for implantation of the bone plate assembly between two bone structures are disclosed. Instrumentation for implantation, compression and locking of the bone plate assembly is disclosed. | 01-27-2011 |
20110029020 | Bone Tissue Clamp - Systems, methods, and kits incorporate a fusion member for vertebral processes. The fusion member may be unitary or modular. The fusion member comprises extensions configured to be crimped to vertebral processes. The extensions may comprise tabs configured to be deformed to further penetrate the vertebral processes. The tabs may also lock together modular components of the fusion member. The fusion member may comprise fasteners extending between the extensions. The fusion member may comprise a cage with a movable cover or a graft retention feature. | 02-03-2011 |
20110313472 | POLYAXIAL FACET FIXATION SCREW SYSTEM WITH FIXATION AUGMENTATION - A screw system includes a screw and a washer assembly captive to the screw. The washer assembly is polyaxially pivotable relative to the screw. The screw may be freely rotated in one direction relative to the washer assembly, but frictionally binds with the washer assembly when rotated in a second direction. Various auxiliary fixation features are disclosed. | 12-22-2011 |
20110319936 | SPINOUS PROCESS FUSION IMPLANTS AND INSERTION, COMPRESSION, AND LOCKING INSTRUMENTATION - A bone plate assembly including at least one bone plate, polyaxially adjustable fixation elements and a polyaxially adjustable locking mechanism. A first plate includes at least one polyaxial element for lockable connection with a fixation pad, and a connection feature which allows the plate to translate and polyaxially rotate relative to the locking mechanism. A second plate includes at least one polyaxial element for connection with a fixation pad and a connection feature for non-rotatable connection with the locking mechanism. The locking mechanism allows translation and polyaxial adjustment of the first plate relative to the second plate and locks the first and second plates via a taper lock. The fixation pad includes a deflectable spacer configured to prevent premature locking of the pad. Methods for implantation of the bone plate assembly between bone structures are disclosed. Instrumentation for implantation, compression and locking of the bone plate assembly is disclosed. | 12-29-2011 |
Patent application number | Description | Published |
20140128872 | Bone Plates, Screws, and Instruments - Systems for trauma and/or joint fusion implants and instruments include transarticular screw and intra-articular washer, polyaxial screw and plate, single- and multi-level polyaxial bone clamps, and minimally invasive adaptations. | 05-08-2014 |
20140207192 | Spinous Process Fusion Implants and Insertion, Compression, and Locking Instrumentation - A bone plate assembly including at least one bone plate, polyaxially adjustable fixation elements and a polyaxially adjustable locking mechanism. A first plate includes at least one polyaxial element for lockable connection with a fixation pad, and a connection feature which allows the plate to translate and polyaxially rotate relative to the locking mechanism. A second plate includes at least one polyaxial element for connection with a fixation pad and a connection feature for non-rotatable connection with the locking mechanism. The locking mechanism allows translation and polyaxial adjustment of the first plate relative to the second plate and locks the first and second plates via a taper lock. The fixation pad includes a deflectable spacer configured to prevent premature locking of the pad. Methods for implantation of the bone plate assembly between bone structures are disclosed. Instrumentation for implantation, compression and locking of the bone plate assembly is disclosed. | 07-24-2014 |
20140207199 | Spinous Process Fusion Implants and Insertion, Compression, and Locking Instrumentation - A bone plate assembly including at least one bone plate, polyaxially adjustable fixation elements and a polyaxially adjustable locking mechanism. A first plate includes at least one polyaxial element for lockable connection with a fixation pad, and a connection feature which allows the plate to translate and polyaxially rotate relative to the locking mechanism. A second plate includes at least one polyaxial element for connection with a fixation pad and a connection feature for non-rotatable connection with the locking mechanism. The locking mechanism allows translation and polyaxial adjustment of the first plate relative to the second plate and locks the first and second plates via a taper lock. The fixation pad includes a deflectable spacer configured to prevent premature locking of the pad. Methods for implantation of the bone plate assembly between bone structures are disclosed. Instrumentation for implantation, compression and locking of the bone plate assembly is disclosed. | 07-24-2014 |
20150100095 | BONE PLATES, SCREWS AND INSTRUMENTS - Systems for trauma and/or joint fusion implants and instruments include transarticular screw and intra-articular washer, polyaxial screw and plate, single- and multi-level polyaxial bone clamps, and minimally invasive adaptations. | 04-09-2015 |
20150112388 | BONE TISSUE CLAMP - Systems, methods, and kits incorporate a fusion member for vertebral processes. The fusion member may be unitary or modular. The fusion member comprises extensions configured to be crimped to vertebral processes. The extensions may comprise tabs configured to be deformed to further penetrate the vertebral processes. The tabs may also lock together modular components of the fusion member. The fusion member may comprise fasteners extending between the extensions. The fusion member may comprise a cage with a movable cover or a graft retention feature. | 04-23-2015 |
Patent application number | Description | Published |
20140057785 | PESTICIDAL COMPOSITIONS - Molecules according to Formula One: | 02-27-2014 |
20140135218 | PESTICIDAL COMPOSITIONS AND PROCESSES RELATED THERETO - This document discloses molecules having the following formula (Formula One) | 05-15-2014 |
20140162874 | PESTICIDAL COMPOSITIONS AND PROCESSES RELATED THERETO - This document discloses molecules having the following formula (“Formula One”): | 06-12-2014 |
20140221312 | USE OF BENZOXABOROLES AS VOLATILE ANTIMICROBIAL AGENTS ON MEATS, PLANTS, OR PLANT PARTS - This invention is related to use of a volatile antimicrobial compound against pathogens affecting meats, plants, or plant parts. The volatile antimicrobial compounds provided include certain oxaborole compounds, for example benzoxaboroles. Delivery systems are provided to take advantage of the volatile nature of these antimicrobial compounds. Also combinations with a volatile plant growth regulator, for example 1-methylcyclopropene, are disclosed. | 08-07-2014 |
20140349853 | USE OF BENZOXABOROLES AS VOLATILE ANTIMICROBIAL AGENTS ON MEATS, PLANTS, OR PLANT PARTS - This invention is related to use of a volatile antimicrobial compound against pathogens affecting meats, plants, or plant parts. The volatile antimicrobial compounds provided include certain oxaborole compounds, for example benzoxaboroles. Delivery systems are provided to take advantage of the volatile nature of these antimicrobial compounds. Also combinations with a volatile plant growth regulator, for example 1-methylcyclopropene, are disclosed. | 11-27-2014 |
20150045218 | PESTICIDAL COMPOSITIONS - This document discloses molecules having the following formula (“Formula I”): | 02-12-2015 |
20150289509 | PESTICIDAL COMPOSITIONS AND PROCESSES RELATED THERETO - This document discloses molecules having the following formula (Formula One) | 10-15-2015 |
20150291557 | METALLOENZYME INHIBITOR COMPOUNDS AS FUNGICIDES - The instant invention describes compounds of Formula I having metalloenzyme modulating activity, and methods of treating diseases, disorders or symptoms thereof mediated by such metalloenzymes. | 10-15-2015 |
20150291632 | METALLOENZYME INHIBITOR COMPOUNDS AS FUNGICIDES - The instant invention describes compounds of Formula I having metalloenzyme modulating activity, and methods of treating diseases, disorders or symptoms thereof mediated by such metalloenzymes. | 10-15-2015 |
20150327551 | PESTICIDAL COMPOSITIONS AND RELATED METHODS - This disclosure relates to the field of molecules having pesticidal utility against pests in Phyla Arthropoda, Mollusca, and Nematoda, processes to produce such molecules, intermediates used in such processes, pesticidal compositions containing such molecules, and processes of using such pesticidal compositions against such pests. These pesticidal compositions may be used, for example, as acaricides, insecticides, miticides, molluscicides, and nematicides. This document discloses molecules having the following formula I, or any agriculturally acceptable salt thereof, wherein R | 11-19-2015 |
Patent application number | Description | Published |
20150092377 | DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH IN-TRENCH PACKAGE SURFACE CONDUCTORS AND METHODS OF THEIR FABRICATION - Embodiments of methods for forming microelectronic device packages include forming a trench on a surface of a package body between exposed ends of first and second device-to-edge conductors, and forming a package surface conductor in the trench to electrically couple the first and second device-to-edge conductors. In one embodiment, the package surface conductor is formed by first forming a conductive material layer over the package surface, where the conductive material layer substantially fills the trench, and subsequently removing portions of the conductive material layer from the package surface adjacent to the trench. In another embodiment, the package surface conductor is formed by dispensing one or more conductive materials in the trench between the first and second exposed ends (e.g., using a technique such as spraying, inkjet printing, aerosol jet printing, stencil printing, or needle dispense). Excess conductive material may then be removed from the package surface adjacent to the trench. | 04-02-2015 |
20150162310 | DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PACKAGE SURFACE CONDUCTORS AND ADJACENT TRENCHES AND METHODS OF THEIR FABRICATION - Embodiments of methods for forming microelectronic device packages include forming a trench on a surface of a package body in an area adjacent to where first and second package surface conductors will be (or have been) formed on both sides of the trench. The method also includes forming the first and second package surface conductors to electrically couple exposed ends of various combinations of device-to-edge conductors. The trench may be formed using laser cutting, drilling, sawing, etching, or another suitable technique. The package surface conductors may be formed by dispensing (e.g., coating, spraying, inkjet printing, aerosol jet printing, stencil printing, or needle dispensing) one or more conductive materials on the package body surface between the exposed ends of the device-to-edge conductors. | 06-11-2015 |
20150194388 | SHIELDED DEVICE PACKAGES HAVING ANTENNAS AND RELATED FABRICATION METHODS - Shielded device packages and related fabrication methods are provided. An exemplary device package includes one or more electrical components, a molding compound overlying the one or more electrical components, a conductive interconnect structure within the molding compound, a conductive frame structure laterally surrounding the one or more electrical components and the interconnect structure, and a shielding structure overlying the one or more electrical components. The shielding structure is electrically connected to the frame structure and at least a portion of the molding compound resides between the shielding structure and the one or more electrical components. | 07-09-2015 |
20150255371 | SEMICONDUCTOR PACKAGE WITH THERMAL VIA AND METHOD FOR FABRICATION THEREOF - A semiconductor package includes a semiconductor die having an active face and dielectric layers disposed on the active face of the semiconductor die. At least one opening is formed through the dielectric layers and extends from a non-bond pad area of the active face to an exterior surface of the dielectric layers. An electrically conductive layer is formed in the opening and is in physical contact with the active face of the semiconductor die. A thermally conductive material fills the opening to form a thermal via for dissipating heat away from the semiconductor die. | 09-10-2015 |
20150262981 | LEADFRAME-BASED SYSTEM-IN-PACKAGES HAVING SIDEWALL-MOUNTED SURFACE MOUNT DEVICES AND METHODS FOR THE PRODUCTION THEREOF - Embodiments of a method for fabricating System-in-Packages (SiPs) are provided, as are embodiments of a SiP. In one embodiment, the method includes producing a first package including a first molded package body having a sidewall. A first leadframe is embedded within the first molded package body and having a first leadframe lead exposed through the sidewall. In certain implementations, a semiconductor die may also be encapsulated within the first molded package body. A Surface Mount Device (SMD) is mounted to the sidewall of the first molded package body such that a first terminal of the SMD is in ohmic contact with the first leadframe lead exposed through the sidewall. | 09-17-2015 |
20150270233 | WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES HAVING DELAMINATION-RESISTANT REDISTRIBUTION LAYERS - Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers are provided. In one embodiment, the method includes building inner redistribution layers over a semiconductor die. Inner redistribution layers include a body of dielectric material containing metal routing features. A routing-free dielectric block is formed in the body of dielectric material and is uninterrupted by the metal routing features. An outer redistribution layer is produced over the inner redistribution layers and contains a metal plane, which is patterned to include one or more outgassing openings overlying the routing-free dielectric block. The routing-free dielectric block has a minimum width, length, and depth each at least twice the thickness of the outer redistribution layer. | 09-24-2015 |
20150333028 | WAFER LEVEL PACAKGES HAVING NON-WETTABLE SOLDER COLLARS AND METHODS FOR THE FABRICATION THEREOF - Wafer level packages and methods for producing wafer level packages having non-wettable solder collars are provided. In one embodiment, the method includes forming solder mask openings in a solder mask layer exposing regions of a patterned metal level underlying the solder mask layer. Before or after forming solder mask openings in the solder mask layer, non-wettable solder collars are produced extending partially over the exposed regions of the patterned metal level. Solder balls are deposited onto the non-wettable solder collars and into the solder mask openings such that circumferential clearances are provided around base portions of the solder balls and sidewalls of the solder mask layer defining the solder mask openings. | 11-19-2015 |
20150357270 | INTEGRATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION - An integrated electronic package includes an integrated circuit (IC) die and conductive discrete components. Electrical interconnects are formed directly between bond pads on an active side of the IC die and contacts on the conductive discrete components without an intervening lead frame. The IC die, conductive discrete components and electrical interconnects are embedded in an encapsulation material. Contact surfaces of at least some of the conductive discrete components are exposed from the encapsulation material and can be attached to a printed circuit board in order to mount the integrated electronic package to the printed circuit board. | 12-10-2015 |
20150371960 | SYSTEM-IN-PACKAGES HAVING VERTICALLY-INTERCONNECTED LEADED COMPONENTS AND METHODS FOR THE FABRICATION THEREOF - System-in-Packages (SiPs) and methods for producing SiPs are provided. In one embodiment, the above-described SiP fabrication method includes the step or process of forming a through-hole in a core package, the core package containing an electrically-conducive routing feature exposed at a sidewall surface of the through-hole. A leaded component is positioned adjacent the core package such that an elongated lead of the leaded component extends into the through-hole. An electrically-conductive material, such as solder, is then applied into the through hole to electrically couple the elongated lead of the leaded component to the electrically-conductive routing feature of the core package. | 12-24-2015 |
20160005628 | WAFER LEVEL PACKAGING METHOD AND INTEGRATED ELECTRONIC PACKAGE - A wafer level packaging method entails providing electronic devices and providing a platform structure having cavities extending through the platform structure. The platform structure is mounted to a temporary support. One or more electronic devices are placed in the cavities with an active side of each electronic device facing the temporary support. The platform structure and the electronic devices are encapsulated in an encapsulation material to produce a panel assembly. Redistribution layers may be formed over the panel assembly, after which the panel assembly may be separated into a plurality of integrated electronic packages. The platform structure may be formed from a semiconductor material, and platform segments within each package provide a fan-out region for conductive interconnects, as well as provide a platform for a metallization layer and/or for forming through silicon vias. | 01-07-2016 |
20160064341 | MICROELECTRONIC PACKAGES HAVING TEXTURIZED SOLDER PADS AND METHODS FOR THE FABRICATION THEREOF - Microelectronic packages and methods for fabricating microelectronic packages having texturized solder pads, which can improve solder joint reliability, are provided. In one embodiment, the method includes forming a texturized dielectric region having a texture pattern, such as a hatch pattern, in an under-pad dielectric layer. A texturized solder pad is produced over the texturized dielectric region. The texturized solder pad has a solder contact surface to which the texture pattern is transferred such that the area of the solder contact surface is increased relative to a non-texturized solder pad of equivalent dimensions. | 03-03-2016 |
20160111403 | LEADFRAME-BASED SYSTEM-IN-PACKAGES HAVING SIDEWALL-MOUNTED SURFACE MOUNT DEVICES AND METHODS FOR THE PRODUCTION THEREOF - Embodiments of a method for fabricating System-in-Packages (SiPs) are provided, as are embodiments of a SiP. In one embodiment, the method includes producing a first package including a first molded package body having a sidewall. A first leadframe is embedded within the first molded package body and having a first leadframe lead exposed through the sidewall. In certain implementations, a semiconductor die may also be encapsulated within the first molded package body. A Surface Mount Device (SMD) is mounted to the sidewall of the first molded package body such that a first terminal of the SMD is in ohmic contact with the first leadframe lead exposed through the sidewall. | 04-21-2016 |
20160118313 | FAN-OUT WAFER LEVEL PACKAGES CONTAINING EMBEDDED GROUND PLANE INTERCONNECT STRUCTURES AND METHODS FOR THE FABRICATION THEREOF - Fan-Out Wafer Level Packages (FO-WLPs) and methods for fabricating FO-WLPs containing Embedded Ground Planes (EGPs) and backside EGP interconnect structures are provided. In one embodiment, the method includes electrically coupling an EGP to a backside terminal of a first microelectronic device through a backside EGP interconnect structure. A molded package body is formed around the first microelectronic device, the EGP, and the EGP interconnect structure. The molded package body has a frontside at which the EGP is exposed. One or more Redistribution Layers are formed over the frontside of the molded packaged body and contain at least one interconnect line electrically coupled to the backside contact through the EGP and the backside EGP interconnect structure. | 04-28-2016 |
Patent application number | Description | Published |
20140239497 | PACKAGED SEMICONDUCTOR DEVICE - A packaged semiconductor device includes a substrate including a first major surface, a second major surface, first vias running between the first major surface and the second major surface, first contact pads contacting the first vias at the first major surface, second contact pads contacting the first vias at the second major surface, and an opening between the first major surface and the second major surface. A first integrated circuit (IC) die is positioned in the opening in the substrate. Electrical connections are formed between the second IC die and the second contact pads. A first conductive layer is over the first contact pads and contact pads on the first IC die. Encapsulating material is on the second major surface of the substrate around the first IC die, the second IC die, the electrical connections, and between edges of the opening and edges of the first IC die. | 08-28-2014 |
20140264945 | STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF - A stacked microelectronic package can comprise a package body having an external vertical package sidewall, a plurality of microelectronic devices embedded within the package body, and package edge conductors electrically coupled to the plurality of microelectronic devices and extending to the external vertical package sidewall. A cavity is formed on an external surface of the package body between a first one of the package edge conductors and a second one of the package edge conductors. Electrically conductive material is in the cavity and in electrical contact with a first and a second one of the package edge conductors, wherein the conductive material in the cavity is within planform dimensions of the microelectronic package. | 09-18-2014 |
20140353840 | STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF - A method for fabricating a stacked microelectronic device includes attaching a first package layer to a second package layer to form stacked microelectronic layers. Saw streets of the first package layer overlie and are aligned with saw streets of the second package layer. The first and second package layers include respective edge connectors formed between the saw streets and electronic components in the first and second package layers. A through package via is formed in one of the saw streets of the first and second package layers. The via is filled with conductive material. The stacked package layers are singulated along the saw streets in a manner that retains a portion of the conductive material to form a sidewall connector between at least two of the edge connectors. | 12-04-2014 |
20150061139 | MICROELECTRONIC PACKAGES CONTAINING OPPOSING DEVICES AND METHODS FOR THE FABRICATION THEREOF - Microelectronic packages and methods for fabricating microelectronic packages are provided. The fabrication method may be carried-out utilizing a preformed panel having a frontside cavity and a backside cavity in which first and second microelectronic devices are positioned, respectively. One or more frontside RDL layers are produced over the frontside of the preformed panel in ohmic contact with or otherwise electrically coupled to the first microelectronic device. Similarly, one or more backside RDL layers are formed over the backside of the preformed panel in ohmic contact with or otherwise electrically coupled to the second microelectronic device. A frontside contact array is produced over the frontside of the preformed panel and electrically coupled to at least the first microelectronic device through the frontside RDL layers. Lastly, the preformed panel is singulated to yield a microelectronic package including a package body in which the first and second microelectronic devices are embedded. | 03-05-2015 |
20150115454 | MICROELECTRONIC PACKAGES HAVING LAYERED INTERCONNECT STRUCTURES AND METHODS FOR THE MANUFACTURE THEREOF - Microelectronic packages having layered interconnect structures are provided, as are methods for the fabrication thereof. In one embodiment, the method includes forming a first plurality of interconnect lines in ohmic contact with a first bond pad row provided on a semiconductor. A dielectric layer is deposited over the first plurality of interconnect lines, the first bond pad row, and a second bond pad row adjacent the first bond pad row. A trench via is then formed in the dielectric layer to expose at least the second bond pad row therethrough. A second plurality of interconnect lines is formed in ohmic contact with the second bond pad row within the trench via. The second plurality of interconnect lines extends over the first bond pad row and is electrically isolated therefrom by the dielectric layer to produce at least a portion of the layered interconnect structure. | 04-30-2015 |
20150137381 | OPTICALLY-MASKED MICROELECTRONIC PACKAGES AND METHODS FOR THE FABRICATION THEREOF - Microelectronic packages and methods for fabricating microelectronic packages having optical mask layers are provided. In one embodiment, the method includes building redistribution layers over the frontside of a semiconductor die. The redistribution layers includes a body of dielectric material in which a plurality of interconnect lines are formed. An optical mask layer is formed over the frontside of the semiconductor die and at least a portion of the redistribution layers. The optical mask layer has an opacity greater than the opacity of the body of dielectric material and blocks or obscures visual observation of an interior portion of the microelectronic package through the redistribution layers. | 05-21-2015 |
20150145108 | MICROELECTRONIC PACKAGES HAVING RADIOFREQUENCY STAND-OFF LAYERS AND METHODS FOR THE PRODUCTION THEREOF - Microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the method includes producing a plurality of vertically-elongated contacts in ohmic contact with interconnect lines contained within one or more redistribution layers built over the frontside of a semiconductor die. A molded radiofrequency (RF) separation or stand-off layer is formed over the redistribution layers through which the plurality of vertically-elongated contacts extend. An antenna structure is fabricated or otherwise provided over the molded RF stand-off layer and electrically coupled to the semiconductor die through at least one of the plurality of vertically-elongated contacts. | 05-28-2015 |
20150348920 | MICROELECTRONIC PACKAGES HAVING RADIOFREQUENCY STAND-OFF LAYERS AND METHODS FOR THE PRODUCTION THEREOF - Microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the method includes producing a plurality of vertically-elongated contacts in ohmic contact with interconnect lines contained within one or more redistribution layers built over the frontside of a semiconductor die. A molded radiofrequency (RF) separation or stand-off layer is formed over the redistribution layers through which the plurality of vertically-elongated contacts extend. An antenna structure is fabricated or otherwise provided over the molded RF stand-off layer and electrically coupled to the semiconductor die through at least one of the plurality of vertically-elongated contacts. | 12-03-2015 |
Patent application number | Description | Published |
20140167262 | SEMICONDUCTOR PACKAGE SIGNAL ROUTING USING CONDUCTIVE VIAS - A mechanism is provided by which signal travel distance within and between semiconductor device packages is reduced and substrate size and complexity can be reduced. This capacity is provided by virtue of a conductive via that intersects a wire bond molded within a package substrate. The via provides a direct electrical connection between an external signal transmitter or receiver and the points connected by the wire bond, and thereby avoiding the need for the signal to transit built up interconnects in the semiconductor device package. Conductive vias can provide connectivity through or to a package substrate, and can be through vias or blind vias. The conductive via is formed by either mechanical or laser drilling, and is filled using standard fill techniques, and is therefore readily incorporated into a package production flow. | 06-19-2014 |
20140231980 | SEMICONDUCTOR GRID ARRAY PACKAGE - A semiconductor grid array package has a first housing member with a cavity that has a cavity floor and cavity walls. A semiconductor die is affixed to the cavity floor. A second housing member is molded to the first housing member and covers an interface surface of the die. Electrically conductive runners are mounted to an external surface of the second housing member. The runners have a wire contacting area and an external connector contacting area. Bond wires are selectively bonded to the external connection pads of the semiconductor die and selectively connected to the wire contacting area of the runners. External electrical connectors are mounted to a designated external connector contacting area. | 08-21-2014 |
20140353816 | METHOD OF FORMING A HIGH THERMAL CONDUCTING SEMICONDUCTOR DEVICE PACKAGE - A semiconductor device package ( | 12-04-2014 |
20150014838 | MICROELECTRONIC PACKAGES HAVING FRONTSIDE THERMAL CONTACTS AND METHODS FOR THE FABRICATION THEREOF - Microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the method includes forming one or more redistribution layers over an encapsulated die having a frontside bond pad area and a frontside passivated non-bond pad area. The redistribution layers are formed to have a frontside opening over the non-bond pad area of the encapsulated die. A primary heat sink body is provided in the frontside opening and thermally coupled to the encapsulated die. A contact array is formed over the redistribution layers and is electrically coupled to a plurality bond pads located on the frontside bond pad area of the encapsulated die. | 01-15-2015 |
20150014855 | MICROELECTRONIC PACKAGES AND METHODS FOR THE FABRICATION THEREOF - Microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the method comprises encapsulating a first semiconductor die having one or more core redistribution layers formed thereover in an outer molded body. The outer molded body has a portion, which circumscribes the core redistribution layer. One or more topside redistribution layers are produced over the core redistribution layer. A contact array is formed over the topside redistribution layer and electrically coupled to the first semiconductor die encapsulated in the outer molded body through the topside redistribution layers and the core redistribution layers. | 01-15-2015 |
20150076700 | SYSTEM-IN-PACKAGES CONTAINING EMBEDDED SURFACE MOUNT DEVICES AND METHODS FOR THE FABRICATION THEREOF - Embodiments of a method for fabricating System-in-Packages (SiPs) are provided, as are embodiments of a SiP. In one embodiment, the method includes producing one or more frontside redistribution layers over a molded panel having a backside and an opposing frontside through which a semiconductor die and a first Surface Mount Device (SMD) are exposed. Material is removed from the backside of the molded panel to expose the first SMD therethrough. A contact array is formed over the frontside of the molded panel and electrically coupled to the semiconductor die and to the first SMD through the frontside redistribution layers. The molded panel is singulated to produce a SiP having a molded body in which the semiconductor die and the first SMD are embedded and through which the first SMD extends. | 03-19-2015 |