Patent application number | Description | Published |
20090132534 | Remote replication synchronizing/accessing system and method thereof - A remote replication synchronizing/accessing system and a method thereof applied between a local system and a remote mirroring system of the local system. After the remote mirroring system is created, an initialization synchronous operation of the remote mirroring system is sequentially performed according to a sequence of data blocks in storage of the local system. A small-granulated exclusive lock function is established between the initialization synchronous operation and a data-accessing request operation of the local system. During the initialization synchronous process of the remote mirroring system, it is determined whether a data block position corresponding to the current initialization synchronous operation is the same as that corresponding to the data-accessing request operation or not. Finally, according to a position determination result and the small-granulated exclusive lock function, a data-accessing request is directed processed or processed after finishing the initialization synchronous operation. | 05-21-2009 |
20090138530 | Data management method for logical volume manager - A data management method for logical volume manager (LVM), called LVM includes a first type of physical volume and a second type of physical volume. Access speed of the first type of physical volume is higher than that of the second type of physical volume. Each physical volume has a plurality of physical extents, and a data storage method includes the following steps. Obtaining access frequencies of all the physical extents in statistics; performing a data migration operation, migrating and saving data in the physical extents satisfying an access frequency threshold value in the second type of physical volume to the physical extents without any data in the first type of physical volume; and rewriting a corresponding physical extent number for the migrated data. | 05-28-2009 |
20090187719 | DATA BACKUP METHOD FOR LOGICAL VOLUME MANAGER - A data backup method for logical volume manager (LVM) is used for backup the original data in the LV when adding newly data into a logical volume of the LVM. Before adding a snapshot volume, a new storage space is created. The LVM writes the data to be altered in the logical volume into the new storage space. The LVM then renames the logical volume to the snapshot volume, and names the new storage space to the logical volume. According to the method, reading and writing times of the physical disk can be reduced, so as to quicken backup efficiency. | 07-23-2009 |
20090327640 | METHOD FOR EXPANDING LOGICAL VOLUME STORAGE SPACE - A method for expanding a logical volume (LV) storage space includes creating an LV by using an LV manager, and allocating a storage space for the LV according to a certain proportion; reserving a continuous expanding space behind the allocated storage space; determining in real time whether the LV storage space needs to be expanded or not during a data writing process till the data has been completely written; if the LV storage space needs to be expanded, obtaining a size of a new expanding space required to be reserved by calculating an increment coefficient of space expansion according to a using situation of the previously reserved expanding space, thereby further reserving a continuous expanding space within a space scope managed by the LV manager; and if the LV storage space does not need to be expanded, directly writing the data. | 12-31-2009 |
20100250879 | DATA MANIPULATION METHOD OF LOGICAL VOLUME MANAGER - A data manipulation method of a logical volume manager is applicable to data management of dependent snapshot volumes (SVs) of a logical volume manager. The data management method includes the following steps generating a plurality of SVs, defining the SV generated at first as a first SV, defining the SV generated at last as a last SV, and defining the rest SVs as middle SVs; selecting a middle SV; combining content stored in the selected middle SV into a neighboring SV; according to the combined SV, combining meta-data of the selected middle SV into meta-data of the middle SV; deleting the selected middle SV. The logical volume manager does not need copy the data again, thereby saving access time in data management. | 09-30-2010 |
20100251013 | METHOD FOR PROCESSING BAD BLOCK IN REDUNDANT ARRAY OF INDEPENDENT DISKS - A method for processing a bad block in a redundant array of independent disks (RAID) is presented, which is characterized by a software RAID constructed by a scale computer interface disk, and adapted to backup data in a bad block in the software RAID. The method includes invoking an access error program to intercept an access instruction for a data block in the software RAID when the data block is a bad block; searching a disk number and a logical block address of the data block in the software RAID according to the access instruction; selecting the scale computer interface disk; and mapping data stored in the data block, the disk number, and the logical block address to a reserved local memory of the scale computer interface disk. Through the above steps, the data in the bad block can be mapped to a normal block, thus maintaining the data integrity. | 09-30-2010 |
Patent application number | Description | Published |
20080266828 | LEAD FRAME WITH SOLDER FLOW CONTROL - A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding. | 10-30-2008 |
20090236713 | SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF PACKAGING SEMICONDUCTOR INTEGRATED CIRCUIT - In a method of packaging a semiconductor IC, a tape is attached to a back surface of a lead frame array, and the lead frame array is held between an upper mold chase and a lower mold chase of a mold, with the back surface of the lead frame array upward. The upper and lower mold chases form an upper cavity and a lower cavity with respect to the lead frame array respectively. A mold compound is injected into the upper and lower cavities respectively. With respect to clearances between leads, between die pads and/or between the leads and the die pads, the mold compound injected into the upper cavity covers the portion of the tape over the clearances before the mold compound injected into the lower cavity fills the clearances, so that the tape is depressed. After curing the mold compound, removing the mold and de-taping, the mold compound filled in the clearances is recessed inward from the back surface, which increases the solderability in the subsequent surface mount process and decreases the possibility of the occurrence of lead short-circuits. | 09-24-2009 |
20100283135 | LEAD FRAME FOR SEMICONDUCTOR DEVICE - A lead frame including a lead frame structure having a die support area and a plurality of electrical contact areas has shallow recesses formed on a surface of the lead frame structure. | 11-11-2010 |
20110189823 | METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH IMPROVED STANDOFF - A no-lead type semiconductor package is formed by attaching a die to a top surface of a flag of a lead frame and then taping a bottom surface of the flag and leads of the lead frame. Die bonding pads are connected to the leads with wires and then the assembly is put in a mold chase and encapsulated with a plastic material. The mold chase has protrusions between the flag and the leads of a lead frame, and between the leads themselves, which causes indentations to be formed between the leads and between the flag and the leads. The method is particularly useful for making quad flat no lead (QFN) devices and power-QFN type devices. | 08-04-2011 |
20110193237 | METHOD FOR MAKING SEMICONDUCTOR PACKAGE - A method for assembling a semiconductor package includes a rapid cooling step after post mold curing of an encapsulation material. The rapid cooling step includes blowing chilled, compressed air over the package for about two minutes. The rapid cooling step does not require any clamping pressure be simultaneously applied to the package. The rapid cooling step reduces a temperature of the encapsulation material from a curing temperature to the cooled temperature within a maximum period of less than five minutes. By using rapid cooling, as opposed to cooling the package under a clamping pressure with ambient air, package warpage due to CTE mismatches is prevented. | 08-11-2011 |
20110248393 | LEAD FRAME FOR SEMICONDUCTOR DEVICE - A lead frame for reducing detrimental effects of burr formation includes a lead frame that has leads where a portion of a top surface is removed from a first lead and a portion of a bottom surface is removed from a second lead adjacent to the first lead to reduce spacing between leads while reducing the detrimental effects of burr formation, such as shorting and the like, caused during singulation of a semiconductor device manufactured with the lead frame. | 10-13-2011 |
20110263077 | METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES INCLUDING SAW SINGULATION - A method of assembling semiconductor devices for surface mounting includes forming an array of lead frames in which supporting frame structures of adjacent lead frames include an intermediate common bar connecting on both its sides with sets of leads of the respective adjacent lead frames. The semiconductor devices are singulated by sawing through the leads on each side of the common bars without sawing the common bars longitudinally. The material sawn off from the common bars in a first direction is removed by washing it away before sawing off the intermediate common bars that run in an orthogonal direction. The supporting frame structures include bars surrounding the array and singulation includes sawing beside the surrounding bars to saw them off before sawing off the intermediate common bars. | 10-27-2011 |
20120056311 | LEADFRAME FOR SEMICONDUCTOR DEVICE - A lead frame for a semiconductor device has a die pad with a first major surface for receiving an semiconductor die and a connection bar that encircles the die pad. First lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the first lead fingers lie in a first plane. Second lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the second lead fingers lie in a second plane that is parallel and spaced from the first plane. An isolation frame is disposed between the proximal ends of the first and second lead fingers. The isolation frame separates but supports the proximal ends of the first and second lead fingers. | 03-08-2012 |
20120139067 | PRESSURE SENSOR AND METHOD OF PACKAGING SAME - A method of packaging a pressure sensor die that does not use pre-molded lead frames. Instead a lead frame array is attached to a tape and a non-conductive material is deposited on the lead frames. The non-conductive material is cured and the tape is removed. Pressure sensor dies then are attached to respective die pads of the lead frames and electrically connected to lead frame leads with bond wires. A gel is dispensed onto a top surface of the pressure sensor dies and then a lid is attached to each of the lead frames to cover the pressure sensor dies. The lead frames are singulated to form individual pressure sensor packages. | 06-07-2012 |
20120168884 | PRESSURE SENSOR AND METHOD OF PACKAGING SAME - A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant. | 07-05-2012 |
20120211846 | MRAM DEVICE AND METHOD OF ASSEMBLING SAME - A method of assembling a magnetoresistive random access memory (MRAM) device includes providing a substrate having an opening. A tape is applied to a surface of the substrate and a first magnetic shield is placed onto the tape and within the substrate opening. An adhesive is applied between the first magnetic shield and the substrate to attach the first magnetic shield to the substrate. An MRAM die is attached to the first magnetic shield and bond pads of the MRAM die are connected to pads on the substrate with wires. A second magnetic shield is attached to a top surface of the MRAM die. An encapsulating material is dispensed onto the substrate, the MRAM die, the second magnetic shield and part of the first magnetic shield, cured, and then the tape is removed. Solder balls then may be attached to the substrate. | 08-23-2012 |
20120238058 | METHOD OF PACKAGING SEMICONDUCTOR DIE WITH CAP ELEMENT - A method of assembling semiconductor devices includes placing an array of semiconductor dies on a die support. A cap array structure is provided that has a corresponding array of caps supported by a cap frame structure. The cap array structure and the array of semiconductor dies on the die support are aligned, with the caps extending over corresponding semiconductor dies, in a mold chase. The array of semiconductor dies and the array of caps are encapsulated with a molding compound in the mold chase. The encapsulated units of the semiconductor dies with the corresponding caps are removed from the mold chase and singulated. Singulating the encapsulated units may include removing the cap frame structure from the encapsulated units. | 09-20-2012 |
20120264258 | METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBSTRATE AND HEAT SINK - Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated. | 10-18-2012 |
20130049183 | POWER DEVICE AND METHOD OF PACKAGING SAME - A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers. | 02-28-2013 |
20130196473 | MOLD CHASE - A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows. | 08-01-2013 |
20130249071 | SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME - A method of assembling a semiconductor device includes providing a lead frame having a die pad and a fame member with lead fingers that surround the die pad. The lead fingers have distal ends connected to the frame member and proximal ends near the die pad. A die is attached to the die pad and die connection pads are electrically connected to the proximal ends of the lead fingers with bond wires. The die, bond wires, and part of the lead fingers are encapsulated with an encapsulant. The encapsulating process includes separating the lead fingers into first and second sets of lead fingers. The proximal ends of the first set lie in a first plane and the proximal ends of the second set lie in a second plane that is spaced and maintained from the first plane solely by the encapsulation material. | 09-26-2013 |
20140127862 | METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBSTRATE AND HEAT SINK - Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated. | 05-08-2014 |
20140191383 | POWER DEVICE AND METHOD OF PACKAGING SAME - A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers. | 07-10-2014 |
20140206124 | PRESSURE SENSOR AND METHOD OF PACKAGING SAME - A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant. | 07-24-2014 |
20140284806 | SEMICONDUCTOR DEVICE DIE ATTACHMENT - A semiconductor device has first and semiconductor dies having active faces presenting electrical contact elements and back faces attached to first and second bonding areas side by side on an electrically conductive die support. A layer of electrically insulating material is applied to the first bonding area of the die support. A layer of electrically insulating adhesive bonding material attaches the back face of the first semiconductor die to the first bonding area of the die support through the layer of electrically insulating material. A layer of electrically conductive adhesive bonding material attaches the back face of the second semiconductor die to the second bonding area of the die support. | 09-25-2014 |
20140361421 | LEAD FRAME BASED SEMICONDUCTOR DIE PACKAGE - A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with an encapsulant with ends of the lead fingers projecting out from the encapsulant. One set of the lead fingers are bent and project down and another set of the lead fingers are bent and project inwardly, and under a bottom surface of the encapsulant. The encapsulant includes a slot or groove for receiving the lead fingers of the second set. | 12-11-2014 |
20150028468 | NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME - A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling. | 01-29-2015 |
20150097278 | SURFACE MOUNT SEMICONDUCTOR DEVICE WITH ADDITIONAL BOTTOM FACE CONTACTS - Assembling a surface mount semiconductor device includes providing a lead frame structure with peripheral leads and additional bottom face contacts integral with frame members. Outer portions of the bottom face contact members are interposed between inner portions of adjacent pairs of the peripheral leads. A package body is formed by encapsulating the lead frame structure in which the frame members are positioned outside a side edge surface. The peripheral leads and the bottom face contact members project between the side edge surface of the package body and the frame members. The frame members are cut and the peripheral leads and the bottom face contact members are separated and electrically isolated from each other. | 04-09-2015 |
20150206831 | SEMICONDUCTOR DEVICE WITH WEBBING BETWEEN LEADS - A quad flat package integrated circuit (IC) device has alternating inner and outer leads that protrude from a package body. The inner leads are j-shaped leads and the outer leads are gull-wing shaped leads. The package body is formed such that it includes plastic lead webbings between adjacent leads, which help prevent metal particles from getting lodged between the leads and causing electrical shorts. The webbings are made of the same molding compound as the package body and are formed together with the package body. | 07-23-2015 |
20150294924 | COMBINED QFN AND QFP SEMICONDUCTOR PACKAGE - A semiconductor package includes a first lead frame type having a first type of package leads and a pre-molded portion, and a second lead frame type having a second type of package leads that surround a die pad and are supported by the pre-molded portion. An integrated circuit is attached to the die pad and electrically connected to the first and second types of leads with bond wires. A mold compound, which forms a mold cap, covers the first and second lead frame types, the integrated circuit and the bond wires. The first lead frame type may be a QFP type and the second lead frame type may be a QFN type. | 10-15-2015 |
20150294929 | SEMICONDUCTOR DIE PACKAGE AND METHOD OF ASSEMBLING SAME - A semiconductor die package is assembled from a lead frame having lead fingers with a bonding end adjacent a die flag, and an elongate region extending away from the die flag. A semiconductor die is mounted on the die flag and electrodes of the semiconductor die are electrically connected to the bonding ends with bond wires. Each elongate region is bent into an external connector lead with mounting feet. The elongate region of each of the lead fingers protrudes from a housing formed from a mold compound. The mold compound extends from the housing to provide insulated support fingers molded to the external connector leads. | 10-15-2015 |
Patent application number | Description | Published |
20100236526 | Common rail electronic control injector - The present invention relates to a common rail electronic control injector, which belongs to the electronic control fuel injection system technology. The injector includes an oil inlet joint, an oil inlet located at outside the oil inlet joint, an electromagnet device, a nozzle body, a needle valve, a valve seat and spray holes, wherein the electromagnet device includes a static core, an armature and a coil, wherein a working gap between the static core and the armature is H, the armature is moveably connected with the needle valve along an axial direction. The present invention further includes a compression spring applying a force to the needle valve, a force mechanism applying a force to the armature, and a block mechanism providing an axial anti-thrust while the armature is reset. The present invention has advantages of lower manufacturing cost, better reliability and smaller driving energy. | 09-23-2010 |
20100236527 | Electronic control common rail DME injection system - A common rail electronic control injection system which uses a DME or a low-viscosity fuel similar with DME to inject into a combustion engine, includes a fuel container, a common rail tube, a high-pressure tube, an electronic control injector, an electronic control unit, a high-pressure pump, a working medium case, a reversing component, and a pressure convertor, wherein the pressure convertor includes at least two working components, each working component is divided into a fuel chamber and a working medium chamber by an dividing element, the dividing element can freely deform or move between the fuel chamber and the working medium chamber by pressure effect. The invention avoids the sealing and abrasion problem in the plunger matching portions which is caused by the low-viscosity fuel so as to greatly improve the lifetime and reliability of system. | 09-23-2010 |
20150377197 | DUAL-CHANNEL PIEZOELECTRIC INJECTOR - The invention discloses a dual-channel piezoelectric injector, including a dual-channel injector body, its bottom in turn is connected with an upper intermediate, a lower intermediate and a dual-channel needle valve body. At the top of the dual-channel injector body there are two tubing interfaces, and each tubing interface has a tubing fuel duct. There are two laminated piezoelectric actuators and two spray fuel ducts connected to two tubing fuel ducts respectively inside the dual-channel injector body. The upper intermediate and lower intermediate connected with each other to form the middle connection body. From top to bottom of the middle connection body, there is an external control fuel duct, an external spray fuel duct, an internal control fuel duct and internal fuel spray duct. Inside the double-channel needle valve body, there is the sleeve structure of the needle valve hole, at the bottom of double-channel needle valve body there is an internal fuel spray nozzle connecting the internal casing hole which is outside the body, and an external fuel spray nozzle connecting to the external casing hole which is outside the body. Through the two laminated type piezoelectric actuators, control is realized for the pressure difference between the fuel pressure of the fuel control cavity and the fuel pressure of the inner pressure chamber or outer pressure chamber. So it is also realized to control the open or close state of the internal or external needle valve, in turn to control the injection action of the internal fuel spray nozzle or external fuel spray nozzle. The present invention has a simple structure and a low manufacturing cost. | 12-31-2015 |