Patent application number | Description | Published |
20090122105 | Wiping unit and inkjet printer - Provided is a wiping unit capable of reliably removing contamination of ink or the like adhering to a wiping blade after being wiped in spite of a simple configuration. Provided is a wiping unit having a wiping blade that performs wiping cleaning with respect to a recording head, including a first cleaning portion that cleans the wiping blade after performing the wiping cleaning, a second cleaning portion that performs secondary cleaning after passing through the first cleaning portion, and a blade transport portion that allows the wiping blade to move between the recording head, and the first cleaning portion and the second cleaning portion, in which the first cleaning portion and the second cleaning portion respectively include a cleaning tank which is filled with a detergent and in which the wiping blade is soaked in the detergent, and a blade wiping portion having a blade wiping member containing the detergent, which wipes a surface of the wiping blade having passed through the cleaning tank. | 05-14-2009 |
20130076840 | SOLVENT FOR INK, METHOD FOR PRODUCING SOLVENT FOR INK, INK FOR INKJET RECORDING, METHOD FOR PRODUCING INK FOR INKJET RECORDING, INK CARTRIDGE, AND METHOD FOR PRODUCING INK CARTRIDGE - An ink vehicle having a vinyl chloride-vinyl acetate copolymer resin produced by suspension polymerization. In the production of the ink vehicle, the vinyl chloride-vinyl acetate copolymer resin is partially dissolved in a solvent in a state in which an undissolved gel-like component of the vinyl chloride-vinyl acetate copolymer resin is present in the resin. An external force is applied to the solvent containing the gel-like component to dissolve the gel-like component in the solvent. | 03-28-2013 |
Patent application number | Description | Published |
20090050968 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device including an n-type metal oxide semiconductor transistor for electrostatic discharge protection including drain regions connected with a first metal interconnect and source regions connected with another first metal interconnect alternately placed with each other, and gate electrodes each placed between each of the drain regions and each of the source regions, in which: at least one of the first metal interconnect and the other first metal interconnect being connected to a plurality of layers of metal interconnects other than the first metal interconnect; and the source regions include via-holes for electrically connecting the other first metal interconnect and the plurality of layers of metal interconnects other than the first metal interconnect, a greater number of the via-holes is formed as a distance of an interconnect connected to the NMOS transistor for ESD protection becomes larger. | 02-26-2009 |
20090121223 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device, in which: patterns for detecting displacement at probing are formed of a plurality of minute conductors formed below a protective film; each of the plurality of minute conductors formed below the protective film is electrically insulated and formed to be smaller than a bottom surface of a tip of a probing needle used for carrying out an electrical measurement of IC chips; and the patterns for detecting displacement at probing are provided in a pair for each of the IC chips. | 05-14-2009 |
20090152633 | Semiconductor device - In a semiconductor device including, between an external connection terminal and an internal circuit region, an NMOS transistor for ESD protection having a gate potential fixed to a ground potential, the external connection terminal is formed above a drain region of the NMOS transistor for ESD protection, and the drain region is surrounded by a source region through a channel region. Further, the drain region has a shape with rounded corners in plan view. | 06-18-2009 |
20100213549 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device including an n-type metal oxide semiconductor transistor for electrostatic discharge protection including drain regions and source regions placed alternately with each other, and gate electrodes each placed between each of the drain regions and each of the source regions, in which: the first metal interconnects formed on the source regions are electrically connected to the second metal interconnect through constant size via-holes, and a ratio between the numbers of the via-holes arranged above each of the source regions is controlled to be less than four according to a distance from the ground potential supply line. | 08-26-2010 |
20110233677 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device having an ESD protection MOS transistor including a plurality of transistors combined together, in which a plurality of drain regions and a plurality of source regions disposed alternately and a gate electrode disposed between each pair of adjacent regions constituted of one of the plurality of drain regions and one of the plurality of source regions, in which a distance between a salicide metal region, which is formed on each of the plurality of drain regions, and the gate electrode is determined according to contact holes in the plurality of drain regions and a distance of the contact holes from substrate contacts. | 09-29-2011 |
20120199977 | SEMICONDUCTOR DEVICE - To prevent generation of cracks in an insulating film provided under a bonding pad, a semiconductor device includes a three-layered bonding pad, and the three-layered bonding pad includes a first metal film, a second metal film, and a third metal film, in which the second metal film has a Young's modulus higher than a Young's modulus of the first metal film and a Young's modulus of the third metal film. | 08-09-2012 |
Patent application number | Description | Published |
20080315088 | COMPOSITE CHARGED-PARTICLE BEAM SYSTEM - There is provided a method of arranging, as a composite charged-particle beam system, a gas ion beam apparatus, an FIB and an SEM in order to efficiently prepare a TEM sample. The composite charged-particle beam system includes an FIB lens-barrel | 12-25-2008 |
20090206254 | Composite charged particle beam apparatus, method of processing a sample and method of preparing a sample for a transmission electron microscope using the same - An apparatus is provided that precisely conduct ion beam etching to a sample having the properties of which easily change by electron beam irradiation with no loss of ease of operation and throughput. An apparatus includes an ion beam lens barrel and an electron beam lens barrel, which can observe or measure the conditions of a sample with an electron beam in the process of etching with an ion beam, wherein first, an observation image is obtained that includes the entire process area formed by secondary signals generated by an electron beam, secondly, an irradiation permit area and an irradiation inhibit area are defined in the observation image, and thirdly, electron beam irradiation is restricted only to the irradiation permit area. | 08-20-2009 |
20110226948 | Sample processing and observing method - There is provided a sample processing and observing method including irradiating a focused ion beam to a sample to form an observed surface, irradiating an electron beam to the observed surface to form an observed image, removing the surface opposite to the observed surface of the sample, forming a lamella including the observed surface and obtaining a transmission observed image for the lamella. | 09-22-2011 |
Patent application number | Description | Published |
20130153880 | SURFACE SEALANT FOR OPTICAL SEMICONDUCTOR, METHOD FOR MANUFACTURING ORGANIC EL DEVICE, ORGANIC EL DEVICE AND ORGANIC EL DISPLAY PANEL USING THE SAME - To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N—H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm. | 06-20-2013 |
20140131691 | POLYMERIZABLE EPOXY COMPOSITION AND ORGANIC EL DEVICE - The purpose of the present invention is to provide a polymerizable resin composition with which the cured product refractive index is high and the viscosity under a high shear stress is a specific viscosity or lower. Provided is an polymerizable epoxy composition comprising (A1) an S-containing epoxy resin represented by a general formula, (A2) an epoxy compound having a softening point of 70° C. or lower, (B) a curing promoter, and (C) a thiol compound having two or more thiol groups per molecule, wherein viscosity at 25° C. and 60 rpm as determined using a B viscometer is between 100 and 15,000 mPa·s. | 05-15-2014 |
20140367670 | SURFACE SEALING AGENT FOR ORGANIC EL ELEMENT, ORGANIC EL DEVICE USING SAME, AND MANUFACTURING METHOD FOR SAME - The present invention addresses the issue of providing a surface sealing agent which can be cured at low temperatures and which exhibits excellent storage stability. In order to resolve this issue, provided is a surface sealing agent for an organic EL element, the surface sealing agent including an epoxy resin (A) having at least two epoxy groups in a molecule, and a curing accelerator (B) which is a salt of a specific quaternary ammonium ion, wherein 0.1-10 parts by weight of the curing accelerator (B) is contained relative to 100 parts by weight of the surface sealing agent. | 12-18-2014 |
20150034928 | OPTICAL-DEVICE SURFACE-SEALING COMPOSITION, OPTICAL-DEVICE SURFACE-SEALING SHEET, DISPLAY, AND DISPLAY MANUFACTURING METHOD - The purpose of the present invention is to provide the following: an optical-device surface-sealing composition that makes it possible to fabricate an optical-device-using display with a low amount of warpage even if there is a large difference between the coefficients of linear expansion of substrates used in said display; a display with a low amount of warpage; and a manufacturing method therefor. The storage modulus of elasticity (G′(80)) of this optical-device surface-sealing composition, measured at 80° C. after said composition is heated from 40° C. to 80° C. at 5° C./min and then held at 80° C. for 30 minutes, is between 1.0×10 | 02-05-2015 |