Patent application number | Description | Published |
20090238974 | INK JET INK, INK JET RECORDING METHOD, INK CARTRIDGE, RECORDING UNIT, AND INK JET RECORDING APPARATUS - An ink jet ink is provided which can retain good stability and shows superior intermittent ejection stability not only under a low-temperature, low-humidity environment but also a high-temperature, low-humidity environment even when the evaporation of water in the ink progresses. The ink jet ink includes a coloring material and water-soluble organic solvents, wherein the content of the coloring material is less than 7.0 mass %, the water-soluble organic solvents include glycerin and a branched alkanediol having hydroxyl groups at both terminals of its main chain, the content C of glycerin is 6.0 to 12.0 mass %, the content A of the branched alkanediol is 4.0 to 11.0 mass %, and the content A of the branched alkanediol and the total content B of the water-soluble organic solvents satisfy the relationship of 0.30≦A/B≦0.50. | 09-24-2009 |
20090238975 | INK JET INK, INK JET RECORDING METHOD, INK CARTRIDGE, RECORDING UNIT AND INK JET RECORDING APPARATUS - An ink jet ink providing an image having excellent lightfastness and having sticking resistance and intermittent ejection stability. The ink jet ink is characterized by containing at least a compound represented by the following general formula (I) and a compound represented by the following general formula (II). | 09-24-2009 |
20090238976 | INK JET INK, INK JET RECORDING METHOD, INK CARTRIDGE, RECORDING UNIT, AND INK JET RECORDING APPARATUS - The present invention provides an ink jet ink, which gives a superior lightfastness to an ink image, has a superior sticking resistance and intermittent ejection stability, and gives a preferable color tone to the image. The ink includes an azo-based dye represented by formula (I) and a water-soluble organic solvent represented by bis(2-hydroxyethyl)sulfone represented by formula (II). | 09-24-2009 |
20090274840 | INK JET INK, INK SET, INK JET RECORDING METHOD, INK CARTRIDGE, RECORDING UNIT AND INK JET RECORDING APPARATUS - An ink to be applied to a recording head having a common liquid chamber, pressure chambers developing pressure applied to the liquid, individual channels through which the liquid is introduced into the pressure chambers from the common liquid chamber, and a group of nozzles which communicate with the pressure chambers and eject the liquid, where first nozzles having short individual channels and second nozzles having long ones are alternately arranged at arrangement intervals of less than 30 μm along one side or sides of the common liquid chamber, contains an aqueous medium, a surfactant and a coloring material. The aqueous medium consists of water and a water-soluble organic compound containing at least one alkanediol and has a surface tension of from 40 mN/m or more to less than 60 mN/m in an environment of temperature 25° C. and humidity 50%. | 11-05-2009 |
20130300802 | INK JET INK, INK SET, INK JET RECORDING METHOD, INK CARTRIDGE, RECORDING UNIT AND INK JET RECORDING APPRATUS - An ink to be applied to a recording head having a common liquid chamber, pressure chambers developing pressure applied to the liquid, individual channels through which the liquid is introduced into the pressure chambers from the common liquid chamber, and a group of nozzles which communicate with the pressure chambers and eject the liquid, where first nozzles having short individual channels and second nozzles having long ones are alternately arranged at arrangement intervals of less than 30 μm along one side or sides of the common liquid chamber, contains an aqueous medium, a surfactant and a coloring material. The aqueous medium consists of water and a water-soluble organic compound containing at least one alkanediol and has a surface tension of from 40 mN/m or more to less than 60 mN/m in an environment of temperature 25° C. and humidity 50%. | 11-14-2013 |
Patent application number | Description | Published |
20080280042 | INK SET, INK JET RECORDING METHOD, INK CARTRIDGE, RECORDING UNIT, AND INK JET RECORDING APPARATUS - In an ink set having a plurality of inks, the ink set has at least a pigment ink and a dye ink. The pigment ink contains at least water, a surfactant, a self-dispersion pigment, and a poor medium for self-dispersion pigment and/or a salt; a dynamic surface tension of the pigment ink at a lifetime of 50 milliseconds is higher than 47 mN/m. The dye ink contains at least water, a surfactant and a dye. An ink set is provided which can obtain images having a high image density and a superior bleeding resistance without regard to the types of recording mediums. | 11-13-2008 |
20080280043 | INK SET, INK JET RECORDING METHOD, INK CARTRIDGE, RECORDING UNIT, INK JET RECORDING METHOD, AND AQUEOUS INK - An ink set is provided which can suppress bleeding irrespective of the type of recording medium. The ink set includes a plurality of aqueous inks each containing a dye, and has at least a first aqueous ink containing a dye, wherein the difference between the dynamic surface tension of the first aqueous ink at a lifetime of 50 milliseconds and the dynamic surface tension of the first aqueous ink at a lifetime of 500 milliseconds is 7 mN/m or more; and, between the first aqueous ink and at least one type of aqueous ink except the first aqueous ink included in the ink set, dynamic surface tension γ | 11-13-2008 |
20090214789 | MAILING INK, AND INK TANK FOR MAILING, INK JET RECORDING METHOD FOR MAILING AND INK JET RECORDING APPARATUS FOR MAILING USING THE SAME - A mailing ink, an ink tank for mailing, an ink jet recording method for mailing and an ink jet recording apparatus for mailing that can reconcile preferable tint and visibility as indicia with readability by a 2-D bar code reader. The ink is a mailing ink used in ink jet recording. In the mailing ink, the ink tank, the ink jet recording method, and the ink jet recording apparatus, the ink provides an ‘a*’ of from −10 to 15 and a ‘b*’ of from −50 to −15 according to the CIE L*a*b* color system in a printed portion obtained by applying the ink to a recording medium so as to give an application amount of ink of 4.5 mg per square inch, and provides an integrated value of reflection spectrum of 90 or lower in a wavelength region of from 380 nm to 730 nm in the printed portion. | 08-27-2009 |
20130335490 | INK, INK CARTRIDGE AND INK JET RECORDING METHOD - Provided is an ink capable of recording an image that is excellent in ozone resistance, hardly causes blurring or color change even in a high-humidity environment, and is excellent in humidity resistance. The ink includes a coloring material and a lithium ion. The coloring material includes a compound represented by the following general formula (I) and a content of the lithium ion in the ink is 3.5 times or more in terms of molar ratio with respect to a content of the compound represented by the general formula (I). | 12-19-2013 |
Patent application number | Description | Published |
20080314993 | RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of manufacturing RFID tag - A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line. | 12-25-2008 |
20110074020 | SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE - A method for mounting a semiconductor device by mounting a semiconductor chip on a board by flip chip bonding, comprising: contacting an Au bump of the semiconductor chip with a Sn—Bi solder; and heating the Sn—Bi solder at a temperature which is not lower than the melting point thereof and which is not higher than 180° C. for 30 minutes or more. | 03-31-2011 |
20120043005 | ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD - A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material. | 02-23-2012 |
20120211549 | ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature. | 08-23-2012 |
20120248616 | ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND SOLDERING PASTE - To provide an electronic component, containing: a wiring board containing electrode pads; a component including a plurality of electrodes, the component being mounted on the wiring board; a sealing resin covering the component; and a plurality of terminals configured to connect a wiring provided within the wiring board to an external substrate, wherein the plurality of electrodes and the electrode pads are connected with solder, and wherein a first resin layer and a second resin layer are provided between the solder and the sealing resin in this order from the side of the solder, where the first resin layer has a first Young's modulus and the second resin layer has a second Young's modulus larger than the first Young's modulus. | 10-04-2012 |
Patent application number | Description | Published |
20130087605 | CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD - A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle. | 04-11-2013 |
20130088839 | BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE ASSEMBLY - There is provided a method of manufacturing a board module which includes attaching a metal particle to a surface of a solder bump, which includes at least a tin component and is mounted on an electrode provided on a first surface of an electric part or a printed circuit board, the metal particle having a higher specific gravity and a higher melting point than the solder bump, making the first surface face up, heating the solder bump to a temperature equal to or higher than the melting point of the solder bump so that the metal particle precipitates in the solder bump, and forming an inter-metal compound layer, which has a higher melting point than a melting point of the solder bump, at an interface between the solder bump and the electrode by using the metal particle, which has precipitated, and the tin component of the solder bump. | 04-11-2013 |
20130140069 | CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE - A conductive bonding material includes: copper particles coated with either gallium or gallium alloy; and either tin particles or tin alloy particles. An electronic component includes: a wiring board having electrode pads; a component mounted on the wiring board and having a plurality of electrodes; a sealing resin covering the component; and a plurality of terminals coupled to a wiring line in the wiring board to an external substrate, wherein the plurality of electrodes being coupled to the electrode pads through a conductive bonding material containing copper particles coated with either gallium or gallium alloy particles and either tin particles or tin alloy particles. | 06-06-2013 |
20130259421 | METHOD OF MANUFACTURING OPTICAL WAVEGUIDE DEVICE AND OPTICAL WAVEGUIDE DEVICE - A method of manufacturing an optical waveguide device, the method includes: inserting an inclined surface of a mold which is inclined relative to a surface of a substrate including an optical waveguide member into a through hole in which the optical waveguide member is exposed from one surface side of the substrate; locating an optical component above an opening of the through hole on the other surface side of the substrate; injecting an underfill material into between the optical component and the other surface and into the through hole; and curing the underfill material to form a mirror surface. | 10-03-2013 |
20130313309 | CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - A conductive bonding material includes: a solder component including a metal foamed body of a first metal having at least one pore, the pore absorbs melted first metal when the metal foamed body is heated at a temperature higher than the melting point of the first metal, and a second metal having a melting point lower than the melting point of the first metal. | 11-28-2013 |
20140086525 | OPTICAL UNIT AND METHOD OF MANUFACTURING THE SAME - An optical unit in which an optical part having an optical element is mounted on a base having an optical waveguide includes a hydrophobic first area formed in a region including an optical axis of the optical part, a hydrophobic second area formed in a region facing the first area on a surface of the base, and a hydrophilic filler which fills peripheries of the first area and the second area between the optical part and the base. | 03-27-2014 |
20140285989 | METHOD OF MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE - A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material. | 09-25-2014 |
20140290850 | BONDING APPARATUS AND BONDING METHOD - A bonding apparatus has a light source, a stage, a component holder formed of a light transparent material, a controller, and a driver configured to drive the stage and the component holder under the control of the controller. The component holder includes an incident surface on which light outputted from the light source is made incident, a first reflection surface which is a surface opposite to the incident surface and reflects the incident light from the incident surface, a second reflection surface which reflects the light reflected by the first reflection surface, and an exit surface from which the light reflected by the second reflection surface exits. The bonding apparatus bonds the first component and the second component together with the photo-curing adhesive while holding the second component on the side of the exit surface of the component holder. | 10-02-2014 |
Patent application number | Description | Published |
20090145653 | Substrate pad structure - A substrate pad structure for connecting a lead connecting portion of an electronic device to a substrate is disclosed. The substrate pad structure includes a first pad portion and a second pad portion that are arranged on the substrate at corresponding positions of two end regions of the lead connecting portion, which has a continuous oblong shape. A space portion is provided between the first pad portion and the second pad portion, and the lead connecting portion includes a non-connected region located at a corresponding position of the space portion. | 06-11-2009 |
20100015856 | BALANCED TRANSMISSION CONNECTOR - A balanced transmission connector includes an insulation block including a contact connecting part for connecting with another connector at a front part of the insulation block and connecting with a substrate at a bottom part of the insulation block, a first signal contact including an upper contact portion projecting from the front of the insulation block and a first lead portion projecting from the rear of the insulation block and extending toward the substrate, a second signal contact including a lower contact portion projecting from the front of the insulation block and a second lead portion projecting from the rear of the insulation block and extending toward the substrate, retaining portions formed on a rear part of the insulation block retaining the first and second lead portions from both sides. The first and second lead portions extend substantially in parallel while maintaining a shortest distance with respect to the substrate. | 01-21-2010 |
20100112832 | CONNECTOR - A connector includes a housing and a contact. The contact includes a first part including a first terminal part and a first connection part; a second part including a second terminal part and a second connection part, and a third part including an elastic part having a first end and a second end connected to the first part and the second part, respectively. The first connection part and the second connection part face each other across a gap. The second terminal part is configured to come into press contact with an electrode in response to fixation of the housing to a board. The third part is configured to elastically deform in response to attachment of a plug to the housing and/or the fixation of the housing to the board, so as to cause the first connection part and the second connection part to come into contact and be electrically connected. | 05-06-2010 |
20100190385 | CONNECTOR DEVICE - A jack connector includes pairs of jack signal contacts and jack ground contacts arranged alternately, and a plug connector includes pairs of plug signal contacts and plug ground contacts arranged alternately. Respective contacts of each pair of jack signal contacts come into contact with respective contacts of each pair of plug signal contacts, and each jack ground contact comes into contact with each plug ground contact. In a first contact structure, each jack ground contact comes into contact with each plug ground contact at a first position, and in a second contact structure each jack ground contact comes into contact with each plug ground contact at a second position apart from the first position along an extending direction of the plug ground contact. | 07-29-2010 |
20120168221 | RELAY BOARD FOR TRANSMISSION CONNECTOR USE - A relay board for relaying plurality of electric wires to a transmission connector, the relay board provided with first and second front ground pads | 07-05-2012 |
20130045634 | CONNECTOR - A connector includes: a housing; and a connector module; the connector module including: a projection portion that projects outside from the housing; a substrate composed of a material with thermal conductivity; and a terminal that is fixed to a lower part of the substrate and contacts on an external substrate. | 02-21-2013 |
Patent application number | Description | Published |
20120193139 | SURFACE MOUNT DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead. | 08-02-2012 |
20140051300 | CONNECTOR AND CONNECTOR UNIT - A connector connectable to another connector includes a connector card including a first surface and a second surface, a cable pad provided on the first surface and configured to be connected to a cable core wire, a contact that is provided on the second surface and corresponds to the cable pad, wherein the contact is positioned across the connector card from the corresponding cable pad and is configured to come into contact with the other connector, and an electrically conductive part provided through the connector card, wherein the conductive part electrically connects the cable pad and the corresponding contact. | 02-20-2014 |
20150313024 | SURFACE MOUNT DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead. | 10-29-2015 |
20160126658 | CONNECTOR AND CONNECTOR UNIT - A connector includes a housing and a signal plug contact provided in the housing. The housing includes a hole that expands from part of the housing in which the signal plug contact is provided. | 05-05-2016 |
Patent application number | Description | Published |
20100051336 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR - A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in connection with the interconnections, when the connecting terminals are formed by the electrolytic plating. The interconnections are electrically isolated from the connecting terminal-forming wirings by process openings formed in the substrate. | 03-04-2010 |
20110014819 | JACK SIDE CONNECTOR AND CONNECTOR SET HAVING THE JACK SIDE CONNECTOR - A jack side connector configured to be connected to a plug side connector, the plug side connector including a plug side signal contact and a plug side ground contact extending from a holding part, the jack side connector includes a jack side signal contact and a jack side ground contact configured to come in contact with the plug side signal contact and the plug side ground contact, respectively, so that electric conduction between the plug side connector and the jack side connector is made when the plug side connector is connected to the jack side connector, wherein the jack side ground contact includes a first contact part and a second contact part, and when the plug side connector is connected to the jack side connector, the electric conduction between the plug side connector and the jack side connector is made by the first contact part and the second contact part. | 01-20-2011 |
20110028033 | COAXIAL CONNECTOR AND CONNECTOR DEVICE - A coaxial connector where a plug having a coaxial structure is connected in a direction substantially parallel with a board, the board being where the coaxial connector is mounted, the coaxial connector includes a signal contact having one end connected to a plug pin and another end bent or curved toward the board; and a ground contact having a substantially cylindrical shaped main body part, the main body part surrounding a part of the signal contact, the ground contact being connected to a plug side ground member by a first connecting part formed at one end of the main body part, the ground contact being connected to the board by a second connecting part formed at another end of the main body part, wherein the second connecting part includes a center member surrounding two or more surfaces of the signal contact, and an arm part extending from a side part of the center member. | 02-03-2011 |
20120320540 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR - A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in connection with the interconnections, when the connecting terminals are formed by the electrolytic plating. The interconnections are electrically isolated from the connecting terminal-forming wirings by process openings formed in the substrate. | 12-20-2012 |
Patent application number | Description | Published |
20090210556 | Time division address management device and time division routing information management device - There is provided an address management device, which includes an address storage unit configured to store an address used for communication for a local network and a global address used for communication for a global network, an address switch judgment unit configured to judge timing for switching between the address for the local network and the global address, and an address switch unit configured to switch between the address for the local network and the global address in accordance with a judgment result of the address switch judgment unit. | 08-20-2009 |
20100060650 | MOVING IMAGE PROCESSING METHOD, MOVING IMAGE PROCESSING PROGRAM, AND MOVING IMAGE PROCESSING DEVICE - A moving image processing method includes: an operation item setting step of setting operation items to be operated on the moving image; a time interval setting step of setting which time interval in a reproducing period of the moving image should be defined as an interval in which the operation items that have been set are executable; a display area setting step of setting display areas for images for operations corresponding to the operation items that have been set; an image combining step of combining the images for operations corresponding to the operation items that have been set with the respective frame images, in accordance with the time interval setting step and the display area setting step; and an associating step of associating, with each combined frame image, information concerning the display areas of the images for operations in the frame image and information concerning the operation items, and storing each combined frame image and the associated information. | 03-11-2010 |
20100118035 | MOVING IMAGE GENERATION METHOD, MOVING IMAGE GENERATION PROGRAM, AND MOVING IMAGE GENERATION DEVICE - A moving image generation method includes: a content designation step of designating a plurality of contents used for a moving image; a content collecting step of collecting each designated content; a content image generation step of generating content images based on the collected contents; a display mode setting step of setting a display mode of each generated content image; and a moving image generation step of generating a moving image where each content image alters with respect to time in accordance with the display mode which has been set. | 05-13-2010 |
20100281403 | BROWSER PROGRAM AND TERMINAL DEVICE - A computer-executable browser program, which generates drawing data for displaying contents on a display in accordance with contents data described in markup language, is provided with plurality of browser modules in which different functions are implemented, and a browser module managing unit that manages the plurality of the browser modules. One of a plurality of the browser modules is a rendering module to carry out rendering contents data for generating drawing data. At least one of a plurality of the browser modules is such a module as exclusively used for substituting for or changing a part of a rendering module or adding a separate function to functions of the rendering module. The browser module managing unit determines to process an element included in the contents data by using any of the exclusive modules in accordance with a predetermined condition so as to provide what makes a rendering module process such a thing that a predetermined change is added to the contents data. | 11-04-2010 |