| Patent application number | Description | Published |
|---|
| 20080310111 | TRANSPIRATION COOLING FOR PASSIVE COOLED ULTRA MOBILE PERSONAL COMPUTER - In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chassis to house the integrated circuit device(s) and the power supply, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device(s) and a water absorbent layer configured to absorb water. Other embodiments are also disclosed and claimed. | 12-18-2008 |
| 20090004317 | HIGH THERMAL CONDUCTIVITY MOLDING COMPOUND FOR FLIP-CHIP PACKAGES - A molding compound for use in an integrated circuit package comprises an epoxy and a thermally conductive filler material. The thermally conductive filler material comprises between 70% and 95% of the molding compound and has a thermal conductivity between 10 W/m-K and 3000 W/m-K. | 01-01-2009 |
| 20090068387 | Composite thermal interface material including aligned nanofiber with low melting temperature binder - A thermal interface material includes a mechanically compliant vertically aligned nanofiber film and a binder material for joining the nanofibers of the film to the surfaces of two substrates. Preferably, the binder material comprises a non-hydrocarbon-based material such as a metallic eutectic with a melting temperature below a nanofiber thermal damage threshold temperature of the film. The film is grown on a substrate which is then bonded to another substrate by the binder material in an adhesion process that may include pressure and heat. Alternatively, the film may be released from the substrate to produce a stand-alone thermal tape which may later be placed between two substrates and bonded. | 03-12-2009 |
| 20090325032 | TRANSPIRATION COOLING AND FUEL CELL FOR ULTRA MOBILE APPLICATIONS - In some embodiments, transpiration cooling and fuel cell for ultra mobile applications is presented. In this regard, an apparatus is introduced having an integrated circuit device, a fuel cell to power the integrated circuit device, wherein the fuel cell produces water as a byproduct, a chassis to house the integrated circuit device and the fuel cell, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device and a water absorbent layer of hydro gel configured to absorb water. Other embodiments are also disclosed and claimed. | 12-31-2009 |
| 20100079955 | Microfins for cooling an ultramobile device - The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device. | 04-01-2010 |
| 20100182744 | THERMAL SPACER FOR STACKED DIE PACKAGE THERMAL MANAGEMENT - In some embodiments, a thermal spacer for stacked die package thermal management is presented. In this regard, an apparatus is introduced having a top integrated circuit die, a bottom integrated circuit die, and a thermal spacer between the top and bottom integrated circuit dice, the thermal spacer comprising a heat conducting material and the thermal spacer overhanging and extending parallel with one outside edge of the bottom integrated circuit die. Other embodiments are also disclosed and claimed. | 07-22-2010 |
