Patent application number | Description | Published |
20080242079 | IN-SITU FORMATION OF CONDUCTIVE FILLING MATERIAL IN THROUGH-SILICON VIA - The formation of electronic assemblies including a die having through vias is described. In one embodiment, a method includes providing Si die including a first surface and a second surface opposite the first surface, and forming a via extending through the Si die from the first surface to the second surface. The via is formed to have a larger width at the first surface than at the second surface, the larger width at the first surface being no less than 100 microns. The method also includes placing a plurality of particles in the via, wherein at least some of the particles comprise a polymer and at least some of the particles comprise a metal. The method also includes heating the die and the particles in the via to cross-link at least part of the polymer in the via, and cooling the die to solidify the polymer and form a electrically conductive composite including the cross-linked polymer and the metal in the via. Other embodiments are described and claimed. | 10-02-2008 |
20090004317 | HIGH THERMAL CONDUCTIVITY MOLDING COMPOUND FOR FLIP-CHIP PACKAGES - A molding compound for use in an integrated circuit package comprises an epoxy and a thermally conductive filler material. The thermally conductive filler material comprises between 70% and 95% of the molding compound and has a thermal conductivity between 10 W/m-K and 3000 W/m-K. | 01-01-2009 |
20090321922 | SELF-HEALING THERMAL INTERFACE MATERIALS FOR SEMICONDUCTOR PACKAGES - A semiconductor package is described. The semiconductor package includes an internal housing and a semiconductor die coupled with the internal housing by a layer of self-healing thermal interface material. | 12-31-2009 |
20100264536 | SELF-HEALING THERMAL INTERFACE MATERIALS FOR SEMICONDUCTOR PACKAGES - A semiconductor package is described. The semiconductor package includes an internal housing and a semiconductor die coupled with the internal housing by a layer of self-healing thermal interface material. | 10-21-2010 |
20110151624 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die - A coating for a microelectronic device comprises a polymer film ( | 06-23-2011 |
20110159256 | Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same - A treatment for a microelectronic device comprises a dicing tape ( | 06-30-2011 |
20120074597 | FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY - Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed. | 03-29-2012 |
20120153494 | FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES - Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die. | 06-21-2012 |
20130017650 | COATING FOR A MICROELECTRONIC DEVICE, TREATMENT COMPRISING SAME,AND METHOD OF MANAGING A THERMAL PROFILE OF A MICROELECTRONIC DIE - A coating for a microelectronic device comprises a polymer film ( | 01-17-2013 |
20140167217 | PACKAGE WITH DIELECTRIC OR ANISOTROPIC CONDUCTIVE (ACF) BUILDUP LAYER - Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having one or more dies connected to an integrated circuit substrate by an interface layer. In one embodiment, the interface layer may include an anisotropic portion configured to conduct electrical signals in the out-of-plane direction between one or more components, such as a die and an integrated circuit substrate. In another embodiment, the interface layer may be a dielectric or electrically insulating layer. In yet another embodiment, the interface layer may include an anisotropic portion that serves as an interconnect between two components, a dielectric or insulating portion, and one or more interconnect structures that are surrounded by the dielectric or insulating portion and serve as interconnects between the same or other components. Other embodiments may be described and/or claimed. | 06-19-2014 |
20140175657 | METHODS TO IMPROVE LASER MARK CONTRAST ON DIE BACKSIDE FILM IN EMBEDDED DIE PACKAGES - Apparatus including a die including a device side with contact points; and a build-up carrier disposed on the device side of the die; and a film disposed on the back side of the die, the film including a markable material including a mark contrast of at least 20 percent. Method including forming a body of a build-up carrier adjacent a device side of a die; and forming a film on a back side of the die, the film including a markable material including a mark contrast of at least 20 percent. Apparatus including a package including a microprocessor disposed in a carrier; a film on the back side of the microprocessor, the film including a markable material including a mark contrast of at least 20 percent; and a printed circuit board coupled to at least a portion of the plurality of conductive posts of the carrier. | 06-26-2014 |
Patent application number | Description | Published |
20080203534 | COMPLEMENTARY ZENER TRIGGERED BIPOLAR ESD PROTECTION - An electrostatic discharge (ESD) protection clamp ( | 08-28-2008 |
20090213506 | RESISTOR TRIGGERED ELECTROSTATIC DISCHARGE PROTECTION - An electrostatic discharge (ESD) protection device ( | 08-27-2009 |
20090294849 | RESURF SEMICONDUCTOR DEVICE CHARGE BALANCING - Breakdown voltage BVdss is enhanced and ON-resistance reduced in RESURF devices ( | 12-03-2009 |
20130175616 | RESURF SEMICONDUCTOR DEVICE CHARGE BALANCING - Breakdown voltage BVdss is enhanced and ON-resistance reduced in RESURF devices, e.g., LDMOS transistors, by careful charge balancing, even when body and drift region charge balance is not ideal, by: (i) providing a plug or sinker near the drain and of the same conductivity type extending through the drift region at least into the underlying body region, and/or (ii) applying bias Viso to a surrounding lateral doped isolation wall coupled to the device buried layer, and/or (iii) providing a variable resistance bridge between the isolation wall and the drift region. The bridge may be a FET whose source-drain couple the isolation wall and drift region and whose gate receives control voltage Vc, or a resistor whose cross-section (X, Y, Z) affects its resistance and pinch-off, to set the percentage of drain voltage coupled to the buried layer via the isolation wall. | 07-11-2013 |
Patent application number | Description | Published |
20090061564 | METHOD OF PACKAGING AN INTEGRATED CIRCUIT DIE - A structure ( | 03-05-2009 |
20090221114 | PACKAGING AN INTEGRATED CIRCUIT DIE USING COMPRESSION MOLDING - A structure ( | 09-03-2009 |
20100029045 | PACKAGING AN INTEGRATED CIRCUIT DIE WITH BACKSIDE METALLIZATION | 02-04-2010 |
20100252919 | ELECTRONIC DEVICE AND METHOD OF PACKAGING AN ELECTRONIC DEVICE - An electronic device can include a package device structure including a die encapsulated within a packaging material. The package device structure can have a first side and a second side opposite the first side. The electronic device can include a first layer along the first side of the package device structure. The first layer can be capable of causing a first deformation of the package device structure. The electronic device can also include a second layer along the second side of the package device structure. The second layer can be capable of causing a second deformation of the package device structure, the second deformation opposite the first deformation. | 10-07-2010 |
20110119910 | METHOD AND SYSTEM FOR RELEASING A MICROELECTRONIC ASSEMBLY FROM A CARRIER SUBSTRATE - Methods and system for forming a microelectronic assembly ( | 05-26-2011 |
20120021565 | METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE - A method is used to form a packaged semiconductor device. A semiconductor device, which has an active surface, is placed in an opening of a circuit board. The circuit board has a first major surface and a second major surface having the opening, first vias that extend between the first major surface and the second major surface, first contact pads terminating the vias at the first major surface, and second contact pads terminating the vias at the second major surface. A dielectric layer is applied over the semiconductor device and the second major surface of the circuit board. An interconnect layer is formed over the dielectric layer. The interconnect layer has second vias electrically connected to the second contact pads, third vias that are electrically connected to the active surface of the semiconductor device, an exposed surface, and third contact pads at the exposed surface. | 01-26-2012 |
Patent application number | Description | Published |
20140269889 | POWER AND AREA EFFICIENT RECEIVER EQUALIZATION ARCHITECTURE WITH RELAXED DFE TIMING CONSTRAINT - An exemplary receiver equalizer includes a first decision feedback equalizer (DFE) sampler coupled to a summer, the first DFE to latch an equalized output of the summer. The first branch includes a second DFE sampler coupled to the first DFE sampler, the second DFE to latch an output of the first DFE sampler. The first branch includes a third DFE sampler coupled to the second DFE sampler, the third DFE to latch an output of the second DFE sampler. The summer coupled to the first, second, and third DFE samplers of the first branch, the summer to integrate the output of said DFE samplers, the received signal, and equalized outputs from one or more other branches, wherein the integrating occurs over a plurality of unit intervals (UIs). | 09-18-2014 |
20150163077 | POWER AND AREA EFFICIENT RECEIVER EQUALIZATION ARCHITECTURE WITH RELAXED DFE TIMING CONSTRAINT - An exemplary receiver equalizer includes a first decision feedback equalizer (DFE) sampler coupled to a summer, the first DFE to latch an equalized output of the summer. The first branch includes a second DFE sampler coupled to the first DFE sampler, the second DFE to latch an output of the first DFE sampler. The first branch includes a third DFE sampler coupled to the second DFE sampler, the third DFE to latch an output of the second DFE sampler. The summer coupled to the first, second, and third DFE samplers of the first branch, the summer to integrate the output of said DFE samplers, the received signal, and equalized outputs from one or more other branches, wherein the integrating occurs over a plurality of unit intervals (UIs). | 06-11-2015 |
Patent application number | Description | Published |
20080303280 | ENGINE START SYSTEM WITH QUADRATURE AC EXCITATION - A starter-generator system may be used to supply sufficient starting torque to start an aircraft main engine. The main starter-generator stator winding may be connected to a constant frequency (CF) power source to create a rotating field in the main starter-generator air gap. This rotating field, in turn, may induce current on the main rotor winding, which may be a closed circuit formed by main rotor field winding and exciter armature winding. The interaction between the main rotor current and the air gap flux may give rise to the starting torque to start the main engine. Adjusting the voltage supplied to the exciter stator field winding can modify the induced voltage and current on the rotor circuit to control the rotor current and starting torque. The starter-generator system may also be used to start an aircraft main engine by directly connecting the main stator winding to a power source without powering the exciter stator. | 12-11-2008 |
20080303490 | GENERATOR WITH QUADRATURE AC EXCITATION - A generator system is configured to supply two phase excitation current from an exciter rotor to a main generator rotor. When driven by a variable speed prime mover, the generator system provides relatively constant frequency AC power by independently controlling the main rotor flux rotational speed. The generator system includes an exciter stator that induces current in the exciter rotor windings at a desired frequency and phasing. The exciter rotor windings are electrically connected to the main rotor windings to provide two-phase excitation current to the main rotor windings. Excitation is supplied to the exciter stator from an exciter controller, which controls the frequency and phasing of the exciter excitation, based on the rotational speed of the generator, to maintain a constant output frequency. The exciter frequency control function of the exciter controller may be eliminated when the generator system is driven by a constant speed prime mover or when a narrow band variable frequency output is required. | 12-11-2008 |
20090045784 | A NOVEL AIRCRAFT ENGINE STARTER/GENERATOR - A rotor resistor and switch combination may cause a starter/generator device to function as an asynchronous device when in a start mode. Thus, starting torque may result. A starter/generator device may include an exciter rotor winding, a main rotor winding, and a resistor and switch combination positioned between the exciter rotor winding and the main rotor winding to control a flow of current in the main rotor winding during a start mode of the starter/generator device. A method of optimizing starting torque of a starter/generator device without a start controller unit during a start mode may include providing a main rotor winding of the starter/generator device, and providing a control to control a flow of current in the main rotor winding during the start mode. | 02-19-2009 |
20090256419 | AC/AC POWER CONVERTER FOR AIRCRAFT - A matrix converter circuit having two AC/AC matrix converters coupled in parallel in a first mode to power a starter and decoupled in a second mode to each power separate functions used in aircraft power applications. Three common functional modes include 1) start mode with two matrix converters operating in parallel powering the starter, 2) a motor mode where one matrix converter powers a motor, and 3) a constant frequency power mode where the other matrix converter provides constant frequency AC power. | 10-15-2009 |
20100308581 | POSITION-CONTROLLED START FROM THE AC LINE USING A SYNCHRONOUS MACHINE - A synchronous electric machine operates as a starter-generator for an aircraft. When operating in a starting mode, a main stator of the machine is supplied with electrical power at a constant frequency. An exciter stator is supplied with variable frequency power. As rotational speed increases, the exciter variable frequency changes correspondingly to maintain synchronous operation of the machine and maximum torque. In a generator mode, variable frequency is applied to the exciter stator with the exciter frequency varying as a function of rotational speed of an engine driving the machine. This provides for a constant frequency output from the machine. | 12-09-2010 |
20110068753 | GENERATOR WITH QUADRATURE AC EXCITATION - A generator system is configured to supply two phase excitation current from an exciter rotor to a main generator rotor. When driven by a variable speed prime mover, the generator system provides relatively constant frequency AC power by independently controlling the main rotor flux rotational speed. The generator system includes an exciter stator that induces current in the exciter rotor windings at a desired frequency and phasing. The exciter rotor windings are electrically connected to the main rotor windings to provide two-phase excitation current to the main rotor windings. Excitation is supplied to the exciter stator from an exciter controller, which controls the frequency and phasing of the exciter excitation, based on the rotational speed of the generator, to maintain a constant output frequency. The exciter frequency control function of the exciter controller may be eliminated when the generator system is driven by a constant speed prime mover or when a narrow band variable frequency output is required. | 03-24-2011 |
Patent application number | Description | Published |
20090076220 | UNDERFILL FORMULATION AND METHOD OF INCREASING AN ADHESION PROPERTY OF SAME - An underfill formulation includes a solvent ( | 03-19-2009 |
20090093072 | ELECTRONIC ASSEMBLIES WITH HOT SPOT COOLING AND METHODS RELATING THERETO - A composite of two or more thermal interface materials (“TIMs”) is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described. | 04-09-2009 |
20090170247 | MAGNETIC PARTICLES FOR LOW TEMPERATURE CURE OF UNDERFILL - Electronic devices and methods for fabricating electronic devices are described. One embodiment includes a method comprising providing a first body and a second body, and electrically coupling the first body to the second body using a plurality of solder bumps, wherein a gap remains between the first body and the second body. The method also includes placing an underfill material into the gap between the first body and the second body, the underfill material comprising magnetic particles in a polymer composition. The method also includes curing the underfill material in the gap by applying a magnetic field powered by alternating current, to induce heat in the magnetic particles, wherein the heat in the magnetic particles heats the polymer composition, and the magnetic field is applied for a sufficient time to cure the polymer composition. Other embodiments are described and claimed. | 07-02-2009 |
20110136941 | UNDERFILL FORMULATION AND METHOD OF INCREASING AN ADHESION PROPERTY OF SAME - An underfill formulation includes a solvent ( | 06-09-2011 |
Patent application number | Description | Published |
20100291442 | PRIMER FOR BATTERY ELECTRODE - Primer arrangements that facilitate electrical conduction and adhesive connection between an electroactive material and a current collector are presented. In some embodiments, primer arrangements described herein include first and second primer layers. The first primer layer may be designed to provide good adhesion to a conductive support. In one particular embodiment, the first primer layer comprises a substantially uncrosslinked polymer having hydroxyl functional groups, e.g., polyvinyl alcohol. The materials used to form the second primer layer may be chosen such that the second primer layer adheres well to both the first primer layer and an electroactive layer. In certain embodiments including combinations of first and second primer layers, one or both of the first and second primer layers comprises less than 30% by weight of a crosslinked polymeric material. A primer including only a single layer of polymeric material is also provided. | 11-18-2010 |
20110068001 | RELEASE SYSTEM FOR ELECTROCHEMICAL CELLS - Electrochemical cells, and more specifically, release systems for the fabrication of electrochemical cells are described. In particular, release layer arrangements, assemblies, methods and compositions that facilitate the fabrication of electrochemical cell components, such as electrodes, are presented. In some embodiments, methods of fabricating an electrode involve the use of a release layer to separate portions of the electrode from a carrier substrate on which the electrode was fabricated. For example, an intermediate electrode assembly may include, in sequence, an electroactive material layer, a current collector layer, a release layer, and a carrier substrate. The carrier substrate can facilitate handling of the electrode during fabrication and/or assembly, but may be released from the electrode prior to commercial use. | 03-24-2011 |
20140072873 | PRIMER FOR BATTERY ELECTRODE - Primer arrangements that facilitate electrical conduction and adhesive connection between an electroactive material and a current collector are presented. In some embodiments, primer arrangements described herein include first and second primer layers. The first primer layer may be designed to provide good adhesion to a conductive support. In one particular embodiment, the first primer layer comprises a substantially uncrosslinked polymer having hydroxyl functional groups, e.g., polyvinyl alcohol. The materials used to form the second primer layer may be chosen such that the second primer layer adheres well to both the first primer layer and an electroactive layer. In certain embodiments including combinations of first and second primer layers, one or both of the first and second primer layers comprises less than 30% by weight of a crosslinked polymeric material. A primer including only a single layer of polymeric material is also provided. | 03-13-2014 |
20140079994 | RELEASE SYSTEM FOR ELECTROCHEMICAL CELLS - Electrochemical cells, and more specifically, release systems for the fabrication of electrochemical cells are described. In particular, release layer arrangements, assemblies, methods and compositions that facilitate the fabrication of electrochemical cell components, such as electrodes, are presented. In some embodiments, methods of fabricating an electrode involve the use of a release layer to separate portions of the electrode from a carrier substrate on which the electrode was fabricated. For example, an intermediate electrode assembly may include, in sequence, an electroactive material layer, a current collector layer, a release layer, and a carrier substrate. The carrier substrate can facilitate handling of the electrode during fabrication and/or assembly, but may be released from the electrode prior to commercial use. | 03-20-2014 |