Patent application number | Description | Published |
20090000549 | Substrate processing method and apparatus - There is provided a substrate processing method and apparatus which can measure and monitor thickness and/or properties of a film formed on a substrate as needed, and quickly correct a deviation in process conditions, and which can therefore stably provide a product of constant quality. A substrate processing method for processing a substrate having a metal and an insulating material exposed on its surface in such a manner that a film thickness of the metal, with an exposed surface of the metal as a reference plane, is selectively or preferentially changed, including measuring a change in the film thickness and/or a film property of the metal during and/or immediately after processing, and monitoring processing and adjusting processing conditions based on results of this measurement. | 01-01-2009 |
20100075498 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND PROCESSING LIQUID - A semiconductor device has interconnects protected with an alloy film having a minimum thickness necessary for producing the effect of preventing diffusion of oxygen, copper, etc., formed more uniformly over an entire surface of a substrate with less dependency to the interconnect pattern of the substrate. The semiconductor device includes, embedded interconnects, formed by filling an interconnect material into interconnect recesses formed in an electric insulator on a substrate, and an alloy film, containing 1 to 9 atomic % of tungsten or molybdenum and 3 to 12 atomic % of phosphorus or boron, formed by electroless plating on at least part of the embedded interconnects. | 03-25-2010 |
20100105154 | METHOD AND APPARATUS FOR PROCESSING SUBSTRATE - A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate. | 04-29-2010 |
20100325913 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A substrate processing method dose not use or only use the least possible amount of an organic solvent, and can quickly and completely remove a liquid from a wet substrate surface without allowing the liquid to remain on the substrate surface. The substrate processing method for drying a substrate surface which is wet with a liquid, includes: removing the liquid from the substrate surface and sucking the liquid together with its surrounding gas into a gas/liquid suction nozzle, disposed opposite the substrate surface, while relatively moving the gas/liquid suction nozzle and the substrate parallel to each other; and blowing a dry gas from a dry gas supply nozzle, disposed opposite the substrate surface, toward that area of the substrate surface from which the liquid has been removed while relatively moving the dry gas supply nozzle and the substrate parallel to each other. | 12-30-2010 |
20110209727 | METHOD AND APPARATUS FOR CLEANING SUBSTRATE - A substrate is cleaned by performing a scrubbing process on a surface to be cleaned of the rotating substrate with a roll-shaped cleaning member while holding an outer circumferential surface of the roll-shaped cleaning member in contact with the surface to be cleaned of the substrate across a predetermined contact width. During at least a part of the scrubbing process, the roll-shaped cleaning member is placed at an offset cleaning position where the central axis of the roll-shaped cleaning member is spaced from the central axis of the substrate by a distance which is 0.14 to 0.5 times the contact width. The surface to be cleaned of the substrate is scrubbed with more uniform cleaning intensity while taking into account the cleaning intensity at each position (area) along the radial direction of the surface to be cleaned of the substrate. | 09-01-2011 |
20120160267 | CLEANING METHOD AND CLEANING APPARATUS - A cleaning method according to embodiments of the present invention is a cleaning method of cleaning residues from a semiconductor substrate by rotating a roll brush, the method having cleaning residues from the semiconductor substrate while pressing the roll brush against the semiconductor substrate with a first pressure of 7.35 kPa or lower, and cleaning residues from the semiconductor substrate while pressing the roll brush against the semiconductor substrate with a second pressure higher than 7.35 kPa. | 06-28-2012 |
20120318304 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING UNIT - A substrate processing method includes jetting at least one fluid from a fluid nozzle toward a rotating substrate surface while moving the fluid nozzle from a center toward a periphery of the rotating substrate. The fluid nozzle is moved from the center of the substrate to a predetermined point at a constant initial movement speed. The fluid nozzle is subsequently moved from the predetermined point at a movement speed V(r) which satisfies the following relational expression: V(r)×r | 12-20-2012 |
20130000671 | SUBSTRATE CLEANING METHOD - A substrate cleaning method is provided, which can clean a surface of a substrate with a roll cleaning member more uniformly over the entire surface even when a point (area) exists in the cleaning area of the surface of the substrate at which the relative speed between the rotational speed of the substrate and the rotational speed of the roll cleaning member is zero. The substrate cleaning method for scrubbing a surface of a substrate with a roll cleaning member, extending along the diametrical direction of the substrate, by rotating the substrate and the roll cleaning member while keeping the roll cleaning member in contact with the surface of the substrate, includes changing a rotational speed of at least one of the substrate and the roll cleaning member or a direction of rotation of the substrate during the scrub cleaning of the surface of the substrate. | 01-03-2013 |
20130098397 | SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS - The present invention can reduce the burden on a scrub cleaning member without entailing a large footprint and a long cleaning time and can enhance cleaning performance. A moving arm is moved to move a scrub cleaning member from a standby position above the edge of a substrate to a scrub cleaning position above the center of the substrate. A two-fluid nozzle is moved in conjunction with the movement of the moving arm while jetting a mixed fluid from the two-fluid nozzle toward the surface of the rotating substrate to carry out two-fluid jet cleaning of the substrate. After stopping the jetting of the fluid from the two-fluid nozzle, the scrub cleaning member is brought into contact with the surface of the substrate to carry out scrub cleaning of the substrate. | 04-25-2013 |