Patent application number | Description | Published |
20090234687 | METHOD OF DESIGNING AN OPTICAL METROLOGY SYSTEM OPTIMIZED FOR OPERATING TIME BUDGET - Provided is a method of designing an optical metrology system for measuring structures on a workpiece wherein the optical metrology system is configured to achieve a time budget for completing metrology process steps. The design of the optical metrology system is optimized by using collected operating data in comparison to the selected operating criteria. In one embodiment, the optical metrology system is used for stand alone systems. In another embodiment, the optical metrology system is integrated with fabrication clusters in semiconductor manufacturing. | 09-17-2009 |
20090240537 | APPARATUS FOR DESIGNING AN OPTICAL METROLOGY SYSTEM OPTIMIZED FOR OPERATING TIME BUDGET - Provided is an apparatus for designing an optical metrology system for measuring structures on a workpiece wherein the optical metrology system is configured to achieve a time budget for completing metrology process steps. The design of the optical metrology system is optimized by using collected operating data in comparison to the selected operating criteria. In one embodiment, the optical metrology system is used for stand alone systems. In another embodiment, the optical metrology system is integrated with fabrication clusters in semiconductor manufacturing. | 09-24-2009 |
20090248339 | DESIGNING AN OPTICAL METROLOGY SYSTEM OPTIMIZED WITH SIGNAL CRITERIA - Provided is a method of designing an optical metrology system for measuring structures on a workpiece wherein the optical metrology system is configured to meet one or more signal criteria. The design of the optical metrology system is optimized by using collected signal data in comparison to the one or more signal criteria. In one embodiment, the optical metrology system is used for stand alone systems. In another embodiment, the optical metrology system is integrated with a fabrication cluster in semiconductor manufacturing. | 10-01-2009 |
20090248340 | APPARATUS FOR DESIGNING AN OPTICAL METROLOGY SYSTEM OPTIMIZED WITH SIGNAL CRITERIA - Provided is an apparatus for designing an optical metrology system for measuring structures on a workpiece wherein the optical metrology system is configured to meet one or more signal criteria. The design of the optical metrology system is optimized by using collected signal data in comparison to set one or more signal criteria. In one embodiment, the optical metrology system is used for stand alone systems. In another embodiment, the optical metrology system is integrated with a fabrication cluster in semiconductor manufacturing. | 10-01-2009 |
20090248341 | PROCESS CONTROL USING AN OPTICAL METROLOGY SYSTEM OPTIMIZED WITH SIGNAL CRITERIA - Provided is system and method for controlling a fabrication cluster using at least one parameter of a structure measured with an optical metrology system designed and configured to meet one or more signal criteria. The design of the optical metrology system is optimized by using collected signal data in comparison to set one or more signal criteria. In one embodiment, the optical metrology system is used for standalone systems. In another embodiment, the optical metrology system is integrated with a fabrication cluster in semiconductor manufacturing. At least one parameter determined from a signal measured using the optical metrology system is transmitted to a fabrication cluster. The at least one parameter is used to modify at least one process variable or equipment setting of the fabrication cluster. | 10-01-2009 |
20090319075 | AUTOMATED PROCESS CONTROL USING AN OPTICAL METROLOGY SYSTEM OPTIMIZED WITH DESIGN GOALS - Provided is a method of designing an optical metrology system for measuring structures on a workpiece wherein the optical metrology system is configured to meet a plurality of design goals. The design of the optical metrology system is optimized by using collected design goal data in comparison to the set plurality of design goals. In one embodiment, the optical metrology system is used for stand alone metrology systems. In another embodiment, the optical metrology system is integrated with a fabrication cluster in semiconductor manufacturing. At least one parameter determined from a diffraction signal measured using the optical metrology system is transmitted to the fabrication cluster. The at least one parameter is used to modify at least one process variable or equipment setting of the fabrication cluster. | 12-24-2009 |
20090319214 | OPTICAL METROLOGY SYSTEM OPTIMIZED WITH DESIGN GOALS - Provided is a method of designing an optical metrology system for measuring structures on a workpiece where the optical metrology system is configured to meet two or more design goals. The design of the optical metrology system is optimized by using collected design goal data in comparison to the set two or more design goals. In one embodiment, the optical metrology system is used for stand alone metrology systems. In another embodiment, the optical metrology system is integrated with a fabrication cluster in semiconductor manufacturing. | 12-24-2009 |
20100085576 | AUTO FOCUS OF A WORKPIECE USING TWO OR MORE FOCUS PARAMETERS - Provided is a method for focusing a workpiece in the Z-axis for optical metrology. The auto focusing subsystem includes a focus detector having a tilt angle, a capture range, and a plurality of sensors. A processor coupled to the focus detector is configured to utilize the plurality of focus signals measured using the focus detector to determine two or more focus parameters. The two or more focus parameters and calibration data are used to determine an initial position of the workpiece and to generate instructions to move the workpiece to a best focus position. | 04-08-2010 |
20100243859 | APPARATUS FOR CONTROLLING ANGLE OF INCIDENCE OF MULTIPLE ILLUMINATION BEAMS - Provided is an apparatus for projecting multiple beams to a structure on a workpiece comprising a first light source generating a first illumination beam and a second light source generating a second illumination beam, an illumination primary mirror configured to reflect the first illumination beam onto the structure of the workpiece at a first angle of incidence, generating a first detection beam, and configured to reflect the second illumination beam onto the workpiece at a second angle of incidence, generating a second detection beam, a separate illumination secondary mirror positioned relative to the illumination primary mirror so as make the first angle of incidence substantially the same or close to a calculated optimum first angle of incidence and make the second angle of incidence substantially the same or close to a calculated optimum second angle of incidence. The first and second detection beams are diffracted off the structure at the corresponding angle of incidence to a detection primary mirror, reflected onto a separate secondary detection mirror and other optical components on the detection path, and onto spectroscopic detectors. | 09-30-2010 |
20100243860 | CONTROLLING ANGLE OF INCIDENCE OF MULTIPLE- BEAM OPTICAL METROLOGY TOOLS - Provided is a method of controlling multiple beams directed to a structure in a workpiece, the method comprising generating a first illumination beam with a first light source and a second illumination beam with a second light source, projecting the first and second illumination beams onto a separate illumination secondary mirror, reflecting the first and second illumination beams onto an illumination primary mirror, the reflected first and second illumination beams projected onto the structure at a first and second angle of incidence respectively, the reflected first and second illumination beams generating a first and second detection beams respectively. The separate illumination secondary mirror is positioned relative to the illumination primary mirror so as make the first angle of incidence substantially the same or close to a calculated optimum first angle of incidence and make the second angle of incidence substantially the same or close to a calculated optimum second angle of incidence. The first and second detection beams are diffracted off the structure at the corresponding angle of incidence to a detection primary mirror, reflected onto a separate secondary detection mirror and other optical components on the detection path, and onto spectroscopic detectors. | 09-30-2010 |
20140024143 | SYSTEM FOR IN-SITU FILM STACK MEASUREMENT DURING ETCHING AND ETCH CONTROL METHOD - Disclosed is an in-situ optical monitor (ISOM) system and associated method for controlling plasma etching processes during the forming of stepped structures in semiconductor manufacturing. The in-situ optical monitor (ISOM) can be optionally configured for coupling to a surface-wave plasma source (SWP), for example a radial line slotted antenna (RLSA) plasma source. A method is described to correlate the lateral recess of the steps and the etched thickness of a photoresist layer for use with the in-situ optical monitor (ISOM) during control of plasma etching processes in the forming of stepped structures. | 01-23-2014 |