Patent application number | Description | Published |
20090094816 | Method for producing a structure having a perforated sealing strip and structure obtained - The structure comprises facing substrates bonded to one another by crushing a closed peripheral sealing strip delineating a closed cavity in which a microsystem is disposed between the substrates. Before crushing, the sealing strip comprises perforated patterns delineating a plurality of voids inside the strip. | 04-16-2009 |
20100001361 | SUSPENDED GETTER MATERIAL-BASED STRUCTURE - Getter structure comprising a substrate and at least one getter material-based layer mechanically connected to the substrate by means of at least one support, in which the surface of the support in contact with the substrate is smaller than the surface of a first face of the getter material layer, in which said first face is in contact with the support, and a second face of the getter material layer, opposite said first face is at least partially exposed. | 01-07-2010 |
20100003789 | METHOD OF ENCAPSULATING A MICROELECTRONIC DEVICE BY A GETTER MATERIAL - A method of encapsulating a microelectronic device arranged on a substrate, comprising at least the following steps: a) formation of a portion of sacrificial material covering at least one part of the microelectronic device, the volume of which occupies a space intended to form at least one part of a cavity in which the device is intended to be encapsulated; b) deposition of a layer based on at least one getter material, covering at least one part of the portion of sacrificial material; c) formation of at least one orifice through at least the layer of getter material, forming an access to the portion of sacrificial material; d) elimination of the portion of sacrificial material via the orifice, forming the cavity in which the microelectronic device is encapsulated; and e) sealing of the cavity. | 01-07-2010 |
20100178419 | STRUCTURE COMPRISING A GETTER LAYER AND AN ADJUSTING SUBLAYER AND FABRICATION PROCESS - The structure comprises at least a device, for example a microelectronic chip, and at least a getter arranged in a cavity under a controlled atmosphere delineated by a substrate and a sealing cover. The getter comprises at least one preferably metallic getter layer, and an adjustment sub-layer made from pure metal, situated between the getter layer and the substrate, on which it is formed. The adjustment sub-layer is designed to modulate the activation temperature of the getter layer. The getter layer comprises two elementary getter layers. | 07-15-2010 |
20100193215 | STRUCTURE COMPRISING A GETTER LAYER AND AN ADJUSTING SUBLAYER AND FABRICATION PROCESS - The structure comprises at least a device, for example a microelectronic chip, and at least a getter arranged in a cavity under a controlled atmosphere delineated by a substrate and a sealing cover. The getter comprises at least one preferably metallic getter layer, and an adjustment sub-layer made from pure metal, situated between the getter layer and the substrate, on which it is formed. The adjustment sub-layer is designed to modulate the activation temperature of the getter layer. The getter layer comprises two elementary getter layers. | 08-05-2010 |
20110030989 | MICROCAVITY STRUCTURE AND ENCAPSULATION STRUCTURE FOR A MICROELECTRONIC DEVICE - Microcavity structure comprising:
| 02-10-2011 |
20110052879 | ENCAPSULATION DEVICE AND METHOD, MICROCAPSULE INCORPORATING THIS DEVICE - The invention concerns a device for encapsulating an element within a microcavity made on a support ( | 03-03-2011 |
20110079425 | TREATMENT METHOD OF A GETTER MATERIAL AND ENCAPSULATION METHOD OF SUCH GETTER MATERIAL - A treatment method for a getter material, comprising at least one oxidation and/or nitriding step of getter material conducted under dry atmosphere of dioxygen and/or dinitrogen at pressure greater than approximately 10 | 04-07-2011 |
20110079889 | CAVITY STRUCTURE COMPRISING AN ADHESION INTERFACE COMPOSED OF GETTER MATERIAL - A structure comprising a cavity delimited by a first substrate and a second substrate attached to the first substrate by an adhesion interface, in which a first part of a first portion of a getter material forms part of the adhesion interface, and a second part of the first portion of getter material is placed in the cavity, the first portion of getter material being placed against the first substrate or the second substrate, the adhesion interface further comprising part of a second portion of a getter material thermocompressed to the first part of the first portion of getter material, said second portion of getter material being placed against the second substrate when the first portion of getter material is placed against the first substrate or placed against the first substrate when the first portion of getter material is placed against the second substrate. | 04-07-2011 |
20110115056 | GETTER HAVING TWO ACTIVATION TEMPERATURES AND STRUCTURE COMPRISING THIS GETTER - The structure comprises a closed cavity under a controlled atmosphere in which a monoblock getter with a first getter layer is arranged. The first getter layer presents at least first and second getter areas which have different activation temperatures. The second getter area is formed on an adjustment sub-layer of the getter material activation temperature. | 05-19-2011 |
20120112334 | PACKAGING STRUCTURE OF A MICRO-DEVICE INCLUDING A GETTER MATERIAL - A packaging structure including at least one cavity wherein at least one micro-device is provided, the cavity being bounded by at least a first substrate and at least a second substrate integral with the first substrate through at least one bonding interface consisting of at least one metal or dielectric material, wherein at least one main face of the second substrate provided facing the first substrate is covered with at least one layer of at least one getter material, the bonding interface being provided between the first substrate and the layer of getter material. | 05-10-2012 |
20120161333 | DEVICE FOR CONNECTING NANO-OBJECTS TO EXTERNAL ELECTRICAL SYSTEMS, AND METHOD FOR PRODUCING SAID DEVICE - Device for connecting nano-objects to external electrical systems, and method for producing the device. | 06-28-2012 |
20120328779 | STRUCTURE MADE OF GETTER MATERIAL HERMETICALLY PROTECTED DURING MANUFACTURING - Process for making a device comprising at least the following steps:
| 12-27-2012 |
20130015568 | GETTER STRUCTURE WITH OPTIMIZED PUMPING CAPACITYAANM FERRANDON; ChristineAACI SassenageAACO FRAAGP FERRANDON; Christine Sassenage FRAANM BAILLIN; XavierAACI CrollesAACO FRAAGP BAILLIN; Xavier Crolles FR - Getter structure comprising at least one getter portion arranged on a support and including at least two adjacent getter material parts arranged on the support one beside the other, with different thicknesses and of which the surface grain densities are different from one another. | 01-17-2013 |
20130089955 | PROCESS FOR ENCAPSULATING A MICRO-DEVICE BY ATTACHING A CAP AND DEPOSITING GETTER THROUGH THE CAP - Process for encapsulating a micro-device in a cavity formed between one first and one second substrate, comprising at least the steps of:
| 04-11-2013 |
20130207281 | MICROELECTRONIC SUBSTRATE COMPRISING A LAYER OF BURIED ORGANIC MATERIAL - Microelectronic substrate comprising at least:
| 08-15-2013 |
20130221497 | METHOD FOR THE PRODUCTION OF A SUBSTRATE COMPRISING EMBEDDED LAYERS OF GETTER MATERIAL - A method for producing a substrate with buried layers of getter material, including: making a first stack including one layer of a first getter material, arranged on a first support; making a second stack including one layer of a second getter material, arranged on a second support; and bringing the first stack into contact with the second stack and performing thermocompression, the layers of the first and of the second getter material being arranged between the first and the second support, at a temperature greater than or equal to a lowest temperature among thermal activation temperatures of the first and of the second getter material, to bond the layers of the first and second getter materials together. | 08-29-2013 |
20130243942 | PROCESS FOR MAKING A STRUCTURE WITH HERMETICALLY CLOSED CAVITY UNDER CONTROLLED ATMOSPHERE - A process for making an encapsulation structure comprising the following steps:
| 09-19-2013 |
20140038364 | METHOD OF ENCAPSULATING A MICROELECTRONIC DEVICE - Method of encapsulating at least one microelectronic device, comprising at least the following steps:
| 02-06-2014 |
20140160682 | ELECTRONIC COMPONENT AND FABRICATION PROCESS OF THIS ELECTRONIC COMPONENT - An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on the upper face or inside the substrate and connected to the connections via the substrate, a thick insulating layer forming a package and covering the upper face or at least part of the chip, and having an outer face parallel to the plane; a cavity inside the thick layer, the cavity having a bottom parallel to the plane and a side extending from the bottom to the outer face, the cavity having heat-absorbing material inside that is different from the material forming the thick layer. The heat-absorbing material has a specific heat capacity greater than 1 kJKg | 06-12-2014 |
20150028433 | ENCAPSULATION STRUCTURE INCLUDING A MECHANICALLY REINFORCED CAP AND WITH A GETTER EFFECT - A structure ( | 01-29-2015 |
20150050428 | METHOD FOR PRODUCING A METAL LAYER ON A SURFACE - The invention concerns a method for producing a metal coating on a portion of the surface of a substrate of a microelectronic device, wherein it comprises, using a modified nucleic acid strand comprising a nucleic acid strand structure, at least one metal nanoparticle and/or a metal atom and at least one chemical function, at least one step of fixing the chemical function of the at least one modified nucleic acid strand on the portion of the surface of the substrate. | 02-19-2015 |