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Wurman

Peter R. Wurman, Raleigh, NC US

Patent application numberDescriptionPublished
20110060449System and Method for Transporting Inventory Items - A method for transporting inventory items includes moving a mobile drive unit to a first point within a workspace. The first point is a location of an inventory holder. The method further includes docking the mobile drive unit with the inventory holder and moving the mobile drive unit and the inventory holder to a second point within the workspace. The second point is associated with conveyance equipment. The method further includes moving the inventory holder to a third point within the workspace using the conveyance equipment.03-10-2011
20110112758System and Method for Managing Mobile Drive Units - A method for moving a mobile drive unit within a workspace includes receiving a path. The path includes at least an initial segment and one or more additional segments. The initial segment includes a portion of the path adjacent to the first point; and at least one of the additional segments includes a portion of the path adjacent to the second point. The method further includes storing the path, reserving the initial segment of the path, and moving away from the first point along the initial segment. After initiating movement along the initial segment, the method includes reserving each of the additional segments of the path and moving toward the second point along each of the additional segments while that segment is reserved.05-12-2011
20110130954System and Method for Coordinating Movement of Mobile Drive Units - A method for moving one or more mobile drive units within a workspace includes receiving, from a first mobile drive unit, a reservation request requesting use of a first path segment to move in a first direction. The method further includes determining that a second mobile drive unit is currently located on the first path segment and determining whether the second mobile drive unit is moving in the first direction. Additionally, the method includes transmitting a reservation response indicating that the reservation request is denied, in response to determining that the second mobile drive unit is not moving in the first direction. The method also includes transmitting a reservation response indicating that the reservation request is granted, in response to determining that the second mobile drive unit is moving in the first direction.06-02-2011
20120041677SYSTEM AND METHOD FOR MANAGING MOBILE DRIVE UNITS - A method for moving a mobile drive unit within a workspace includes receiving a path. The path includes at least an initial segment and one or more additional segments. The initial segment includes a portion of the path adjacent to the first point; and at least one of the additional segments includes a portion of the path adjacent to the second point. The method further includes storing the path, reserving the initial segment of the path, and moving away from the first point along the initial segment. After initiating movement along the initial segment, the method includes reserving each of the additional segments of the path and moving toward the second point along each of the additional segments while that segment is reserved.02-16-2012
20120143427System and Method for Positioning a Mobile Drive Unit - A method for transporting inventory items includes determining an assignment state of a mobile drive unit. The method also includes selecting a location for the mobile drive unit based on the assignment state of the mobile drive unit, in response to determining that the mobile drive unit is not currently completing a task. The method further includes transmitting information to the mobile drive unit identifying the selected location.06-07-2012

Patent applications by Peter R. Wurman, Raleigh, NC US

Peter R. Wurman, Acton, MA US

Patent application numberDescriptionPublished
20090185884METHOD AND SYSTEM FOR FULFILLING REQUESTS IN AN INVENTORY SYSTEM - A method for fulfilling requests in an inventory system includes receiving a request indicating an activity to be completed. The method also includes selecting a holder to fulfill the request and an inventory station at which to fulfill the request. The inventory station is associated with a queue that includes a plurality of queue spaces. The method further includes moving the selected holder from a first location to a second location remote from the selected inventory station. Additionally, the method also includes determining that a trigger event has occurred and, in response to determining that the trigger event has occurred, moving the selected holder from the second location to a queue space of a queue associated with the selected inventory station.07-23-2009
20110153063System and Method for Processing Waste Material - A method for processing waste in a material handling system includes detecting an occurrence of a trigger event associated with a waste holder located at a first location and, in response to detecting the trigger event, moving a mobile drive unit to the first location. The method also includes loading waste material onto the mobile drive unit at the first location and transporting the waste material to a waste station using the mobile drive unit.06-23-2011

Zeev Wurman, Palo Alto, CA US

Patent application numberDescriptionPublished
20110031997METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A method is presented that may be used to provide a Configurable Logic device, which may be Field Programmable with volume flexibility. A method of fabricating an integrated circuit may include the steps of: providing a semiconductor substrate and forming a borderless logic array, and it may also include the step of forming a plurality of antifuse configurable interconnect circuits and/or a plurality of transistors to configure at least one antifuse. The programming transistors may be fabricated over the at least one antifuse.02-10-2011
20110084314SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A system includes a semiconductor device. The semiconductor device includes a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single crystal silicon layer, wherein the at least one metal layer comprises copper or aluminum more than other materials; and a second single crystal silicon layer overlying the at least one metal layer. The second single crystal silicon layer comprises a plurality of second transistors arranged in substantially parallel bands. Each of a plurality of the bands comprises a portion of the second transistors along an axis in a repeating pattern.04-14-2011
20110199116METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A Configurable device comprising, a logic die connected by at least one through silicon-via (TSV), to an input/output (I/O) die.08-18-2011
20120012895SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A system includes a semiconductor device. The semiconductor device includes a first semiconductor layer comprising first transistors, wherein the first transistors are interconnected by at least one metal layer comprising aluminum or copper. The second mono-crystallized semiconductor layer includes second transistors and is overlaying the at least one metal layer, wherein the second mono-crystallized semiconductor layer is less than 150 nm in thickness, and at least one of the second transistors is an N-type transistor and at least one of the second transistors is a P-type transistor.01-19-2012
20120129301SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A method of manufacturing a semiconductor device, the method including, providing a first monocrystalline layer including semiconductor regions, overlaying the first monocrystalline layer with an isolation layer, transferring a second monocrystalline layer comprising semiconductor regions to overlay the isolation layer, wherein the first monocrystalline layer and the second monocrystalline layer are formed from substantially different crystal materials; and subsequently etching the second monocrystalline layer as part of forming at least one transistor in the second monocrystalline layer.05-24-2012
201201938063D SEMICONDUCTOR DEVICE - A three dimensional semiconductor device includes a first die; and a second die overlaying the first die, wherein said first die comprises signals are selectively coupleable to the second die using Through Silicon Vias.08-02-2012
201201942163D Semiconductor Device - A three dimensional semiconductor device is described with two transistor layers overlaid. The first transistor layer comprises a plurality of flip-flops each having an input and an output, wherein the inputs are selectively coupleable to the second transistor layer.08-02-2012
201201942183D Semiconductor Device - A semiconductor device includes a first transistor layer and a second transistor layer overlaying the first transistor layer, wherein said first transistor layer comprises a plurality of flip-flops each having a selectively coupleable additional input generated by said second transistor layer.08-02-2012
201201963903D SEMICONDUCTOR DEVICE WITH REDUNDANCY - A method for manufacturing system includes 3D-IC comprising at least first layer of first transistors and second layers of second transistors and, perform a test for the circuit constructed with said first transistors and switch in function constructed with said second transistors to replace function constructed with said first transistors.08-02-2012

Patent applications by Zeev Wurman, Palo Alto, CA US

Zeev Wurman US

Patent application numberDescriptionPublished
201201936213D SEMICONDUCTOR DEVICE - A semiconductor device comprising first layer comprising multiplicity of first transistors and, second layer comprising multiplicity of second transistors and, at least one function constructed by the first transistors are structure so it could be replaced by a function constructed by the second transistors.08-02-2012

Ze'Ev Wurman, Pala Alto, CA US

Patent application numberDescriptionPublished
20120248595SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A method of manufacturing a semiconductor device, the method including, providing a first monocrystalline layer including semiconductor regions, overlaying the first monocrystalline layer with an isolation layer, transferring a second monocrystalline layer comprising semiconductor regions to overlay the isolation layer, wherein the first monocrystalline layer and the second monocrystalline layer are formed from substantially different crystal materials; and subsequently etching the second monocrystalline layer as part of forming at least one transistor in the second monocrystalline layer.10-04-2012