Patent application number | Description | Published |
20100109065 | THREE-DIMENSIONAL NONVOLATILE MEMORY DEVICES HAVING SUB-DIVIDED ACTIVE BARS AND METHODS OF MANUFACTURING SUCH DEVICES - Nonvolatile memory devices are provided and methods of manufacturing such devices. In the method, conductive layers and insulating layers are alternatingly stacked on a substrate. A first sub-active bar is formed which penetrates a first subset of the conductive layers and a first subset of the insulating layers. The first sub-active bar is electrically connected with the substrate. A second sub-active bar is formed which penetrates a second subset of the conductive layers and a second subset of the insulating layers. The second sub-active bar is electrically connected to the first sub-active bar. A width of a bottom portion of the second sub-active bar is less than a width of a top portion of the second sub-active bar. | 05-06-2010 |
20100207184 | Semiconductor devices and methods of forming the same - A semiconductor device includes insulating patterns and gate patterns alternately stacked on a substrate; an active pattern on the substrate, which extends upward along sidewalls of the insulating patterns and the gate patterns; data storage patterns interposed between the gate patterns and the active pattern; and a source/drain region disposed in the active pattern between a pair of gate patterns adjacent to each other. | 08-19-2010 |
20100254191 | SEMICONDUCTOR MEMORY DEVICE COMPRISING THREE-DIMENSIONAL MEMORY CELL ARRAY - A semiconductor memory device includes a substantially planar substrate; a memory string vertical to the substrate, the memory string comprising a plurality of storage cells; and a plurality of elongated word lines, each word line including a first portion substantially parallel to the substrate and connected to the memory string and a second portion substantially inclined relative to the substrate and extending above the substrate, wherein a first group of the plurality of word lines are electrically connected to first conductive lines disposed at a first side of the memory string, and a second group of the plurality of word lines are electrically connected to second conductive lines disposed at a second side of the memory string. | 10-07-2010 |
20100315875 | NON-VOLATILE MEMORY DEVICE HAVING VERTICAL STRUCTURE AND METHOD OF OPERATING THE SAME - Provided is a method of operating a non-volatile memory device. The method includes applying a turn-on voltage to each of first and second string select transistors of a first NAND string, applying first and second voltages to third and fourth string select transistors of a second NAND string, respectively, and applying a high voltage to word lines connected with memory cells of the first and second NAND strings. | 12-16-2010 |
20110065270 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF FABRICATING THE SAME - A method of forming a semiconductor memory device includes stacking a plurality of alternating first insulating layers and first sacrificial layers on a substrate to form a first multilayer structure, forming a first hole through the first multilayer structure, forming a first semiconductor pattern in the first hole, stacking a plurality of alternating second insulating layers and second sacrificial layers on the first multilayer structure to form a second multilayer structure, forming a second hole through the second multilayer structure to be aligned with the first hole, forming a second semiconductor pattern in the second hole, forming a trench to expose sidewalls of the first and second insulating layers at a side of the first and second semiconductor patterns, removing at least some portions of the first and second sacrificial layers to form a plurality of recess regions, forming an information storage layer along surfaces of the plurality of recess regions, and forming a conductive pattern within each recess region. | 03-17-2011 |
20110147801 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - Provided are a three-dimensional semiconductor device and a method of fabricating the same. The three-dimensional semiconductor device may include a mold structure for providing gap regions and an interconnection structure including a plurality of interconnection patterns disposed in the gap regions. The mold structure may include interlayer molds defining upper surfaces and lower surfaces of the interconnection patterns and sidewall molds defining sidewalls of the interconnection patterns below the interlayer molds. | 06-23-2011 |
20110151667 | Methods of Manufacturing Three-Dimensional Semiconductor Devices and Related Devices - A three-dimensional semiconductor device may include a substrate including wiring and contact regions and a thin film structure on the wiring and contact regions of the substrate. The thin-film structure may include a plurality of alternating wiring layers and inter-layer insulating layers defining a terraced structure in the contact region so that each of the wiring layers includes a contact surface in the contact region that extends beyond others of the wiring layers more distant from the substrate. A plurality of contact structures may extend in a direction perpendicular to a surface of the substrate with each of the contact structures being electrically connected to a contact surface of a respective one of the wiring layers. Related methods are also discussed. | 06-23-2011 |
20110180941 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - Provided is a three-dimensional semiconductor device and method for fabricating the same. The device includes a first electrode structure and a second electrode structure stacked sequentially on a substrate. The first and second electrode structures include stacked first electrodes and stacked second electrodes, respectively. Each of the first and second electrodes includes a horizontal portion parallel with the substrate and an extension portion extending from the horizontal portion along a direction penetrating an upper surface of the substrate. Here, the substrate may be closer to top surfaces of the extension portions of the first electrodes than to the horizontal portion of at least one of the second electrodes. | 07-28-2011 |
20110284943 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes: a plurality of conductive patterns stacked on a substrate and spaced apart from each other and a pad pattern including a flat portion extending in a first direction parallel to the substrate from one end of any one of the plurality of conductive patterns, and a landing sidewall portion extending upward from a top surface of the flat portion, wherein a width of a portion of the landing sidewall portion in a second direction parallel to the substrate and perpendicular to the first direction is less than a width of the flat portion. | 11-24-2011 |
20110287623 | Three-Dimensional Nonvolatile Memory Devices Having Sub-Divided Active Bars and Methods of Manufacturing Such Devices - Nonvolatile memory devices are provided and methods of manufacturing such devices. In the method, conductive layers and insulating layers are alternatingly stacked on a substrate. A first sub-active bar is formed which penetrates a first subset of the conductive layers and a first subset of the insulating layers. The first sub-active bar is electrically connected with the substrate. A second sub-active bar is formed which penetrates a second subset of the conductive layers and a second subset of the insulating layers. The second sub-active bar is electrically connected to the first sub-active bar. A width of a bottom portion of the second sub-active bar is less than a width of a top portion of the second sub-active bar. | 11-24-2011 |
20110291172 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes a substrate doped with a first conductive type dopant, a plurality of stacked structures arranged side by side on the substrate and extending in a first direction, each of the stacked structures including gate electrodes spaced apart from each other, the plurality of stacked structures including a pair of stacked structures spaced apart from each other at a first interval in a second direction perpendicular to the first direction, and a pick-up region extending in the first direction in the substrate between the pair of stacked structures and doped with the first conductive type dopant. | 12-01-2011 |
20120061744 | THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES - Three dimensional semiconductor memory devices are provided. The three dimensional semiconductor memory device includes a first stacked structure and a second stacked structure sequentially stacked on a substrate. The first stacked structure includes first insulating patterns and first gate patterns which are alternately and repeatedly stacked on a substrate, and the second stacked structure includes second insulating patterns and second gate patterns which are alternately and repeatedly stacked on the first stacked structure. A plurality of first vertical active patterns penetrate the first stacked structure, and a plurality of second vertical active patterns penetrate the second stacked structure. The number of the first vertical active patterns is greater than the number of the second vertical active patterns. | 03-15-2012 |
20120098050 | Three-Dimensional Semiconductor Devices - Three-dimensional semiconductor devices may be provided. The devices may include a stack-structure including gate patterns and an insulation pattern. The stack-structure may further include a first portion and a second portion, and the second portion of the stack-structure may have a narrower width than the first portion. The devices may also include an active pattern that penetrates the stack-structure. The devices may further include a common source region adjacent the stack-structure. The devices may additionally include a strapping contact plug on the common source region. | 04-26-2012 |
20120119287 | 3D SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SAME - A three dimensional (3D) semiconductor device includes; a vertical channel extending from a lower end proximate a substrate to an upper end and connecting a plurality of memory cells, and a cell array comprising the plurality of cells, wherein the cell array is arranged in a gate stack of layers having a stair-stepped structure disposed on the substrate. The gate stack includes a lower layer including a lower select line coupled to a lower non-memory transistor proximate the lower end, upper layers including conductive lines respectively coupled to an upper non-memory transistor proximate the upper end and connected as a single conductive piece to form an upper select line, and intermediate layers respectively including a word line and coupled to a cell transistor, wherein the intermediate layers are disposed between the lower select line and the upper select line. | 05-17-2012 |
20120322252 | SEMICONDUCTOR MEMORY DEVICE COMPRISING THREE-DIMENSIONAL MEMORY CELL ARRAY - A semiconductor memory device includes a substantially planar substrate; a memory string vertical to the substrate, the memory string comprising a plurality of storage cells; and a plurality of elongated word lines, each word line including a first portion substantially parallel to the substrate and connected to the memory string and a second portion substantially inclined relative to the substrate and extending above the substrate, wherein a first group of the plurality of word lines are electrically connected to first conductive lines disposed at a first side of the memory string, and a second group of the plurality of word lines are electrically connected to second conductive lines disposed at a second side of the memory string. | 12-20-2012 |
20130161831 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICES - A three-dimensional semiconductor device may include a substrate including wiring and contact regions and a thin film structure on the wiring and contact regions of the substrate. The thin-film structure may include a plurality of alternating wiring layers and inter-layer insulating layers defining a terraced structure in the contact region so that each of the wiring layers includes a contact surface in the contact region that extends beyond others of the wiring layers more distant from the substrate. A plurality of contact structures may extend in a direction perpendicular to a surface of the substrate with each of the contact structures being electrically connected to a contact surface of a respective one of the wiring layers. Related methods are also discussed. | 06-27-2013 |
20130201758 | NON-VOLATILE MEMORY DEVICE HAVING VERTICAL STRUCTURE AND METHOD OF OPERATING THE SAME - Provided is a method of operating a non-volatile memory device. The method includes applying a turn-on voltage to each of first and second string select transistors of a first NAND string, applying first and second voltages to third and fourth string select transistors of a second NAND string, respectively, and applying a high voltage to word lines connected with memory cells of the first and second NAND strings. | 08-08-2013 |
20130295761 | Three-Dimensional Semiconductor Device and Method for Fabricating the Same - Provided is a three-dimensional semiconductor device and method for fabricating the same. The device includes a first electrode structure and a second electrode structure stacked sequentially on a substrate. The first and second electrode structures include stacked first electrodes and stacked second electrodes, respectively. Each of the first and second electrodes includes a horizontal portion parallel with the substrate and an extension portion extending from the horizontal portion along a direction penetrating an upper surface of the substrate. Here, the substrate may be closer to top surfaces of the extension portions of the first electrodes than to the horizontal portion of at least one of the second electrodes. | 11-07-2013 |
20140014889 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME - A semiconductor device includes a plurality of first insulating layers and a plurality of second layers alternately and vertically stacked on a substrate. Each of the plurality of second layers includes a horizontal electrode horizontally separated by a second insulating layer. A contact plug penetrates the plurality of first insulating layers and the second insulating layer of the plurality of second layers. | 01-16-2014 |
20140063890 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device including gate structures provided on a substrate, a separation insulating layer interposed between the gate structures, and a plurality of cell pillars connected to the substrate through each gate structure. Each gate structure may include horizontal electrodes vertically stacked on the substrate, and an interval between adjacent ones of the cell pillars is non-uniform. | 03-06-2014 |
20140183756 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE - A three-dimensional semiconductor device includes a substrate having a cell array region between first and second contact regions. A first stack includes a plurality of first electrodes vertically provided on the substrate, and a second stack includes a plurality of second electrodes vertically provided on the first stack. The second stack is arranged to expose end portions of the first electrodes on the first contact region and overlap end portions of the first electrodes on the second contact region. | 07-03-2014 |
20140248766 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - Provided are a three-dimensional semiconductor device and a method of fabricating the same. The three-dimensional semiconductor device may include a mold structure for providing gap regions and an interconnection structure including a plurality of interconnection patterns disposed in the gap regions. The mold structure may include interlayer molds defining upper surfaces and lower surfaces of the interconnection patterns and sidewall molds defining sidewalls of the interconnection patterns below the interlayer molds. | 09-04-2014 |
20160049346 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - Provided are a three-dimensional semiconductor device and a method of fabricating the same. The three-dimensional semiconductor device may include a mold structure for providing gap regions and an interconnection structure including a plurality of interconnection patterns disposed in the gap regions. The mold structure may include interlayer molds defining upper surfaces and lower surfaces of the interconnection patterns and sidewall molds defining sidewalls of the interconnection patterns below the interlayer molds. | 02-18-2016 |
20160049419 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device including gate structures provided on a substrate, a separation insulating layer interposed between the gate structures, and a plurality of cell pillars connected to the substrate through each gate structure. Each gate structure may include horizontal electrodes vertically stacked on the substrate, and an interval between adjacent ones of the cell pillars is non-uniform. | 02-18-2016 |
Patent application number | Description | Published |
20090315095 | Multiple-layer non-volatile memory devices, memory systems employing such devices, and methods of fabrication thereof - In multiple-layered memory devices, memory systems employing the same, and methods of forming such devices, a second memory device layer on a first memory device layer comprises a second substrate including a second memory cell region. The second substrate includes only a single well in the second memory cell region, the single well of the second memory cell region comprising a semiconducting material doped with impurity of one of a first type and second type. The single well defines an active region in the second memory cell region of the second substrate. Multiple second cell strings are arranged on the second substrate in the second active region. Although the second memory cell region includes only a single well, during a programming or erase operation of the memory cells of the second layer, requiring a high voltage to be applied to the single well in the substrate of the second layer, the high voltage will not interfere with the operation of the peripheral transistors of the first layer, second layer, or other layers, since they are isolated from each other. As a result, the substrate of the second layer can be prepared to have a thinner profile, and with fewer processing steps, resulting in devices with higher-density, greater reliability, and reduced fabrication costs. | 12-24-2009 |
20110171787 | MULTIPLE-LAYER NON-VOLATILE MEMORY DEVICES, MEMORY SYSTEMS EMPLOYING SUCH DEVICES, AND METHODS OF FABRICATION THEREOF - In multiple-layered memory devices, memory systems employing the same, and methods of forming such devices, a second memory device layer on a first memory device layer comprises a second substrate including a second memory cell region. The second substrate includes only a single well in the second memory cell region, the single well of the second memory cell region comprising a semiconducting material doped with impurity of one of a first type and second type. The single well defines an active region in the second memory cell region of the second substrate. Multiple second cell strings are arranged on the second substrate in the second active region. Although the second memory cell region includes only a single well, during a programming or erase operation of the memory cells of the second layer, requiring a high voltage to be applied to the single well in the substrate of the second layer, the high voltage will not interfere with the operation of the peripheral transistors of the first layer, second layer, or other layers, since they are isolated from each other. As a result, the substrate of the second layer can be prepared to have a thinner profile, and with fewer processing steps, resulting in devices with higher-density, greater reliability, and reduced fabrication costs. | 07-14-2011 |
Patent application number | Description | Published |
20110056544 | SOLAR CELL - A solar cell is disclosed. The solar cell includes a substrate containing first impurities of a first conductive type, an emitter layer containing second impurities of a second conductive type opposite the first conductive type, a first electrode electrically connected to the emitter layer, and a second electrode electrically connected to the substrate. The emitter layer and the substrate form a p-n junction. A doping concentration of the second impurities of the emitter layer linearly or nonlinearly changes depending on a depth of a position within the emitter layer. | 03-10-2011 |
20110056545 | SOLAR CELL - A solar cell is discussed. The solar cell includes a substrate of a first conductive type, an emitter region of a second conductive type opposite the first conductive type that is positioned on the substrate, a first field region of the first conductive type that is positioned on the substrate to be separated from the emitter region, a first electrode electrically connected to the emitter region, a second electrode electrically connected to the first field region, and an insulating region positioned on at least one of the emitter region and the first field region. | 03-10-2011 |
20110056550 | SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME - A solar cell and a method for manufacturing the same are disclosed. The solar cell includes a substrate that contains first impurities of a first conductive type and is formed of a crystalline semiconductor, a first field region that is positioned on an incident surface of the substrate and contains second impurities of a second conductive type, an emitter region that contains third impurities of a third conductive type, is formed of a non-crystalline semiconductor, and is positioned on a non-incident surface of the substrate opposite the incident surface of the substrate, a first electrode electrically connected to the emitter region, and a second electrode electrically connected to the substrate. | 03-10-2011 |
20150132598 | EXTERIOR DECOR PANEL FOR HOME APPLIANCE AND METHOD OF MANUFACTURING THE SAME - Manufacturing an exterior decor panel for a home appliance includes laminating a photosensitive dry film on a front surface of a metal sheet, the photosensitive dry film having a higher etch resistance than the metal sheet against an electrolytic solution, photo-masking the photosensitive dry film attached to the metal sheet to create a pattern having a minimum width of 0.1 mm in the photosensitive dry film to thereby expose the front surface of the metal sheet corresponding to the pattern in the photosensitive film, electrolytic-polishing the photo-masked metal sheet by dipping the photo-masked metal sheet in an electrolytic bath to allow the electrolytic solution to contact the exposed front surface of the metal sheet and form the pattern in the front surface of the metal sheet, and performing post-treatment on the metal sheet, the post-treatment including washing and removing the photosensitive dry film. | 05-14-2015 |
20150263188 | SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME - A solar cell is discussed, and includes a substrate; a first field region; a first electrode directly formed on an emitter region; and a second electrode directly formed on a second field region, wherein a second passivation layer comprises a first back passivation portion and a second back passivation portion. Furthermore, the first back passivation portion is merely positioned between the emitter region and the substrate and the second field region and the substrate, and the second back passivation portion is positioned between the emitter region and the second field region, and wherein the first back passivation portion positioned between the emitter region and the substrate is physically separated from first back passivation portion positioned between the second field region and the substrate. | 09-17-2015 |
Patent application number | Description | Published |
20110222342 | DATA STORAGE SYSTEM HAVING MULTI-BIT MEMORY DEVICE AND OPERATING METHOD THEREOF - A data storage device includes a non-volatile memory device which includes a memory cell array; and a memory controller which includes a buffer memory and which controls the non-volatile memory device. The operating method of the data storage device includes storing data in the buffer memory according to an external request, and determining whether the data stored in the buffer memory is data accompanying a buffer program operation of the memory cell array. When the data stored in the buffer memory is data accompanying the buffer program operation, the method further includes determining whether a main program operation on the memory cell array is required, and when a main program operation on the memory cell array is required, determining a program pattern of the main program operation on the memory cell array. The method further includes issuing a set of commands for the main program operation on the memory cell array to the multi-bit memory device based on the determined program pattern. | 09-15-2011 |
20130141972 | DATA STORAGE SYSTEM HAVING MULTI-BIT MEMORY DEVICE AND OPERATING METHOD THEREOF - A data storage device includes a non-volatile memory device which includes a memory cell array; and a memory controller which includes a buffer memory and which controls the non-volatile memory device. The operating method of the data storage device includes storing data in the buffer memory according to an external request, and determining whether the data stored in the buffer memory is data accompanying a buffer program operation of the memory cell array. When the data stored in the buffer memory is data accompanying the buffer program operation, the method further includes determining whether a main program operation on the memory cell array is required, and when a main program operation on the memory cell array is required, determining a program pattern of the main program operation on the memory cell array. The method further includes issuing a set of commands for the main program operation on the memory cell array to the multi-bit memory device based on the determined program pattern. | 06-06-2013 |
20140016397 | NONVOLATILE MEMORY DEVICE AND WRITE METHOD THEREOF - A nonvolatile memory device includes a memory cell array including a plurality of memory cells, and a data comparison write unit connected with the memory cell array and configured to support a comparison write operation. The nonvolatile memory device further includes control logic configured to selectively execute the comparison write operation based on a comparison between an access number of the memory cell array and a reference number. | 01-16-2014 |
20140032890 | STORAGE DEVICE COMPRISING VARIABLE RESISTANCE MEMORY AND RELATED METHOD OF OPERATION - A storage device includes a nonvolatile memory device including a variable resistance memory, and a controller configured to control the nonvolatile memory device. At a booting operation, the controller stores booting information in the variable resistance memory of the nonvolatile memory device. At a rebooting operation, the controller selectively performs a warm boot operation using the booting information stored in the variable resistance memory, based on a comparison result between a booting setting condition associated with the booting operation and a rebooting condition associated with the rebooting operation. | 01-30-2014 |
20140040535 | NONVOLATILE MEMORY DEVICE HAVING WEAR-LEVELING CONTROL AND METHOD OF OPERATING THE SAME - A method is provided for controlling a write operation in a nonvolatile memory device to provide wear leveling, where the nonvolatile memory device includes multiple memory blocks. The method includes reading write indication information with respect to at least a selected memory block of the multiple memory blocks; determining whether a write order of data to be stored in the selected memory block is an ascending order or a descending order, based on the write indication information of the selected memory block; and generating addresses of memory regions in the selected memory block in an ascending order when the write order of the data is determined to be an ascending order, and generating addresses of the memory regions in the selected memory block in a descending order when the write order is determined to be a descending order. | 02-06-2014 |
20140043892 | SEMICONDUCTOR MEMORY DEVICE HAVING VARIABLE RESISTANCE MEMORY AND OPERATING METHOD - A semiconductor memory device includes a memory cell array of nonvolatile memory cells having a variable resistance element, and a conductor line array capable of generating a compensation magnetic field for the nonvolatile memory cells. A current driver selectively supplies current to conductive lines, a magnetic field sensor senses an applied external magnetic field and generates external magnetic field information, and a controller controls generation of the compensation magnetic field in response to the external magnetic field information. | 02-13-2014 |
20140071744 | NONVOLATILE MEMORY MODULE, MEMORY SYSTEM INCLUDING NONVOLATILE MEMORY MODULE, AND CONTROLLING METHOD OF NONVOLATILE MEMORY MODULE - A memory system is provided, which includes a nonvolatile memory module including a plurality of nonvolatile memory devices, and a memory module controller configured to control the nonvolatile memory module. At least two nonvolatile memory devices of the plurality of nonvolatile memory devices are configured to store serial presence detect (SPD) information. The memory module controller is configured to read the SPD information from the nonvolatile memory module and to set a communication mode with the nonvolatile memory module based on the read SPD information. | 03-13-2014 |
20140112082 | DATA STORAGE DEVICE, CONTROLLER, AND OPERATING METHOD OF DATA STORAGE DEVICE - A nonvolatile memory is provided which includes a memory cell array including a plurality of nonvolatile memory cells; a decoder connected with the memory cell array through a plurality of word lines; a data input/output circuit connected with the memory cell array through a plurality of bit lines; a voltage detector configured to detect a variation in a power supply voltage to output a voltage variation signal; and control logic configured to control the decoder and the data input/output circuit such that data stored at the memory cell array is invalidated in response to the voltage variation signal. | 04-24-2014 |
20140313824 | DATA STORAGE SYSTEM HAVING MULTI-BIT MEMORY DEVICE AND OPERATING METHOD THEREOF - A data storage device includes a non-volatile memory device which includes a memory cell array; and a memory controller which includes a buffer memory. The operating method of the data storage device includes storing data in the buffer memory, and determining whether the data stored in the buffer memory is data accompanying a buffer program operation of the memory cell array. When the data stored in the buffer memory is data accompanying the buffer program operation, the method further includes determining whether a main program operation on the memory cell array is required, and when a main program operation on the memory cell array is required, determining a program pattern of the main program operation on the memory cell array. The method further includes issuing a set of commands for the main program operation on the memory cell array to the multi-bit memory device based on the program pattern. | 10-23-2014 |
20140372829 | RISK PROTECTION STORAGE DEVICE AND RISK PROTECTION METHOD THEREOF - A storage device in accordance with the inventive concepts includes at least one nonvolatile memory device and a memory controller controlling the nonvolatile memory device. The memory controller includes at least one processor configured to control an operation of the storage device, and configured to perform at least one of a trim operation according a trim command and a garbage collection operation and a risk protection controller configured to perform a risk protection operation that disables at least one of the garbage collection operation or the trim operation according to a risk protection signal internally generated or a risk protection command input from the external device. | 12-18-2014 |
20150279475 | NONVOLATILE MEMORY MODULE, MEMORY SYSTEM INCLUDING NONVOLATILE MEMORY MODULE, AND CONTROLLING METHOD OF NONVOLATILE MEMORY MODULE - A memory system is provided, which includes a nonvolatile memory module including a plurality of nonvolatile memory devices, and a memory module controller configured to control the nonvolatile memory module. At least two nonvolatile memory devices of the plurality of nonvolatile memory devices are configured to store serial presence detect (SPD) information. The memory module controller is configured to read the SPD information from the nonvolatile memory module and to set a communication mode with the nonvolatile memory module based on the read SPD information. | 10-01-2015 |