Patent application number | Description | Published |
20090079091 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER - An integrated circuit packaging system comprising: fabricating an interposer array having an access opening; fabricating a base package substrate sheet; attaching a first integrated circuit die over the base package substrate sheet; mounting the interposer array over the first integrated circuit die; and singulating a base package from the base package substrate sheet and the interposer array by cutting the access opening generally through the center. | 03-26-2009 |
20090155961 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION - An integrated circuit package system comprising: providing a base substrate; attaching a base integrated circuit die over the base substrate; forming a support over the base substrate near only one edge of the base substrate; and attaching a stack substrate over the support and the base integrated circuit die. | 06-18-2009 |
20090189275 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFER SCALE HEAT SLUG - An integrated circuit package system includes: providing a singulated, layered structure equivalent in size to an integrated circuit die and having an adhesive layer, an electrical insulator layer, and a heat slug; attaching the integrated circuit die to a base; attaching bond wires to a top of the base for electrical connection between the integrated circuit die and the base; attaching the singulated, layered structure to the integrated circuit die wherein the bond wires are surrounded by the adhesive layer; and encapsulating the integrated circuit die and a portion of the heat slug with a molding compound. | 07-30-2009 |
20090243070 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE UNDER WIRE-IN-FILM ADHESIVE - An integrated circuit package in package system including: providing a substrate; mounting a wire bonded die with an active side over the substrate; connecting the active side to the substrate with bond wires; mounting a structure over the wire bonded die having a wire-in-film adhesive between the structure and the wire bonded die and overhangs at ends of the structure between the wire-in-film adhesive and the substrate; mounting support structures at the overhangs between the wire-in-film adhesive and the substrate; and encapsulating the wire bonded die and the structure with an encapsulation. | 10-01-2009 |
20100123247 | BASE PACKAGE SYSTEM FOR INTEGRATED CIRCUIT PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of a base package system includes: forming a substrate strip assembly including: providing a substrate strip having ball lands, mounting an integrated circuit on the substrate strip, and molding a finger structure, having a knuckle region, on the integrated circuit; and singulating a substrate from the substrate strip assembly. | 05-20-2010 |
20100244236 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a package substrate; mounting an integrated circuit die on the package substrate; and attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the package substrate and the integrated circuit die. | 09-30-2010 |
20110316162 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRENCHES AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate with a material layer including grooves in a fillet region that are substantially parallel and adjacent an integrated circuit; and forming a resin between the substrate and the integrated circuit that contacts a trench trace exposed by the grooves. | 12-29-2011 |
20120146243 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER - An integrated circuit packaging system comprising: a base package substrate; a first integrated circuit die attached over the base package substrate; and an interposer having a recessed edge and a corner that extends to a singulation edge, the interposer mounted over the first integrated circuit die, the interposer having a recess gap between the recessed edge and the singulation edge. | 06-14-2012 |
20120146246 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIELECTRIC SUPPORT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having an outer pad at a substrate top side; forming a resist layer directly on the substrate top side, the resist layer having a resist top side with a channel array adjacent the outer pad exposed from the resist layer; mounting an integrated circuit having an active side facing the resist top side, the integrated circuit having a non-horizontal side adjacent the outer pad; and forming a dielectric between the active side and the resist top side, the dielectric having a fillet extended from the non-horizontal side to the substrate top side inside an inner extent of the channel array. | 06-14-2012 |
20120241980 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COLLAPSED MULTI-INTEGRATION PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a central integrated circuit over the base substrate; mounting a side package having a side package substrate along a peripheral region of the base substrate and laterally peripheral to the central integrated circuit with the side package substrate coplanar with the central integrated circuit; and encapsulating the central integrated circuit and the side package above the base substrate with a base encapsulation to form a planar surface over the central integrated circuit and the side package facing away from the base substrate. | 09-27-2012 |