Patent application number | Description | Published |
20100061351 | MULTI-COEXISTENCE COMMUNICATION SYSTEM BASED ON INTERFERENCE-AWARE ENVIRONMENT AND METHOD FOR OPERATING THE SAME - A multi-coexistence communication technology is provided. A multi-coexistence communication system based on an interference-aware environment and a method for operating the same can remove interference detected using an interference temperature limit from at least one transmission signal and transmit the signal to a main/sub communication terminal during data communication on a wired/wireless communication network formed of a main base station, a sub base station, the main communication terminal, and the sub communication terminal, thereby smoothly providing a high-speed seamless data transmission service based on a multi-coexistence communication environment where a distributed small-scale network requiring a low transmission rate, a medium-scale network for providing various wireless communication services, and a large-scale broadcasting network requiring a high transmission rate and high quality coexist, and preventing congestion due to increased demand for frequency resources. | 03-11-2010 |
20100217790 | METHOD AND APPARATUS FOR DIGITAL UP-DOWN CONVERSION USING INFINITE IMPULSE RESPONSE FILTER - A method and an apparatus for digital up-down conversion using an Infinite Impulse Response (IIR) filter are provided. The method for digital up-down conversion for frequency conversion in a mobile communication system using plural frequency converts, includes IIR-filtering, by a magnitude response IIR filter having the same magnitude response as in Finite Impulse Response (FIR) filtering, an input signal and a stable filter coefficient calculated according to a Levinson polynomial; and receiving, by the magnitude response IIR filter, the IIR filtered signal, and performing IIR filtering by a phase compensation IIR filter having a filter coefficient compensating for a non-linear phase to a linear phase. | 08-26-2010 |
20110142154 | SEQUENTIAL TRANSMISSION MULTI-BEAMFORMING METHOD WITH LOW COMPLEXITY USING HADAMARD MATRIX - Provided is a sequential transmission multi-beamforming apparatus and method with a low complexity based on a Hadamard matrix. A simple codebook may be generated based on the Hadamard matrix and thus, a number of weighted-vectors is reduced and a complexity of hardware is decreased. A diversity gain may be maximized based on a spatial diversity processing apparatus and a beamforming weighted vector may be systematically generated. | 06-16-2011 |
20130122933 | APPARATUS AND METHOD FOR PROVIDING COMMUNICATION SERVICES VIA TELEVISION WHITE SPACES - Disclosed herein are an apparatus and method for providing communication services. The apparatus includes a location information acquisition unit, a radio station information acquisition unit, and an offloading unit. The location information acquisition unit acquires information about the current location of the user terminal by sending a location information request message to the user terminal The radio station information acquisition unit requests information about a white space radio station from which the user terminal can receive the communication services by sending the information about the current location of the user terminal to a white space server, and acquires, from the white space server, information about an available white space radio station. The offloading unit sends the information about the available white space radio station to the user terminal, and also sends information about the user terminal to the available white space radio station. | 05-16-2013 |
20130241774 | WIRELESS POSITIONING SERVER USING CLOCK OFFSET CALIBRATION AND WIRELESS POSITIONING METHOD USING THE SAME - A wireless positioning server using clock offset compensation and a wireless positioning method using the same. The wireless positioning server using clock offset compensation estimates a precise position of a tag requiring position information by effectively predicting information regarding a distance between a beacon for performing positioning and the tag requiring position information. An error in the positioning estimation result due to a clock offset is minimized by measuring a relative clock frequency ratio between beacons and by compensating for clock frequencies of the beacons when a distance between a beacon and a tag is estimated. | 09-19-2013 |
20140131867 | SYSTEM AND METHOD FOR DESIGNING SEMICONDUCTOR PACKAGE USING COMPUTING SYSTEM, APPARATUS FOR FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SYSTEM, AND SEMICONDUCTOR PACKAGE DESIGNED BY THE METHOD - A system for designing a semiconductor package using a computing system, comprising: a virtual stacking module configured to receive a layout parameter for a first chip, a layout parameter for a second chip, and a layout parameter for a package substrate, and in response to the layout parameters of the first chip, the second chip, and the package substrate, generate a plurality of virtual layouts in which the first and second chips are stacked, on the package substrate; a modeling module configured to model operating parameters for the first and second chips and the package substrate in response to the virtual layouts; and a characteristic analyzing module configured to analyze operating characteristics of the virtual layouts in response to the modeled operating parameters. | 05-15-2014 |
20140208284 | METHOD AND SYSTEM FOR DESIGNING 3D SEMICONDUCTOR PACKAGE - A three-dimensional semiconductor package and method for making the same include providing a first package layout parameter for a plurality of first terminals included in a first package, a second package layout parameter for a plurality of second terminals included in a second package disposed above or below the first package, and a connection terminal layout parameter for a plurality of connection terminals electrically connecting the first package and the second package; providing a first wiring connection layout between the first and second terminals and the connection terminals by applying a first process to the first package, second package, and connection terminal layout parameters; and providing a second wiring connection layout between the first and second terminals and the connection terminals by applying a second process, which is different from the first process, to the first wiring connection layout. | 07-24-2014 |
20160056091 | SEMICONDUCTOR PACKAGE AND ELECTRONIC APPARATUS INCLUDING THE SAME - Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip. | 02-25-2016 |