Patent application number | Description | Published |
20080220567 | Semiconductor Component and Production Method - A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a housing, which at least partially surrounds the semiconductor chip. The substrate is at least partly provided with a layer of polymer foam. | 09-11-2008 |
20080224301 | Lead Structure for a Semiconductor Component and Method for Producing the Same - A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic housing composition, and a chip mounting island composed of the lead material. While leaving free contact pads of the internal leads, the top sides of the chip mounting island and the internal leads are equipped with nanotubes as an anchoring layer. The plastic housing composition is arranged in the interspaces between the nanotubes arranged on the internal leads, while an adhesive composition for the semiconductor chip is arranged in the interspaces between the nanotubes arranged on the chip mounting island. The adhesive composition and the plastic housing composition fill the interspaces in a manner free of voids. | 09-18-2008 |
20090026558 | SEMICONDUCTOR DEVICE HAVING A SENSOR CHIP, AND METHOD FOR PRODUCING THE SAME - A semiconductor sensor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing. | 01-29-2009 |
20090039484 | Semiconductor device with semiconductor chip and method for producing it - A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts. | 02-12-2009 |
20090146272 | ELECTRONIC DEVICE - Embodiments provide an electronic device including a carrier defining a first major surface, a chip attached to the first major surface, an array of leads connected to the first major surface, and a thickness of encapsulation material disposed on the first major surface of the carrier. Each lead extends through the thickness of the encapsulation material. | 06-11-2009 |
20090280314 | THERMOPLASTIC-THERMOSETTING COMPOSITE AND METHOD FOR BONDING A THERMOPLASTIC MATERIAL TO A THERMOSETTING MATERIAL - Composite with a first part composed of a thermoset material and with a second part composed of a thermoplastic material, and with an adhesion-promoter layer located between these, where the first part has been bonded by way of the adhesion-promoter layer to the second part, and where the adhesion-promoter layer comprises pyrolytically deposited semiconductor oxides and/or pyrolytically deposited metal oxides. | 11-12-2009 |
20100207277 | SEMICONDUCTOR COMPONENT HAVING A STACK OF SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING THE SAME - A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another. | 08-19-2010 |
20120223424 | SEMICONDUCTOR COMPONENT AND PRODUCTION METHOD - Semiconductor component and method for production of a semiconductor component. The invention relates to a semiconductor component having a semiconductor chip, which is arranged on a substrate, in one embodiment on a chip carrier, and an encapsulation material, which at least partially surrounds the semiconductor chip. The chip carrier is at least partly provided with a layer of polymer foam. | 09-06-2012 |
20130105992 | SEMICONDUCTOR COMPONENT HAVING A STACK OF SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING THE SAME | 05-02-2013 |
20140001622 | CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR MANUFACTURING CHIP PACKAGES | 01-02-2014 |