Patent application number | Description | Published |
20110061917 | LAMINATED SUBSTRATE FOR AN INTEGRATED CIRCUIT BGA PACKAGE AND PRINTED CIRCUIT BOARDS - A laminated substrate for an integrated circuit package, including a core layer and at least one build-up layer located above only one side of said core layer. An integrated circuit package, including a laminated substrate and including an integrated circuit die placed above the side build-up layer. | 03-17-2011 |
20110062576 | INTEGRATED CIRCUIT PACKAGE AND DEVICE - An integrated circuit package including: a substrate having front connection pads on a front face, an integrated circuit die linked to the front face of the substrate and having front connection pads, connection wires for connecting selected front pads of the integrated circuit die to selected front pads of the substrate, first connection balls on selected front connection pads of the integrated circuit die, and second connection balls on selected front connection pads of the substrate. An integrated circuit device including a second substrate connected to the connection balls of the integrated circuit package. | 03-17-2011 |
20110064362 | INTEGRATED CIRCUIT DEVICE OR PACKAGE AND INTEGRATED CIRCUIT SYSTEM, WITH AN OPTICAL WAVE-GUIDE ELEMENT - An integrated circuit device or package comprising: a laminated substrate, at least an electro-optical element at least partially inserted in the laminated substrate, and at least an optical wave-guide element at least partially inserted in the laminated substrate and optically coupled to the electro-optical element. An integrated circuit system comprising an integrated circuit device and a mounting plate carrying an optical wave-guide part or fiber. | 03-17-2011 |
20140091455 | Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging - A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die. | 04-03-2014 |
20140091482 | Semiconductor Device and Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP - A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface. | 04-03-2014 |
Patent application number | Description | Published |
20150197632 | INTERIOR AIRCRAFT COMPONENTS AND METHODS OF MANUFACTURE - A aircraft component comprises a polycarbonate composition comprising: a first polycarbonate selected from a polycarbonate homopolymer, a poly(aliphatic ester-carbonate), or a combination thereof; a second polymer different from the first polycarbonate, the second polymer comprising a poly(carbonate-siloxane) copolymer, a polydialkylsiloxane, a silicone graft copolymer, or a combination thereof, wherein siloxane units in the second polymer are present in the polycarbonate composition in an amount of 0.3 to 3 wt. %, based on the total weight of the polycarbonate composition; and 10 to 50 wt. % of glass fiber, based on the total weight of the polycarbonate composition. | 07-16-2015 |
20150197633 | INTERIOR TRAIN COMPONENTS HAVING LOW SMOKE AND LOW HEAT RELEASE, AND METHODS OF THEIR MANUFACTURE - A railway component comprises a polycarbonate composition comprising: a first polycarbonate selected from a linear polycarbonate homopolymer, a branched polycarbonate, a poly(carbonate-bisphenol arylate ester), a poly(aliphatic ester-carbonate), or a combination thereof; a second polymer different from the first polycarbonate, the second polymer comprising a poly(carbonate-siloxane) copolymer, a polydialkylsiloxane, a silicone graft copolymer, or a combination thereof, wherein siloxane units in the second polymer are present in an amount of 0.3 to 3 wt. %, based on the total weight of the composition; and 10 to 40 wt. % of glass fiber, based on the total weight of the polycarbonate composition. | 07-16-2015 |