Patent application number | Description | Published |
20100043212 | PRINTED CIRCUIT BOARD BONDING DEVICE - The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism. | 02-25-2010 |
20100043213 | TRANSFER APPARATUS FOR TRANSFERRING A COMPONENT OF INTEGRATED CIRCUITRY - The invention provides for a transfer apparatus for transferring a component of integrated circuitry from a receiving location to a delivery location within an integrated circuitry assembly machine. The transfer apparatus includes a support structure that defines a transfer path between said locations, and a component carrier that defines a receiving zone configured to receive the component of integrated circuitry. The transfer apparatus also includes a retaining mechanism arranged on the component carrier to retain the component of integrated circuitry in position in the receiving zone, the retaining mechanism being operable to release the component at the delivery location, as well as a displacement mechanism engaged with the component carrier to displace the component carrier along said transfer path. | 02-25-2010 |
20100043214 | INTEGRATED CIRCUIT DICE PICK AND LIFT HEAD - The invention provides for a dice pick and lift head for an assembler for assembling printhead integrated circuitry on a carrier. The assembler includes an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The dice pick and lift head includes a first translation stage mounted to the die picking assembly, said first translation stage operatively displaceable along a vertical axis relative to the support assembly. The dice pick and lift head also includes a second translation stage mounted to the first translation stage, said second translation stage operatively displaceable along a horizontal axis relative to the support assembly. Further included is a die picker head mounted to the second translation stage, the picker head defining a vacuum chamber and a dice contact surface having vacuum apertures in fluid communication with the vacuum chamber. | 02-25-2010 |
20100043215 | CLAMP ASSEMBLY FOR AN ASSEMBLER FOR ASSEMBLING PRINTHEAD INTEGRATED CIRCUITRY ON A CARRIER - The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The clamp assembly includes an elongate clamp body, the body shaped and configured to be received by the die placement assembly, and a pair of elongate retaining plates mounted on top of the body. The clamp also includes an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier, as well as a diaphragm positioned in the body, the diaphragm pneumatically displaceable to operatively urge the insert against the retaining plates. | 02-25-2010 |
20100043217 | FASTENING APPARATUS WITH AUTHENTICATION SYSTEM - The present invention relates to a fastening apparatus for fastening a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The fastening apparatus includes a support assembly. An authentication system is arranged on the support assembly and is confinctionfigured to authenticate the printhead assembly. At least one bonding assembly is configured to bond the PCB to the printhead assembly. A controller is configured to control the bonding assembly to bond the PCB to the printhead assembly subsequent to the authentication of the printhead assembly. | 02-25-2010 |
20100043218 | ASSEMBLER FOR ASSEMBLING A CARRIER FOR PRINTHEAD INTEGRATED CIRCUITS - Provided is an assembler for assembling a carrier for supporting printhead integrated circuits. The carrier has upper and lower parts that are operatively fastened together. The assembler includes a support structure configured to support the lower part in a pre-fastened position, and a holding mechanism arranged on the support structure for holding the upper part in a pre-fastened position. The assembler also includes a displacement mechanism arranged on the support structure for displacing the holding mechanisms to bring the parts into operative registration with each other, and a fastening apparatus for fastening the parts together. | 02-25-2010 |
20100043220 | METHOD FOR CONNECTING A FLEXIBLE PRINTED CIRCUIT BOARD (PCB) TO A PRINTHEAD ASSEMBLY - The present invention relates to a method for connecting a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The method includes the step of connecting the flexible PCB to the printhead using a first heater assembly movable along a first path. In turn, the connected PCB is then bent. The method further includes the step of connecting the bent PCB to the printhead carrier using a second heater assembly movable along a second path. | 02-25-2010 |
20100043224 | METHOD OF ATTACHING INTEGRATED CIRCUITS TO A CARRIER - The invention provides for a method of attaching printhead integrated circuitry to a carrier. The method includes scanning a wafer having a number of circuitry dies formed thereon to demarcate respective dies, aligning a die picker with a dice on the wafer according to a wafer substrate mapping scheme, and removing the dice from the wafer with the die picker. The method further includes the steps of transporting the dice to a placement station operatively positioning the carrier, aligning the dice with the carrier; and heat bonding the dice to the carrier. | 02-25-2010 |
20100043533 | PNEUMATIC ASSEMBLY FOR A PRESSURE DECAY TESTER - A pneumatic assembly for a pressure decay tester of printhead integrated circuits includes a pressurized air supply. A pneumatic clamping arrangement is in fluid communication with the pressurized air supply for clamping a carrier for the printhead integrated circuits such that the carrier is in fluid communication with the printhead integrated circuits. A valve arrangement applies a predetermined pressure to the carrier. A sensing arrangement senses a static pressure in the carrier. A control system is in communication with the clamping, valve and sensing arrangements to control operation thereof and to generate a discernible signal representing said static pressure such that a decay in said static pressure can be determined. | 02-25-2010 |
20100043534 | PRESSURE-BASED TESTER FOR A PLATFORM ASSEMBLY - The invention provides for a pressure-based tester for testing integrity of a platform assembly. The platform assembly includes a pair of assembled platform components fastened together and a fluid path extending into both components, the platform assembly suitable for supporting printhead integrated circuits to be tested. The tester includes a housing assembly, a regulated gas supply arranged in the housing assembly, and a retaining mechanism in fluid communication with the gas supply and configured to retain the platform assembly in fluid communication with the gas supply during testing of the platform assembly. The tester also includes a pressure measuring apparatus operatively connected to the gas supply and configured to generate a signal corresponding to a pressure value applied to the retaining mechanism, and a control system configured to control operation of the regulated gas supply, the retaining mechanism and configured to receive the signal from the pressure measuring apparatus and to detect decay in the pressure value. | 02-25-2010 |
20100043535 | LEAK TESTER FOR A CARRIER FOR PRINTHEAD INTEGRATED CIRCUITRY - Provided is a leak tester for a carrier for printhead integrated circuits. The carrier has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The tester includes a support assembly that includes at least one receptacle shaped and configured to receive at least one respective carrier, and a pressurized fluid supply arranged on the support assembly and configured to supply pressurized fluid to the fluid inlets, the pressurized fluid supply incorporating a sealing mechanism configured to engage the fluid inlets in a sealing manner. The tester also includes a pressure measurement arrangement operatively arranged with respect to the pressurized fluid supply to measure pressure applied at the fluid inlets, and a controller operatively connected to the pressure measurement arrangement and pressurized fluid supply, the controller being configured to control the fluid supply to charge the carrier with pressurized fluid until a predetermined pressure is reached, and to monitor the pressure for a predetermined period of time. | 02-25-2010 |
20100043536 | CRADLE ASSEMBLY FOR A PRESSURE DECAY LEAK TESTER - A cradle assembly for a pressure decay leak tester is provided. The assembly operatively receives a printhead integrated circuit carrier having a plurality of printing fluid paths defined therein, respective fluid inlets in fluid communication with respective fluid paths and a locating formation to facilitate correct location of the carrier on the tester. The assembly includes at least one complementary locating formation for engaging the locating formation of the carrier, and at least one fluid outlet for charging the carrier with fluid via a respective fluid inlet of the carrier. Also included is a clamping device for clamping the carrier to the fluid outlet, so that the integrity of the fluid paths is observable via pressure decay testing, and a control system operatively connected to the clamping device for controlling operation of the clamping device. | 02-25-2010 |
20100043960 | METHOD FOR LAMINATING A CARRIER FOR PRINTHEAD INTEGRATED CIRCUITRY - Provided is a method for laminating a carrier for printhead integrated circuits. The carrier includes a plurality of fiducials. The method includes the steps of receiving the carrier in a cradle platform, aligning each said fiducial with respective fiducials in a lamina having a series of such holes therein, and bonding the aligned lamina to the carrier, so that a printing fluid is able to pass through the laminated apertures after such bonding. | 02-25-2010 |
20100043977 | LAMINATING APPARATUS FOR A PRINTHEAD CARRIER SUB-ASSEMBLY - The invention relates to a laminating apparatus for laminating a printhead integrated circuit (IC) carrier sub-assembly and a lamination film. The apparatus includes a lamination support for receiving the carrier, a lamina supply for supplying a lamina defining said lamination film, and an alignment mechanism configured to align the lamination film with the IC carrier sub-assembly. Also included is a bonding apparatus configured to bond the lamination film to the IC carrier sub-assembly, and a control system to control operation of the lamina supply, alignment mechanism and bonding apparatus to facilitate automatic bonding of the lamination film to the surface of the carrier. | 02-25-2010 |
20100043978 | ADHESIVE APPLICATION APPARATUS FOR USE WITH AN ASSEMBLING MACHINE - The invention relates to an adhesive application apparatus for use with an assembling machine for assembling operatively upper and lower components for carrying printhead integrated circuits. The application apparatus includes a plate and a dispensing mechanism which includes an adhesive reservoir, said mechanism being operatively engaged with said plate in a sealing and sliding manner, the mechanism configured to dispense adhesive onto the plate when sliding along the plate. The apparatus also includes a displacement mechanism to slide the dispensing mechanism along the plate, and a control system to control operation of the dispensing and displacement mechanisms. | 02-25-2010 |
20100043979 | BONDING APPARATUS FOR PRINTHEADS - The invention relates to a bonding apparatus for bonding a carrier sheet used for carrying printhead integrated circuits to a carrier base. The apparatus includes a support assembly configured to receive and support the carrier base, and a lamination head arranged on the support assembly and configured to bond the carrier sheet to the carrier base. Further included are a conformal material supply mechanism arranged on the support assembly and configured to interpose a conformal material between the surface and the head prior to bonding, and a controller to control operation of the lamination head and the supply mechanism to facilitate bonding of the carrier sheet to the carrier base. | 02-25-2010 |
20100043980 | ALIGNMENT MECHANISM FOR ALIGNING AN INTEGRATED CIRCUIT - Provided is an alignment mechanism for aligning a lamination film with a carrier substructure prior to laminating the film to the substructure to form a carrier for integrated circuits. The substructure and the lamination film define complementary perforations and a plurality of respective fiducials. The alignment mechanism includes a sensor arrangement configured to detect the fiducials in the lamination film and substructure and a displacement mechanism configured to displace the lamination film with respect to the substructure to align the perforations of the film and substructure respectively according to alignment of their fiducials so that a printing fluid can pass through the perforations in the film and the substructure of the carrier. The mechanism also includes a controller configured to control operation of the sensor arrangement and the displacement mechanism. | 02-25-2010 |
20100044437 | MEASURING APPARATUS FOR A CARRIER OF PRINTHEAD INTEGRATED CIRCUITRY - The invention provides for a measuring apparatus for measuring the positions of a plurality of printhead integrated circuits relative to a carrier on which the printhead integrated circuits are located. The carrier has carrier fiducials and each integrated circuit has integrated circuit fiducials. The measuring apparatus includes a support assembly, a receptacle positioned on the support assembly and configured to receive the carrier, the receptacle being movable relative to the support assembly between a loading position and a sensing position, and a sensor configured to sense positions of the carrier and integrated circuit fiducials. The apparatus also includes a control system configured to control the sensor to measure the positions of the carrier and integrated circuit fiducials. | 02-25-2010 |
20100045458 | SAFETY SYSTEM FOR AN INTEGRATED CIRCUIT ALIGNMENT TESTING APPARATUS - The invention provides for a safety system for a measuring apparatus for measuring positions of integrated circuits on an integrated circuit carrier positioned, in use, in a working enclosure of the apparatus. The safety system includes a sensor arrangement for sensing an operational status of the measuring apparatus, and an emergency cut-off configured to deactivate the measuring apparatus automatically when an undesired operational status is sensed by the sensor arrangement. A control system is connected to the sensor arrangement and the emergency cut-off to activate the emergency cut-off on receipt of a predetermined signal from the sensor arrangement. | 02-25-2010 |
20100045729 | METHOD FOR TESTING ALIGNMENT OF A TEST BED WITH A PLURALITY OF INTEGRATED CIRCUITS THEREON - The invention relates to a method for testing an alignment of a carrier with respect to a plurality of integrated circuits on the carrier. The carrier has optically discernible carrier references and each integrated circuit has optically discernible circuit references. The method includes the steps of receiving the carrier in a holding assembly, sensing positions of the carrier and circuit references, and measuring the positions of the carrier and circuit references | 02-25-2010 |
20100045730 | METHOD FOR TESTING INTEGRITY OF A BASE FOR PRINTHEAD INTEGRATED CIRCUITRY - Provided is a method for testing integrity of a base for printhead integrated circuits. The base has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The method includes the steps of engaging the, or each, fluid inlet of the base to a fluid supply in a sealing manner, charging the base with pressurized fluid until a predetermined pressure is reached, and monitoring the pressure in the base for a predetermined period of time, wherein a rate of pressure decay is indicative of an integrity of the base. | 02-25-2010 |
20100045741 | METHOD FOR ASSEMBLING A CARRIER FOR INTEGRATED CIRCUITS - The invention relates to a method for assembling a carrier for integrated circuits. The carrier has upper and lower parts. The method includes the steps of positioning the lower part in a bottom clamp portion retained in a bottom clamp receptacle, positioning a top clamp portion in a top clamp receptacle, the clamp portions being configured to engage each other in a locking manner, and positioning the upper part in a first gripper. The method also features the steps of applying adhesive to at least one of the parts, pressing said upper part onto the bottom part retained by the bottom clamp receptacle with the first gripper, whilst retrieving the top clamp portion with a second gripper, and locking the top clamp portion to the bottom clamp portion with the second gripper to clamp the parts together. | 02-25-2010 |
20100045986 | IMAGING APPARATUS FOR IMAGING INTEGRATED CIRCUITS ON AN INTEGRATED CIRCUIT CARRIER - The invention provides for an imaging apparatus for imaging integrated circuits and a respective integrated circuit carrier. This enables positional analysis to be carried out on the integrated circuits and respective carrier. The imaging apparatus includes a support structure, and a bed mounted on the support structure and displaceable along an operatively horizontal axis, the bed being configured to support a nest assembly that operatively retains the integrated circuit carrier and respective integrated circuits. Also included is a support assembly operatively mountable with respect to a bed on which the integrated circuit carrier and integrated circuits are supported, in use. The apparatus further includes an image recordal device mounted on the support assembly and configured to record an image representing the integrated circuit carrier and integrated circuits, the support assembly including an adjustment mechanism to enable adjustment of a position of the image recordal device relative to the bed. | 02-25-2010 |
20100046007 | MEASURING APPARATUS FOR PERFORMING POSITIONAL ANALYSIS ON AN INTEGRATED CIRCUIT CARRIER - The invention relates to a measuring apparatus. The apparatus includes a housing assembly that defines an enclosure, a control system mounted in the housing assembly, and an operator interface mounted on the housing assembly and connected to the control system to allow an operator to control the measuring apparatus. The apparatus also includes a measuring table assembly mounted in the housing assembly and configured to receive a nest assembly supporting an integrated circuit carrier carrying a number of integrated circuits, and a camera assembly mounted in the housing assembly and configured to generate image data representing the integrated circuit carrier and the integrated circuits. The camera assembly is connected to the control system which is configured to carry out a positional analysis on the integrated circuit carrier and the integrated circuits to determine at least one of positions of the integrated circuits on the carrier and relative positions of consecutive integrated circuits. | 02-25-2010 |
20100047043 | INTEGRATED CIRCUIT PLACEMENT SYSTEM - This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier. | 02-25-2010 |
20100047044 | PLACEMENT HEAD FOR A DIE PLACING ASSEMBLY - The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage. The placement head further includes a third translation stage mounted on the second stage, the third stage displaceable orthogonally to the first and second stages, as well as a die placer head mounted to the third stage, the placer head shaped and dimensioned to operatively receive a die from the dice conveyance mechanism and to place the dice onto the carrier. | 02-25-2010 |
20100047052 | Wafer positioning system - The invention provides for a wafer positioning assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler includes an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The wafer positioning assembly, in turn, includes a displacement assembly having a base plate with first and second stages mounted thereon, and a wafer support plate assembly rotatably mounted on the second stage. The support plate assembly is configured to receive the wafer and has a motor under control of the control system to rotate the support plate assembly underneath the die picking assembly. | 02-25-2010 |
20100047053 | DIE PICKER FOR PICKING PRINTHEAD DIE FROM A WAFER - The invention provides for a die picker for picking printhead integrated circuitry from a wafer. The picker includes a wafer platform having a displacement actuator to displace said platform which operatively receives the wafer, and a picker head having a vacuum mechanism to lift a dice of the circuitry from said wafer. The picker also includes an alignment sensor configured to detect a position of the dice on the wafer, and a controller arranged in control signal communication with the displacement actuator, the picker head and the sensor to facilitate aligning the wafer with the picker head, and to pick the dice from the wafer with the head for transport to a transfer apparatus. | 02-25-2010 |
20100047962 | MULTI-CHIP PRINTHEAD ASSEMBLER - The invention relates to an assembler for assembling printhead integrated circuitry on a carrier. The assembler includes a support assembly, a wafer positioning assembly arranged on the support assembly and configured to retain and position a wafer defining a plurality of die to be picked from the wafer; and a die picking assembly arranged on the support assembly and configured to pick a pre-selected dice from the wafer. The assembler also includes a die placement assembly arranged on the support assembly and configured to receive the pre-selected dice and to place the dice on the carrier, and a die conveyance mechanism arranged on the support assembly and configured to convey the dice from the die picking assembly to the die placement assembly. Further included is a control system operatively engaged with the wafer positioning, die picking, die placement and die conveyance assemblies to control operation thereof. | 02-25-2010 |
20110149355 | IMAGING APPARATUS FOR IMAGING INTEGRATED CIRCUITS ON AN INTEGRATED CIRCUIT CARRIER - The invention provides for an imaging apparatus for imaging an integrated circuit carrier and respective integrated circuits mounted on the integrated circuit carrier. The imaging apparatus has a support structure and a bed mounted on the support structure. The bed is displaceable along a horizontal axis. A nest assembly is supported by the bed, and retains the integrated circuit carrier and respective integrated circuits. An image recordal device is provided for recording an image representing the integrated circuit carrier and integrated circuits. A support assembly is attached to the support structure. The support assembly supports the image recordal device, and is adjustable to enable adjustment of a position of the image recordal device relative to the bed. | 06-23-2011 |
20110232371 | PRESSURE TESTER FOR PRINTHEAD INTEGRATED CIRCUIT CARRIER - A pressure-based tester for testing an integrity of a printhead integrated circuit (IC) carrier includes a housing assembly; a cradle assembly coupled to the housing assembly and adapted to receive the printhead IC carrier, the cradle assembly further defining spouts adapted to engage with the printhead IC carrier; a regulated gas supply arranged in the housing assembly; a first gas supply line in fluid communication with the regulated gas supply; a pneumatic retaining mechanism in fluid communication with the gas supply via the first gas supply line, the pneumatic retaining mechanism for retaining the carrier in fluid communication with the spouts during testing of the platform assembly; a second gas supply line in fluid communication with the regulated gas supply, the second gas supply line being separated from the first gas supply line by a pressure regulator, the second gas supply line for supplying gas to the spouts; a pressure sensor for measuring a gas pressure at each spout and generating a signal indicative of the measured gas pressure; and a control system for controlling the regulated gas supply and the pneumatic retaining mechanism. The control system is further configured to receive the signal generated by the pressure sensor to determine the presence of any decay in the gas pressure at each spout. | 09-29-2011 |
20120006494 | PRINTED CIRCUIT BOARD BONDING DEVICE - A bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly includes an enclosed work area; a first heater assembly provided within the enclosed work area and movable along a first path; a bending mechanism provided within the enclosed work area and adapted to bend the bonded PCB; a second heater assembly provided within the enclosed work area and movable along a second path; a nest structure for receiving the printhead assembly, the nest structure movable along a third path; and a control system to control operation of the heater assemblies, bending mechanism, and nest structure. The first path and the second path are constrained to an area within the enclosed work area, and the third path crosses a boundary of the enclosed work area. | 01-12-2012 |