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| 20110220600 | ROTATING ORGANIZER USING JARS FOR STORAGE - An organizer that may be mounted on either a wall, wall to ceiling, ceiling, or many other ways, using limited space, and using jars for storage. It has eight wooden slats that have jars attached. There are either six or seven jars, depending on the jar size, attached to the eight rows. The lids are fastened to the slats, and the jars can be opened by unscrewing them from their lids. There are handles on one end to rotate the storage system, and a ratchet on the interior to prevent slipping. The ratchet allows rotation in only one direction. Because they are transparent, the jars allow the user to visually select what the user is looking for. These jars can hold anything from hobby supplies to nuts and bolts. Potential applications range from garage organizing to commercial applications. It can be mounted in a commercial van for electricians or plumbers. | 09-15-2011 |
| 20120201644 | Rotating Organizer Using Jars or Other Containers for Storage - An organizer that may be mounted on either one or two surfaces, such as a wall, ceiling or floor, or two of them, using limited space, and using jars or other containers for storage. It has four wooden slats that have jars or other containers attached. In the first preferred embodiment, there are several jars, the number depending on the jar size, attached to each slat. The lids are fastened to the slats, and the jars can be opened by unscrewing them from their lids. In the second preferred embodiment, plastic containers, with lids that can snap open and shut, are attached to the slates. There are handles on one end to rotate the storage system. Because they are transparent, the jars or plastic containers allow you to visually select what you are looking for. These jars or plastic containers can hold anything from hobby Supplies to nuts and bolts. | 08-09-2012 |
| Patent application number | Description | Published |
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| 20080211077 | Low profile chip scale stacking system and method - The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile structures provide connection between CSPs of the stacked module and between and to the flex circuitry. Low profile contacts are created by any of a variety of methods and materials including, for example, screen paste techniques and use of high temperature solders, although other application techniques and traditional solders may be employed for creating low profile contacts in the present invention. A consolidated low profile contact structure and technique is provided for use in alternative embodiments of the present invention. The CSPs employed in stacked modules devised in accordance with the present invention are connected with flex circuitry. That flex circuitry may exhibit one or two or more conductive layers. In some preferred embodiments, a form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In other embodiments, a heat spreader is disposed between the CSP and the flex circuitry thus providing an improved heat transference function without the standardization of the form standard, while still other embodiments lack either a form standard or a heat spreader and may employ, for example, the flex circuitry as a heat transference material. | 09-04-2008 |
| 20090046431 | High Capacity Thin Module System - Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module. | 02-19-2009 |
| 20090052124 | Circuit Module with Thermal Casing Systems - Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module. | 02-26-2009 |
| 20090073661 | THIN CIRCUIT MODULE AND METHOD - A circuit module includes a printed circuit board (PCB) having a first side, a second side, and a bottom perimeter edge. The PCB exhibits a first thickness along the bottom perimeter edge. The first side includes a recessed area and, in that recessed area, the PCB has a second thickness that is less than the first thickness. A plurality of integrated circuits (ICs) are fixed to the PCB in the recessed area. A plurality of module contacts are connected to the ICs and are disposed along at least one of the first and second sides and are configured to provide electrical connection between the circuit module and an edge connector. | 03-19-2009 |
| 20090124045 | Low Profile Stacking System and Method - The present invention provides a system and method that mounts integrated circuit devices onto substrates and a system and method for employing the method in stacked modules. The contact pads of a packaged integrated circuit device are substantially exposed. A solder paste that includes higher temperature solder paste alloy is applied to a substrate or to the integrated circuit device to be mounted. The integrated circuit device is positioned to contact the contacts of the substrate. Heat is applied to create high temperature joints between the contacts of the substrate and the integrated circuit device resulting in a device-substrate assembly with high temperature joints. The formed joints are less subject to re-melting in subsequent processing steps. The method may be employed in devising stacked module constructions such as those disclosed herein as preferred embodiments in accordance with the invention. Typically, the created joints are low in profile. | 05-14-2009 |
| 20090273069 | LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD - The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile structures provide connection between CSPs of the stacked module and between and to the flex circuitry. Low profile contacts are created by any of a variety of methods and materials including, for example, screen paste techniques and use of high temperature solders, although other application techniques and traditional solders may be employed for creating low profile contacts in the present invention. A consolidated low profile contact structure and technique is provided for use in alternative embodiments of the present invention. The CSPs employed in stacked modules devised in accordance with the present invention are connected with flex circuitry. That flex circuitry may exhibit one or two or more conductive layers. In some preferred embodiments, a form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In other embodiments, a heat spreader is disposed between the CSP and the flex circuitry thus providing an improved heat transference function without the standardization of the form standard, while still other embodiments lack either a form standard or a heat spreader and may employ, for example, the flex circuitry as a heat transference material. | 11-05-2009 |
