Patent application number | Description | Published |
20080223152 | METHODS AND SYSTEMS FOR USING ACTIVE SURFACE COVERINGS FOR STRUCTURAL ASSESSMENT AND MONITORING - A system for structural assessment is described that comprises a plurality of sensors and a surface covering for at least a portion of a structure. The sensors are arranged in a pattern and attached to the surface covering. The surface covering is attached to a surface of a structure, and the sensors are configured to provide signals relating to the integrity of the structure to an external device. | 09-18-2008 |
20100227105 | PREDICTABLE BONDED REWORK OF COMPOSITE STRUCTURES - A patch for reworking an inconsistent area of a composite structure comprises a composite laminate patch and a bond joint between the patch and the structure. The bond joint including at least first and second regions respectively having differing properties for releasing strain energy around the inconsistent area at different rates. | 09-09-2010 |
20100227106 | PREDICTABLE BONDED REWORK OF COMPOSITE STRUCTURES USING TAILORED PATCHES - A patch for reworking an inconsistent area in a composite structure includes a composite laminate patch and a layer of adhesive for bonding the laminate patch to the composite structure. The laminate patch has at least first and second regions for releasing strain energy around the inconsistent area respectively at different rates. | 09-09-2010 |
20100227117 | TAPERED PATCH FOR PREDICTABLE BONDED REWORK OF COMPOSITE STRUCTURES - A patch for reworking an inconsistent area in a composite structure includes a composite laminate patch adapted to cover the inconsistent area and bonded to the structure by a layer of adhesive. The patch includes a plurality of composite plies having a tapered cross section, and at least first and second regions respectively having differing fracture toughnesses. | 09-09-2010 |
20100233424 | COMPOSITE STRUCTURES EMPLOYING QUASI-ISOTROPIC LAMINATES - A composite laminate comprises a stack of unidirectional fiber reinforced composite plies arranged in a fiber orientation sequence providing the laminate with quasi-isotropic properties. | 09-16-2010 |
20100250148 | DETERMINISTIC NDE SYSTEM AND METHOD FOR COMPOSITE DAMAGE ASSESSMENT AND REPAIR - A deterministic non-destructive evaluation system for composite damage assessment and repair includes structure of interest, non-destructive evaluation data and strength test data obtained on the structure of interest, finite element analysis performed on a structural model modified by the non-destructive data and the strength test data, a strength-to-indication correlation based on the finite element analysis and deterministic non-destructive evaluation predictions and recommendations based on the strength-to-indication correlation. | 09-30-2010 |
20110177309 | OBLONG CONFIGURATION FOR BONDED PATCH - A patch for a structure has a rework area with an inconsistency formed therein. The patch comprises a patch body having at least two regions including a fail-safe region and a safe-life region encompassing the fail-safe region. The safe-life region has a mode I interlaminar fracture toughness that is less than the mode I interlaminar fracture toughness of the fail-safe region. | 07-21-2011 |
20130260077 | TAPERED PATCH FOR PREDICTABLE BONDED REWORK OF COMPOSITE STRUCTURES - A patch for reworking an inconsistent area in a composite structure includes a composite laminate patch adapted to cover the inconsistent area and bonded to the structure by a layer of adhesive. The patch includes a plurality of composite plies having a tapered cross section, and at least first and second regions respectively having differing fracture toughnesses. | 10-03-2013 |
20130337214 | PREDICTABLE BONDED REWORK OF COMPOSITE STRUCTURES USING TAILORED PATCHES - A patch for reworking an inconsistent area in a composite structure includes a composite laminate patch and a layer of adhesive for bonding the laminate patch to the composite structure. The laminate patch has at least first and second regions for releasing strain energy around the inconsistent area respectively at different rates. | 12-19-2013 |
20140020221 | BONDED PATCH HAVING MULTIPLE ZONES OF FRACTURE TOUGHNESS - A composite laminate patch for reworking an inconsistent area in a structure has inner and outer control regions possessing differing interlaminar fracture toughnesses for controlling the advance of a disbond in the patch. One or more separation zones in the patch between the control regions aids in diffusing the fracture energy of the disbond as the disbond advances from the inner region to the outer region. | 01-23-2014 |
20140076481 | Discretely Tailored Multi-Zone Bondline for Fail-Safe Structural Repair - A repair patch for reworking an inconsistent area of a composite structure includes a patch body adapted to cover the inconsistent area and having a first patch region, a second patch region outside the first patch region and a first separation zone between the first patch region and the second patch region, with the first patch region, the first separation zone and the second patch region having increasing interlaminar fracture toughness from a center to an edge of the patch body; and a layer of adhesive for bonding the patch body to the composite structure. | 03-20-2014 |
20140322491 | OBLONG CONFIGURATION FOR BONDED PATCH - A patch for a structure has a rework area with an inconsistency formed therein. The patch comprises a patch body having at least two regions including a fail-safe region and a safe-life region encompassing the fail-safe region. The safe-life region has a mode I interlaminar fracture toughness that is less than the mode I interlaminar fracture toughness of the fail-safe region. | 10-30-2014 |
Patent application number | Description | Published |
20110055672 | METHOD OF CERTIFYING MULTIPLE VERSIONS OF AN APPLICATION - A first check code is computed by applying an algorithm to a proper subset of a first body of data. A second check code is computed by applying the algorithm to an equivalent proper subset of a second equivalent body of data. The two check codes are compared. The extent of the proper subset of the first body of data is determined by a semantic analysis of the first body of data. Multiple versions of an application, when the semantic changes between the applications are inconsequential, may then be certified by ignoring the non-significant modifications and ensuring the integrity of the remainder of the content. | 03-03-2011 |
20120144417 | METHOD AND SYSTEM FOR CONTROLLING CONTENT IN A MULTIMEDIA DISPLAY - A computer system is used to create and distribute a multimedia presentation. At a source, audio-video content and an interactive application are broadcast. At a distributor, the audio-video content and the interactive application are received, and at least one resource of the application is replaced with a replacement resource. The audio-video content and the modified interactive application with the replacement resource are distributed. At a receiver, the audio-video content and the modified interactive application are received, the audio-video content is displayed, and in response to an external signal the interactive application is executed utilizing the replacement resource. | 06-07-2012 |
20130097176 | METHOD AND SYSTEM FOR DATA MINING OF SOCIAL MEDIA TO DETERMINE AN EMOTIONAL IMPACT VALUE TO MEDIA CONTENT - A computer system provides access to a corpus of social media content; extracts from the corpus of social media content one or more ratings of an item of media content; identifies the author of each of the one or more ratings; analyzes the content of each of the one or more ratings of an item of media content and assigns a value to each of the one or more ratings; analyzes the corpus of social media content and assigns an impact coefficient to the author of each of the one or more ratings; aggregates the values of the one or more ratings, weighted by the assigned impact coefficients of the author of each of the one or more ratings, and determines therefrom an aggregated value; and based on the aggregated value, assigns an emotional impact value to the item of media content. | 04-18-2013 |
20140140679 | METHOD AND SYSTEM FOR PROVIDING SOCIAL MEDIA CONTENT SYNCHRONIZED TO MEDIA PRESENTATION - A computer system provides a method for delivering a video stream to a viewer and delivering, in synchrony with the video stream, social media content created during the current and previous viewings of the video stream by first-time viewers of the video stream. | 05-22-2014 |
20140325555 | METHODS AND SYSTEMS FOR DISTRIBUTING INTERACTIVE CONTENT - Aspects of the present invention relate to methods and systems for controlling the distribution of supplementary content by generating a first control signal when known content is initially detected in a broadcast stream, and after generating the first control signal, generating a second control signal when the detected content is no longer detected in the broadcast stream. The first and second control signals may be used to control the distribution of supplementary content. | 10-30-2014 |
Patent application number | Description | Published |
20120238073 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-20-2012 |
20130065378 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 03-14-2013 |
20130230968 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-05-2013 |
20130230969 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-05-2013 |
20130230970 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-05-2013 |
20130230971 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma processing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing a cover ring above the work piece, the cover ring having at least one perforated region, and at least one non-perforated region; generating a plasma using the plasma source; and processing the work piece using the generated plasma. | 09-05-2013 |
20130230972 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-05-2013 |
20130230973 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing a work piece onto the work piece support, said work piece having a support film, a frame and the substrate; loading the work piece onto the work piece support; applying a tensional force to the support film; clamping the work piece to the work piece support; generating a plasma using the plasma source; and etching the work piece using the generated plasma. | 09-05-2013 |
20130230974 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-05-2013 |
20140094018 | Method for Dicing a Substrate with Back Metal - The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step. | 04-03-2014 |
20140154869 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma processing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing a cover ring above the work piece, the cover ring having at least one perforated region, and at least one non-perforated region; generating a plasma using the plasma source; and processing the work piece using the generated plasma. | 06-05-2014 |
20140242780 | Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 08-28-2014 |