Patent application number | Description | Published |
20090296330 | ELECTRONIC APPARATUS - An electronic apparatus including a main board, an input/output (I/O) board, and a flexible printed circuit (FPC) is provided. The main board includes a first carrier, a central processing unit (CPU), a north bridge unit, a south bridge unit, a basic input/output system (BIOS), a memory module, a clock generator, a graphic unit, and at least one power management. The CPU, the north bridge unit, the south bridge unit, the BIOS, the memory module, the clock generator, the graphic unit, and the power management are disposed on the first carrier. The I/O board includes a second carrier an I/O module and an I/O connector. The I/O module and the I/O connector are disposed on the second carrier. The FPC connects the first carrier and the second carrier. | 12-03-2009 |
20100155939 | CIRCUIT BOARD AND FABRICATION METHOD THEREOF AND CHIP PACKAGE STRUCTURE - A fabrication method of a circuit board is provided. A substrate, a top pad, a base pad electrically connecting the top pad, and a top and a base solder resist layers are provided. The top and the base pads are disposed on two opposite surfaces of the substrate, respectively. The top solder resist layer having a first opening partially exposing the top pad and the base solder resist layer having a second opening partially exposing the base pad are disposed on the two surfaces, respectively. A conductive layer covering the base solder resist layer and the base pad is formed. A plating resist layer having a third opening is formed on the conductive layer. A current is applied to the conductive layer through the third opening for electroplating a pre-bump on the top pad. The plating resist layer and the conductive layer are then removed. | 06-24-2010 |
20110108984 | CIRCUIT BOARD AND CHIP PACKAGE STRUCTURE - A circuit board includes a substrate that has a top surface and a base surface opposite to each other, at least a top pad disposed on the top surface, a top solder resist layer disposed on the top surface and covering a portion of the top pad, and a pre-bump disposed on the top pad. The top solder resist layer has a first opening exposing a portion of the top pad. The pre-bump is located in the first opening and has a protrusion protruding from the top solder resist layer. A maximum width of the protrusion is less than or equal to a width of the top pad. A chip package structure having the circuit board is also provided. | 05-12-2011 |
20110169147 | CHIP PACKAGE STRUCTURE AND PACKAGE SUBSTRATE - A chip package structure for being disposed on a carrier includes a package substrate and a chip. The package substrate includes a laminated layer, a patterned conductive layer, a solder-mask layer, at least one outer pad and a padding pattern. The patterned conductive layer is disposed on a first surface of the laminated layer and has at least one inner pad. The solder resist layer is disposed on the first surface and has at least one opening exposed the inner pad. The outer pad is disposed on the solder resist layer, located within the opening, and is connected with the inner pad. The padding pattern is disposed on the solder resist layer. A height of the padding pattern relative to the first surface is greater than that of the outer pad. The chip is located on a second surface of the laminated layer and electrically connected to the package substrate. | 07-14-2011 |
Patent application number | Description | Published |
20140364982 | METHODS AND SYSTEMS FOR MEDIA FILE MANAGEMENT - Methods and systems for media file management are provided. A music file is provided. The music file is analyzed to obtain a frequency spectrum corresponding to the music file, and at least one beat point on the time line is detected for the music file based on the frequency spectrum. Media data is generated for a plurality of media files in the electronic device based on the music file and a theme defining effects or transitions between the media files, wherein the sequence of the respective effects or transitions, and the corresponding media files which are selected for the respective effects or transitions are determined according to the at least one beat point of the music file. | 12-11-2014 |
20140365483 | METHODS AND SYSTEMS FOR MEDIA FILE MANAGEMENT - Methods and systems for media file management are provided. A music file including music samples is provided. The music file is analyzed to calculate a gain for each music sample. At least one valley point is detected based on the gains of the respective music samples. A first and a second specific valley points are selected from the detected valley point, and respectively setting the first and second specific valley points as a start and an end of a music segmentation. Media data is generated for media files in the electronic device based on the music segmentation. | 12-11-2014 |
20150235669 | MULTIMEDIA PROCESSING APPARATUS, METHOD, AND NON-TRANSITORY TANGIBLE COMPUTER READABLE MEDIUM THEREOF - A multimedia processing apparatus, method, and non-transitory tangible computer readable medium thereof are provided. The multimedia processing apparatus of the present invention includes an interface and a processing unit. The interface receives an audio stream continuously, wherein the audio stream is defined with a time line. The processing unit performs the following operations every a predetermined time interval: (a) deciding a first portion of the audio stream with reference to a time instant of the time line, (b) calculating an energy of the first portion of the audio stream, and (c) calculating a difference between the energy and a previous energy. The processing unit decides a plurality of second portions of the audio stream and decides a beat point for each of the second portions by selecting the time instant that corresponds to the maximum difference within the second portion. | 08-20-2015 |
Patent application number | Description | Published |
20120119298 | INTEGRATED CIRCUITS AND MANUFACTURING METHODS THEREOF - A method of forming an integrated circuit includes forming a plurality of gate structures longitudinally arranged along a first direction over a substrate. A plurality of angle ion implantations are performed to the substrate. Each of the angle ion implantations has a respective implantation angle with respect to a second direction. The second direction is substantially parallel with a surface of the substrate and substantially orthogonal to the first direction. Each of the implantation angles is substantially larger than 0°. | 05-17-2012 |
20150044847 | METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT - A method of forming an integrated circuit comprises forming a first doped region in a substrate using a first angle ion implantation performed on a first side of a gate structure. The gate structure has a length in a first direction and a width in a second direction. The method also comprises forming a second doped region in the substrate using a second angle ion implantation performed on a second side of the gate structure. The first angle ion implantation has a first implantation angle with respect to the second direction and the second angle ion implantation has a second implantation angle with respect to the second direction. Each of the first implantation angle and the second implantation angle is substantially larger than 0° and less than 90°. | 02-12-2015 |
20150200253 | TRANSISTOR DESIGN - Some embodiments of the present disclosure relate to a transistor device formed in a semiconductor substrate containing dopant impurities of a first impurity type. The transistor device includes channel composed of a delta-doped layer comprising dopant impurities of the first impurity type, and configured to produce a peak dopant concentration within the channel. The channel further includes a layer of carbon-containing material overlying the delta-doped layer, and configured to prevent back diffusion of dopants from the delta-doped layer and semiconductor substrate. The channel also includes of a layer of substrate material overlying the layer of carbon-containing material, and configured to achieve steep retrograde dopant concentration profile a near a surface of the channel. In some embodiments, a counter-doped layer underlies the delta-doped layer configured to reduce leakage within the semiconductor substrate, and includes dopant impurities of a second impurity type, which is opposite the first impurity type. | 07-16-2015 |
20160035832 | TRANSISTOR DESIGN - Some embodiments of the present disclosure relate to a transistor device formed in a semiconductor substrate containing dopant impurities of a first impurity type. The transistor device includes channel composed of a delta-doped layer comprising dopant impurities of the first impurity type, and configured to produce a peak dopant concentration within the channel. The channel further includes a layer of carbon-containing material overlying the delta-doped layer, and configured to prevent back diffusion of dopants from the delta-doped layer and semiconductor substrate. The channel also includes of a layer of substrate material overlying the layer of carbon-containing material, and configured to achieve steep retrograde dopant concentration profile a near a surface of the channel. In some embodiments, a counter-doped layer underlies the delta-doped layer configured to reduce leakage within the semiconductor substrate, and includes dopant impurities of a second impurity type, which is opposite the first impurity type. | 02-04-2016 |
Patent application number | Description | Published |
20140139391 | ANTENNA SYSTEM WITH HIGH ISOLATION CHARACTERISTICS - An antenna system includes a first antenna, a second antenna, a band rejection filter, and a dielectric substrate. The band rejection filter is substantially disposed between the first antenna and the second antenna. The band rejection filter includes a protruded ground element, a main branch, a first extension branch, a first additional branch, and a second additional branch. The main branch substantially has a T-shape. The first extension branch is coupled to the main branch. The first additional branch is separated from the main branch, and a first coupling gap is formed between the first additional branch and the main branch. The second additional branch is separated from the main branch, and a second coupling gap is formed between the second additional branch and the first extension branch. The band rejection filter is configured to improve the isolation between the first antenna and the second antenna. | 05-22-2014 |
20150200443 | FLIP-LOCK TYPE ELECTRICAL DEVICE - A flip-lock type electrical device is provided. The flip-lock type electrical device includes a lid part which includes a metal part and a non-metal part, wherein the metal part includes a hinge cap, and one or a plurality of antennas, and one or a plurality of non-metal support material are configured in the hinge cape, and the hinge cape includes an antenna window, and wherein the antenna is grounded to the metal part, a main part, which includes a keyboard part and a base part, and a hinge part, configured to connect the lid part with the main part. | 07-16-2015 |
Patent application number | Description | Published |
20120151002 | System and method for file access and sharing - The present invention is to provide a system including at least one storage device for storing at least one file each having a file name, a home gateway having a routing identification code and connected to the storage device, and a server connected to the home gateway via the Internet for receiving the routing identification code and the file name uploaded by the home gateway. The server stores a user's registration information corresponding to the routing identification code. When a terminal device connected to the server via the Internet uses the registration information to pass the server's verification and thus log in the server, the server transmits the file name to the terminal device and, when receiving a request instruction from the terminal device, then retrieves the file from the storage device by way of the home gateway and then sends the file to the terminal device as requested. | 06-14-2012 |
20120151375 | Method for automatically inserting an embedded toolbar into a web browser directly by way of a gateway device - The present invention is to provide a method applicable to a network system for automatically inserting an embedded toolbar into a web browser directly by way of a gateway device, wherein a toolbar request instruction written in a dynamic scripting language is inserted into a web page message by the gateway device while the web page message is transmitted from a web server to a terminal device (e.g., a personal computer, personal digital assistant, etc.) through the gateway device, so as to enable the web browser of the terminal device to request an embedded toolbar serve for providing an embedded toolbar message according to the toolbar request instruction and then show an embedded toolbar corresponding to the embedded toolbar message on a web page received from the web server according to the web page message. Thus, a user of the terminal device doesn't have to install the embedded toolbar additionally. | 06-14-2012 |
20120259964 | Cloud computing method capable of hiding real file paths - The present invention is to provide a cloud computing method capable of hiding real file paths, which includes the steps of: triggering a web browsing button of an application program and sending a browsing activation signal to a management server by a terminal device; reading a directory list of at least one file from a file server and sending a file browsing program and the directory list to the terminal device by the management server; displaying the directory list via the file browsing program and sending a file processing signal to the management server by the terminal device; downloading from the file server a file specified by the file processing signal and sending the specified file to the terminal device by the management server; and sending the specified file to a third-party application server via the application program and terminating the file browsing program by the terminal device. | 10-11-2012 |
20120278427 | Method for transmitting information between multiple electronic pages - The present invention is to provide a method for transmitting information between multiple electronic pages. The method is applicable to an information transmission system, which includes at least one terminal device, a web server, a toolbar server and an application server. The terminal device obtains a background page from the web server and a toolbar page from the toolbar server and embeds the toolbar page into the background page. When a user clicks on any of at least one application linking object on the toolbar page through the terminal device, the terminal device is able to obtain a status page from the toolbar server and then store page information on the background or toolbar page into the status page and connect to the application server for obtaining an application page corresponding to the application linking object clicked on, so as to enable the application page to access the page information. | 11-01-2012 |