Wen-Jin
Wen-Jin Huang, Hsinchu City TW
Patent application number | Description | Published |
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20080211509 | Battery capacity monitoring system and method of displaying capacity thereof - A system for monitoring the battery capacitor is disclosed. The system comprises an ADC (analog to digital converter), a CPU, a ROM, a clock generator, a SMbus (smart management bus) interface. A series of RTC interrupt signals are generated by the clock generator and feeds to the CPU. When the CPU receives a RTC interrupt, the CPU runs a program in said ROM to calculate the remaining capacity of the battery and stores it into register or RAM according to the digital signal outputs from the ADC, which converts an analog signal of the battery into a digital signal. The SM bus interface then fetches the calculated results from the CPU and displays them by LED in terms of lighting, dark and flashing. | 09-04-2008 |
Wen-Jin Lee, Taipei City TW
Patent application number | Description | Published |
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20100162728 | THERMOELECTRIC NANOWIRE ARRAY WITH LOW HEAT LEAKAGE AND MANUFACTURING METHOD THEREOF - A thermoelectric nanowire array with a low heat leakage and a manufacturing method thereof are described. Nanowire array units separated from each other are formed on a substrate, and an air wall is formed at a region on the substrate free of the nanowire array units. Or, a polymeric material having a low thermal conductivity is combined with a template material so as to form a composite template structure for nanowires to deposit therein. With the design of the air wall or the composite template structure, the thermal reflow phenomenon of the thermoelectric nanowire array is avoided, thereby greatly improving a thermal dissipation efficiency of the thermoelectric nanowire array. | 07-01-2010 |
Wen-Jin Li, Tapei City TW
Patent application number | Description | Published |
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20080248194 | METHOD FOR PRODUCING A COPPER LAYER ON A SUBSTRATE IN A FLAT PANEL DISPLAY MANUFACTURING PROCESS - Methods and apparatus for producing a copper layer on substrate in a flat panel display manufacturing process, where the copper is electrodelessly deposited on a substrate to form a copper interconnection layer. A copper solution containing: CuSO | 10-09-2008 |