Patent application number | Description | Published |
20080293945 | (Pentaphenyl)phenyl Group Containing Compound, Polymeric Derivative Thereof And Method For Forming The Same - The present invention discloses an iridium complex containing a (pentaphenyl)phenyl ligand, having the following general equation: | 11-27-2008 |
20100026168 | Hole Transport Material - The present invention discloses a photo-curable hole-transport material used in a polymer light-emitting diode. The photo-curable hole-transport material comprises at least one first conjugate structure, at least one connecting structure, and at least one second conjugate structure. The first conjugate structure is a triarylamine derivative. The second conjugate structure is a carbazole derivative. The connecting structure is derived from one structure selected from the group consisting of the following or the combination thereof: urethane and urea structures. | 02-04-2010 |
20100105271 | PH Buffering Hybrid Material and the Forming Method Thereof - The present invention discloses a pH buffering hybrid material and the forming method thereof. The pH buffering hybrid material comprises a substrate, a conductive polymer layer on the substrate, and a ZnO nanorod layer produced by deposition of ZnO particles as nucleuses on the conductive polymer layer, and the ZnO particles growing into the ZnO nanorods via hydrothermal reaction. The pH buffering hybrid material has the pH turning ability and the potential of conductivity. | 04-29-2010 |
20120261625 | STABILIZED MONOMER DISPERSION CONTAINING INORGANIC OXIDE NANOPARTICLES WITH HIGH REFRACTIVE INDEX AND ITS PREPARATION - The present invention relates to a stabilized monomer dispersion containing inorganic oxide nanoparticles with high refractive index in which the refractive index of the inorganic oxide nanoparticles is greater than 1.65 and the average particle size of the high refractive inorganic oxide nanoparticles ranges from 1 to 100 nm and its content is in a range of from 1.0% by weight to 10.0% by weight based on the total weight of the monomer dispersion. The present invention also relates to a process for preparing the stabilized monomer dispersion containing high refractive inorganic oxide nanoparticles. | 10-18-2012 |
20130296501 | POLYIMIDOTHIOETHERS-INORGANIC NANOPARTICLE HYBRID MATERIAL, INTERMEDIATE THEREOF AND THEIR PREPARATION - The present invention relates to novel polyimidothioethers-inorganic nanoparticle hybrid material, which exhibit good surface planarity, thermal dimensional stability, tunable refractive index, and high optical transparency upon forming into films. The present invention also relates to polyimidothioethers which is an intermediate for preparing the present hybrid material, and their preparation. | 11-07-2013 |
20140315020 | NANO METAL WIRE AND METHOD FOR MANUFACTURING THE SAME AND NANO LINE - Disclosed is a method of manufacturing a nano metal wire, including: putting a metal precursor solution in a core pipe of a needle; putting a polymer solution in a shell pipe of the needle, wherein the shell pipe surrounds the core pipe; applying a voltage to the needle while simultaneously jetting the metal precursor solution and the polymer solution to form a nano line on a collector, wherein the nano line includes a metal precursor wire surrounded by a polymer tube; chemically reducing the metal precursor wire of the nano line to form a nano line of metal wire surrounded by the polymer tube; and washing out the polymer tube by a solvent. | 10-23-2014 |
Patent application number | Description | Published |
20080297925 | CAMERA MODULE - An exemplary camera module includes a lens module and a lens holder. The lens module is coupled with the lens holder using threads. The thread coupling section between the lens module and the lens holder is filled with a damping oil for sealing the thread coupling section. | 12-04-2008 |
20090021615 | OBJECTIVE HOLDER FOR CAMERA MODULE - An exemplary objective holder for engaging with a PCB substrate having an image sensor and several passive components arranged thereon, includes a base and several continuously connected walls extending from the base. The walls enclose a chamber thereamong for receiving the image sensor and define notches therein for receiving the passive components. | 01-22-2009 |
20090052887 | OBJECTIVE HOLDER FOR CAMERA MODULE - An exemplary objective holder engages with a PCB substrate having an image sensor and several passive components arranged thereon. The passive components surround the image sensor. The objective includes a lens barrel extending from a side of a base, and a plurality of walls extending from an opposite side of the base. The walls enclose a chamber thereamong for receiving the image sensor and define notches therein for receiving the passive components therein. A transparent cover is received in the objective holder between the lens barrel and the chamber. An adhesive is used to connect the objective holder to the PCB substrate. The PCB substrate is rested on the walls. At least one of the notches communicates the chamber to an exterior for outgassing and is sealed by a mass of sealing material after a heating process of the adhesive. | 02-26-2009 |
20090109327 | CAMERA MODULE - A camera module includes a lens module, an image sensor, and a circuit board. The image sensor module is disposed in an image side of the lens module. The circuit board is electronically connected with the image sensor module. The circuit board includes a receiving chamber defined therein. The receiving chamber receives the image sensor module. The lens module is mounted on the circuit board and covers the receiving chamber. The image sensor module is fixed in the receiving chamber that is defined in the circuit board therein. Therefore, a thickness of the camera module along the axis of the camera module is decreased and a volume of the camera module becomes thinner compare with the conventional camera module. | 04-30-2009 |
20110167618 | ELECTRICAL DEVICE MANUFACTURING METHOD - An exemplary electrical device manufacturing method includes the following steps. First, a first electronic module is provided. Second, one or more functions of the electronic module are verified. Third, a support module is provided. Fourth, one or more functions of the support module are verified. Fifth, the first electronic module is attached to the support module so as to form a first integrated module. Sixth, one or more functions of the first integrated module are verified. | 07-14-2011 |
20140048997 | DEVICE FOR ASSEMBLING CAMERA MODULE WITH HIGH QUALITY - A device for assembling a camera module includes a base and a buffer layer. The camera module includes a flexible printed circuit board (FPCB), a lens module positioned on the FPCB, and a stiffener adhering to the FPCB, opposite to the lens module. The lens module includes a first stepped surface facing away from the FPCB. The base includes a supporting surface for supporting the FPCB and defines a holding groove in the supporting surface for holding the lens module. The holding groove forms a second stepped surface for supporting the first stepped surface. The buffer layer is positioned on the second stepped surface and is elastically compressed when the camera module is subjected to a hot pressing process, which secures the stiffener adhering to the FPCB, to provide relief against, and extend the duration of, various pressures applied to the camera module. | 02-20-2014 |