Weizhong
Weizhong Cai, Vista, CA US
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20130334658 | Method And System For Improved Matching For On-Chip Capacitors - Methods and systems for improved matching of on-chip capacitors may comprise a semiconductor die with an on-chip capacitor comprising one or more metal layers. The on-chip capacitor may comprise interdigitated electrically coupled metal fingers. The electrically coupled metal fingers may be arranged symmetrically in the semiconductor die to compensate for non-uniformities in the one or more metal layers. The metal fingers may be arranged with radial symmetry. Metal fingers in a first metal layer may be electrically coupled to metal fingers in a second metal layer. An orientation of metal fingers may be alternated when coupling metal fingers in a plurality of metal layers. The metal fingers may be coupled at the center or the outer edge of the on-chip capacitor. The on-chip capacitor may be configured in a plurality of symmetric sections wherein a boundary between each of the plurality of sections is configured in a zig-zag pattern. | 12-19-2013 |
Weizhong Cai, Carlsbad, CA US
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20150054126 | METHOD AND SYSTEM FOR A METAL FINGER CAPACITOR WITH A TRIPLET REPEATING SEQUENCE INCORPORATING A METAL UNDERPASS - Methods and systems for a metal finger capacitor with a triplet repeating sequence incorporating a metal underpass may comprise repeating triplet capacitors integrated on a semiconductor die. The capacitors may comprise a first set of interconnected metal fingers comprising a first terminal of a first capacitor, a second set of interconnected metal fingers comprising a first terminal of a second capacitor, and a third set of interconnected metal fingers comprising a common node that surrounds the first and second sets of interconnected metal fingers. The common node may comprise a second terminal of the capacitors. A repeating pattern of fingers may be: (third set/second set/third set/first set . . . ). The repeating pattern of metal fingers may be arranged in two parallel rows to mitigate variations in the semiconductor die. The interconnected metal fingers may comprise first and second metal layers formed on the semiconductor die. | 02-26-2015 |
Weizhong Chen, Shanghai CN
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20140307756 | APPARATUS AND METHOD FOR MEASURING CALORIE IN A BEVERAGE - The invention relates to an apparatus and method for measuring calorie in a beverage. The apparatus comprises a chamber, an information obtaining unit, a concentration measuring unit, a processing unit and a display screen. The chamber is configured to contain the beverage. The information obtaining unit is configured to obtain beverage information indicating the volume or the weight of the beverage. The concentration measuring unit configured to measure the concentration of a predetermined substance in the beverage. The processing unit is configured to calculate the overall calorie according to the volume or the weight of the beverage and the measured concentration of the predetermined substance. The display screen is configured to display the overall calorie. | 10-16-2014 |
Weizhong Jiang, Beijing CN
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20150020035 | METHOD, APPARATUS AND MOBILE TERMINAL FOR CONTROLLING AN APPLICATION INTERFACE BY MEANS OF A GESTURE - Various embodiments provide a method, apparatus and mobile terminal for controlling an application interface by means of a gesture. In an exemplary method, a terminal browser can obtain a preset gesture that is inputted into a screen for generating a control point. The control point can be generated according to the preset gesture inputted into the screen. The control point can be associated with one or more preset areas on the screen. The terminal browser can obtain an operation gesture inputted into the screen targeted for the control point and, according to the operation gesture, generate an application interface corresponding to a preset area that the control point is located at. The present disclosure can break through conventional interface operation modes, realizing application interface control via gestures without occupying visible screen space, and adding more freedom for the layout of the application interface on a mobile device. | 01-15-2015 |
Weizhong Peng, Shanghai CN
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20140295182 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR ELECTROCHEMICAL DEVICE - Provided is a PSA tape for an electrochemical device, which can be peeled off rapidly and will not damage adherend materials or the PSA tape itself, or will not leave adhesive residues, when an adhesion defectiveness occurs during the manufacturing and processing of an electrochemical device, especially an electrolytic capacitor or a battery. The PSA tape comprises a substrate and a PSA layer placed on at least one face of the substrate. In the PSA tape, an anchoring strength of the PSA layer to the substrate is 7.0 N/10 mm or more. | 10-02-2014 |
Weizhong Wang, Puyang CN
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20120138182 | PRESSURE REDUCING SYSTEM FOR FUEL GAS AND NATURAL GAS DEWAXING VEHICLE - A pressure reducing system for fuel gas and a natural gas dewaxing vehicle are disclosed. The pressure reducing system ( | 06-07-2012 |
Weizhong Xu, Shanghai CN
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20120292673 | Semiconductor Device and Manufacturing Method Thereof - A semiconductor device and manufacture method thereof is disclosed. The method includes: forming a gate on a substrate; forming a stack including a first material layer, a second material layer, and a third material layer from inner to outer in sequence; etching the stack to form sidewall spacers on opposite sidewalls of the gate; performing ion implantation to form a source region and a drain region; partially or completely removing the remaining portion of the third material layer; performing a pre-cleaning process, wherein all or a portion of the remaining portion of the second material layer is removed; forming silicide on top of the source region, the drain region, and the gate; depositing a stress film to cover the silicide and the remaining portion of the first material layer. According to the above method, the stress proximity technique (SPT) can be realized while avoiding silicide loss. | 11-22-2012 |
Weizhong Yin, Suzhou CN
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20140288625 | BRAIN ELECTRODE LEAD ANCHORING DEVICE - The invention discloses a device for anchoring a brain lead, comprising: an anchoring ring comprising a circular base and a flange joining together where the inner walls forms an aperture defining a passage of a lead, and outer walls engages with a burr hole to secure said ring to the cranium; and a septum contained within the aperture of the anchoring ring, comprising a slit in its center to allow the brain lead to pass through. Due to the fact the septum is already placed in the aperture when the trocar is removed from the brain, the body of the brain lead is immediately clamped by the elastic material of the septum while the tip of trocar is removed from the slit of septum. The friction between the lead body and the elastic material prohibits any movement of the lead caused by handling of lead during or after the operation. Thus the desired placement of electrodes inside the brain is ensured in the entire procedures. Moreover, the septum is contained within the aperture and the top of the septum is below the flange portion of the ring, therefore the device is less protruding comparing with the prior art, thereby causes less discomfort to the patient. | 09-25-2014 |