Patent application number | Description | Published |
20110085613 | MAPPING METHOD AND DEVICE FOR DISCONTINUOUS TRANSMISSION BITS - A modulation mapping method and device for Discontinuous Transmission (DTX) bits are provided. The method includes: receiving binary symbols from a downlink physical channel; replacing symbol values of DTX bits in the binary symbols with symbol values of non-DTX bits, to obtained updated binary symbols; and performing modulation mapping on the updated binary symbols. Using the DTX bits to replicate the non-DTX bits, the DTX bits are supplied to a receiving end as redundant information of the non-DTX bits, such that the performance for demodulating the non-DTX bits by the receiving end is improved. In addition, when the binary symbols on one branch are all DTX bits, modulation mapping is performed on the binary symbols on the same branch and then a real value 0 is output. That is, when the input symbols on only one branch are all DTX bits, the transmission channel for this branch may be closed down alone, and thus the system transmission power is lowered. | 04-14-2011 |
20110188517 | METHOD AND APPARATUS FOR DETERMINING TRANSMIT POWER - A method and an apparatus for determining transmit power are disclosed. The method includes: determining an E-DPDCH gain factor in compressed mode according to the number of E-DPDCH required for initial transmission of data; and determining transmit power of E-DPDCH according to the E-DPDCH gain factor in compressed mode. The E-DPDCH gain factor in compressed mode is determined according to the number of E-DPDCH required for initial transmission of data, and therefore, the E-DPDCH gain factor in compressed mode is determined accurately, the transmit power of E-DPDCH is determined accurately according to the E-DPDCH gain factor, the waste of transmit power of E-DPDCH is reduced, and therefore the system capacity is improved. | 08-04-2011 |
Patent application number | Description | Published |
20110207419 | METHOD AND APPARATUS FOR DETERMINING TRANSMIT POWER - A method and an apparatus for determining transmit power are disclosed. The method includes: determining an E-DPDCH gain factor in compressed mode according to the number of E-DPDCH required for initial transmission of data; and determining transmit power of E-DPDCH according to the E-DPDCH gain factor in compressed mode. The E-DPDCH gain factor in compressed mode is determined according to the number of E-DPDCH required for initial transmission of data, and therefore, the E-DPDCH gain factor in compressed mode is determined accurately, the transmit power of E-DPDCH is determined accurately according to the E-DPDCH gain factor, the waste of transmit power of E-DPDCH is reduced, and therefore the system capacity is improved. | 08-25-2011 |
20120008520 | METHOD AND APPARATUS FOR DETERMINING TRANSMIT POWER - A method and an apparatus for determining transmission power are disclosed. A gain factor of an E-DPDCH in a compressed mode is determined according to the number of E-DPDCH used for initial transmission of data; and the transmission power of the E-DPDCH is determined according to the gain factor of the E-DPDCH in compressed mode. As the gain factor of E-DPDCH in compressed mode is determined according to the number of E-DPDCH for initial transmission of data, the gain factor of the E-DPDCH in compressed mode can be determined accurately, and thus the transmit power of the E-DPDCH can be determined accurately according to the gain factor of the E-DPDCH. Therefore, the waste of transmit power of the E-DPDCH is reduced, and thus the system capacity is improved. | 01-12-2012 |
20120294217 | METHOD AND APPARATUS FOR DETERMINING TRANSMIT POWER - A method and an apparatus for determining transmission power are disclosed. A gain factor of an E-DPDCH in a compressed mode is determined according to the number of E-DPDCHs used for initial transmission of data; and the transmission power of the E-DPDCH is determined according to the gain factor of the E-DPDCH in compressed mode. As the gain factor of E-DPDCH in compressed mode is determined according to the number of the E-DPDCHs for initial transmission of data, the gain factor of the E-DPDCH in compressed mode can be determined accurately, and thus the transmit power of the E-DPDCH can be determined accurately according to the gain factor of the E-DPDCH. Therefore, the waste of transmit power of the E-DPDCH is reduced, and thus the system capacity is improved. | 11-22-2012 |
20140010198 | METHOD AND APPARATUS FOR DETERMINING TRANSMIT POWER - An apparatus is disclosed for determining a gain factor of an E-DPDCH in a compressed mode. In disclosure, the E-DPDCH gain factor in the compressed mode is determined according to the number of E-DPDCHs used for initial transmission of data. With the determined E-DPDCH gain factor, the transmission power of the E-DPDCH can be accordingly determined. As the E-DPDCH gain factor in compressed mode is determined according to the number of the E-DPDCHs for initial transmission of data, the gain factor of the E-DPDCH in compressed mode can be determined accurately, and thus the transmit power of the E-DPDCH can be determined accurately according to the E-DPDCH gain factor in the compressed mode. Therefore, the waste of transmit power of the E-DPDCH is reduced, and thus the system capacity is improved. | 01-09-2014 |
Patent application number | Description | Published |
20140029242 | Backlight Unit And Display Device - Embodiments of the invention provide a backlight unit and a display device. The backlight unit comprises at least one light emitting component and at least one reflection support component, wherein the light emitting component comprises a plurality of element surfaces disposed obliquely and a plurality of luminophore disposed on the element surfaces, the reflection support component comprises a plurality of reflective surfaces disposed obliquely. | 01-30-2014 |
20140063848 | BACKLIGHT MODULE AND DISPLAY DEVICE - According to the present disclosure, there are provided a backlight module and a display device. With the backlight module, a heat dissipating device can be saved, and a light guide plate is prevented from being warped and deformed due to heat generation of a light source. The backlight module comprises a light source, a light guide plate and a side-glowing optical fiber. The side-glowing optical fiber includes: a light emitting section which is fixed to at least one side of the light guide plate; and a light guide section, which extends from the light emitting section to the outside of the light guide plate, and a terminal of which is connected to the light source. | 03-06-2014 |
20140119051 | LIGHT MIXING ELEMENT, LIGHT GUIDE PLATE, BACKLIGHT MODULE AND DISPLAY DEVICE - A light mixing element in a shape of a prism, and a cylinder of the prism of the light mixing element includes a first light-emitting inclined surface, a second light-emitting inclined surface, a bottom surface, a incident surface and a reflecting inclined surface; one side of the second light-emitting inclined surface is connected with one side of the first light-emitting inclined surface to form a top angle; the bottom surface is arranged opposite to the top angle; the incident surface is connected between one side of the bottom surface and the other side of the first light-emitting inclined surface; and the reflecting inclined surface is connected between the other side of the bottom surface and the other side of the second light-emitting inclined surface and arranged opposite to the incident surface and the first light-emitting inclined surface. | 05-01-2014 |
20140167063 | LED CHIP PACKAGING STRUCTURE, ITS MANUFACTURING METHOD, AND DISPLAY DEVICE - A LED chip packaging structure, its manufacturing method, and a display device are disclosed. A conductive unit is formed at two opposite sides of a LED chip unit, and comprises a first conductive layer formed at a side of, and electrically connected to, a first electrode, a second conductive layer formed at a side of, and electrically connected to, a second electrode, and an intermediate isolation layer formed at a side of a GaN layer. The LED chip unit and the conductive unit are connected laterally to form an electrical-connection channel as a whole, without welding a gold wire for the conductive channel as in a traditional LED. Thus, the method is able to reduce the total thickness of the LED chip device, increase the thermal conductivity effect of the LED chip and the overall stability, and improve the light-extraction effect of the surface of the LED chip. | 06-19-2014 |