Patent application number | Description | Published |
20090128481 | INTEGRATED SYSTEM WITH COMPUTING AND IMAGING CAPABILITES - An integrated system comprising both imaging and computing capabilities comprises a light valve and a CPU, as well as other functional members for performing computing and imaging. | 05-21-2009 |
20090140757 | Microdisplay Assemblies and Methods of Packaging Microdisplays - Microdisplay assemblies, methods of packaging microdisplays, and methods of testing microdisplays are disclosed. In accordance with one embodiment, a microdisplay assembly includes a support and a microdisplay disposed on the support. The microdisplay includes a semiconductor workpiece mounted to the support and an optical device region disposed over the semiconductor workpiece. A plurality of contacts is disposed over a portion of the semiconductor workpiece, wherein each of the plurality of contacts comprises a protruding feature. | 06-04-2009 |
20090267223 | MEMS Package Having Formed Metal Lid - A hermetic MEMS device ( | 10-29-2009 |
20110156179 | Silicon Microphone with Integrated Back Side Cavity - An integrated circuit containing a capacitive microphone with a back side cavity located within the substrate of the integrated circuit. Access holes may be formed through a dielectric support layer at the surface of the substrate to provide access for etchants to the substrate to form the back side cavity. The back side cavity may be etched after a fixed plate and permeable membrane of the capacitive microphone are formed by providing etchants through the permeable membrane and through the access holes to the substrate. | 06-30-2011 |
20110158439 | Silicon Microphone Transducer - A capacitive microphone transducer integrated into an integrated circuit includes a fixed plate and a membrane formed in or above an interconnect region of the integrated circuit. A process of forming an integrated circuit containing a capacitive microphone transducer includes etching access trenches through the fixed plate to a region defined for the back cavity, filling the access trenches with a sacrificial material, and removing a portion of the sacrificial material from a back side of the integrated circuit. | 06-30-2011 |
20120036695 | LOW COST WINDOW PRODUCTION FOR HERMETICALLY SEALED OPTICAL PACKAGES - Disclosed embodiments demonstrate batch processing methods for producing optical windows for microdevices. The windows protect the active elements of the microdevice from contaminants, while allowing light to pass into and out of the hermetically sealed microdevice package. Windows may be batch produced, reducing the cost of production, by fusing multiple metal frames to a single sheet of glass. In order to allow windows to be welded atop packages, disclosed embodiments keep a lip of metal without any glass after the metal frames are fused to the sheet of glass. Several techniques may accomplish this goal, including grinding grooves in the glass to provide a gap that prevents fusion of the glass to the metal frames along the outside edges in order to form a lip. The disclosed batch processing techniques may allow for more efficient window production, taking advantage of the economy of scale. | 02-16-2012 |
20130064400 | SILICON MICROPHONE WITH INTEGRATED BACK SIDE CAVITY - An integrated circuit containing a capacitive microphone with a back side cavity located within the substrate of the integrated circuit. Access holes may be formed through a dielectric support layer at the surface of the substrate to provide access for etchants to the substrate to form the back side cavity. The back side cavity may be etched after a fixed plate and permeable membrane of the capacitive microphone are formed by providing etchants through the permeable membrane and through the access holes to the substrate. | 03-14-2013 |
20150205098 | LOW COST WINDOW PRODUCTION FOR HERMETICALLY SEALED OPTICAL PACKAGES - Disclosed embodiments demonstrate batch processing methods for producing optical windows for microdevices. The windows protect the active elements of the microdevice from contaminants, while allowing light to pass into and out of the hermetically sealed microdevice package. Windows may be batch produced, reducing the cost of production, by fusing multiple metal frames to a single sheet of glass. In order to allow windows to be welded atop packages, disclosed embodiments keep a lip of metal without any glass after the metal frames are fused to the sheet of glass. Several techniques may accomplish this goal, including grinding grooves in the glass to provide a gap that prevents fusion of the glass to the metal frames along the outside edges in order to form a lip. The disclosed batch processing techniques may allow for more efficient window production, taking advantage of the economy of scale. | 07-23-2015 |