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Wei-Hung
Wei-Hung Chen, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110134006 | Broadband circularly polarized annular ring slot antenna - A broadband circularly polarized annular ring slot antenna is disclosed, which includes a substrate, an annular ring slot antenna portion located on the upper surface of the substrate, and a microstrip feeding portion located on the lower surface of the substrate. The annular ring slot antenna portion includes a grounding unit, an annular ring slot unit, a central metal unit, a first perturbation metal unit and a second perturbation metal unit. The first perturbation metal unit and the second perturbation metal unit are extended from the grounding unit, towards the central metal unit, respectively. The microstrip feeding portion includes a vertical feeding unit, a bent feeding unit and a rectangular microstrip unit. | 06-09-2011 |
| 20120108741 | AMBIENT-TEMPERATURE SELF-CURABLE AND FLUORINE CONTAINING AQUEOUS-BASED POLYURETHANE (PU) DISPERSION AND METHOD OF MANUFACTURING THE SAME AND ITS MODIFIED COATED FILM APPLICATIONS - An ambient-temperature self-curable fluorine containing aqueous-based polyurethane dispersion, a method of manufacturing the same and its modified coated film applications are provided. The ambient-temperature self-curable fluorine containing aqueous-based PU dispersion includes water, an ambient temperature cross-linking agent and a fluorine containing PU resin dispersed in water phase. The fluorine containing PU resin includes | 05-03-2012 |
Wei-Hung Chen, Tamsui TW
| Patent application number | Description | Published |
|---|---|---|
| 20100092689 | Long-lasting water-repellent textile treatment process using an ambient temperature curable polydimethylsiloxane-containing polyurethane PU system - A long-lasting water-repellency textile application that uses a polydimethylsiloxane (PDMS)-containing polyurethane (PU) involves a manufacturing process of NCO-terminated PU prepolymer of PDMS diols and polyisocyanate with a catalyst for forming a moisture-curable PDMS-containing PU oligomer, or becoming an UV-curable PDMS-containing PU oligomer after a chemical reaction takes place. The PU oligomer owns PDMS moiety with water-repellent properties. The moisture- or UV-curable PU with NCO and acrylate end-groups can create cross-linked polymeric networks between fibers of textiles by exposing to the air or UV-radiation. The final cross-linked PDMS-containing PU treated textile demonstrates long-lasting water-repellent properties with an excellent soft hand feel and a breathable feature. Furthermore, the textile water-repellent treatment is cost-effective, and most importantly these two different curing processes could be carried out at ambient temperature without requiring any waste water discharge. Therefore, these textile water repellent treatments are considered as environmental friendly green processes. | 04-15-2010 |
Wei-Hung Chen, New Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120277400 | Modified Polyesters and Processes for Manufacturing the Same - Disclosed herein are processes for manufacturing modified polyesters. An esterification reaction of diacid, diol and a branching agent having at least three carboxyl groups is carried out at a temperature of about 180 to 300° C. and a pressure of about 1 to 4 bar to obtain a product of esterification. A polycondensation reaction of the product of esterification and a diamine is carried out at a pressure below about 0.01 bars to obtain the modified polyester. | 11-01-2012 |
Wei-Hung Chen, Shanghai CN
| Patent application number | Description | Published |
|---|---|---|
| 20110239128 | DATA TRANSMISSION METHOD AND DATA TRANSMISSION SYSTEM - The present invention relates to a data transmission method and system. The system includes a connection module for setting up a transmission path between a computer end and a device end, a display unit, a capture unit disposed at the device end for capturing an image of the screen including an icon, and a computing unit for recognizing the image to determine that the icon corresponding to an object is shown on the image. The method includes the steps of: displaying a screen including an icon at the computer end; capturing an image including an icon of the screen; recognizing the image to determine that the icon corresponding to an object is shown on the image; and transmitting the object from the computer end to the device end through the transmission path. The present invention does not require complicated operation at the computer end and improves convenience for the application. | 09-29-2011 |
| 20130033426 | HANDHELD PROJECTOR AND PROJECTION METHOD THEREOF - The invention provides a handheld projector and a projection method thereof. The handheld projector includes a projection module, a control module, a detecting module and a steering module. The control module drives the projection module to project an image towards an object, which includes a cursor. The detecting module generates a shift signal according to shift of the handheld projector, and transmits the shift signal to the control module. The control modules drives the steering module to rotate the projection module towards an opposite direction of the shift of the handheld projector, so as to make the image projected by the projection module stay in a fixed position of the object. Through the invention, projected image is not easily shocked, and the user only need move the handheld projector when change of the cursor position is desired, and thus operation convenience is greatly enhanced. | 02-07-2013 |
Wei-Hung Chen, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100150105 | Apparatus And Method For Splicing Multimedia Session On Communication Networks - The present invention relates to an apparatus and method for splicing multimedia session on communication networks. The apparatus comprises a handoff manager, a session migration manager and a session splicing module. The handoff manager monitors whether a mobile host is roaming to other subnets or not, and acquires a new IP address and issues a control signal when a handoff event is triggered. When a user triggers a migration action, the session migration manager, based on the monitoring status of an ongoing session, sends a state message to a target host for performing session migration, enables a media player, and issues another control signal. The session splicing module respectively receives the two control signals, and performs a corresponding session splicing for each control signal to persist session connection. | 06-17-2010 |
| 20120297222 | BRIDGES AND OPERATION METHODS THEREFOR - A bridge is provided. The bridge is coupled between a host and a peripheral apparatus and includes a connector, a power circuit, and a bridge circuit. The connector connects the host and comprises a power pin. The power circuit converts a supplying power to a driving voltage when the power circuit is enabled. The bridge circuit is powered by the driving voltage and performs a data transmission procedure between the host and the peripheral apparatus. An enabling terminal of the power circuit is coupled to the power pin to receive an enabling signal transmitted by the host through the power pin. The power circuit is enabled to provide the driving voltage when the enabling signal is provided with a first potential. The power circuit is disabled to stop providing the driving voltage when the enabling signal is provided with a second potential. | 11-22-2012 |
Wei-Hung Chen, Chia-Yi TW
| Patent application number | Description | Published |
|---|---|---|
| 20110070192 | Method of preparation of novel nucleoside analogs and uses - Processes for the preparation of racemic and optically active nucleoside analogs of formula (A) are described. These compounds are useful as anti-infective agents, antisense therapeutic agents and hybridization assay probes. | 03-24-2011 |
Wei-Hung Chung, New Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120208430 | LOADING/UNLOADING MODULE OF ELECTRIC TOY GUN - In a loading/unloading module of an electric toy gun, and the toy gun includes a gun body, a piston shell installed to the gun body, and a loading/unloading module corresponding to the piston shell, and the loading/unloading module is provided for loading/unloading the piston shell to/from the gun body, and the loading/unloading module includes a fixing assembly, and the fixing assembly includes a receiving element of the piston shell installed to the piston shell and a latching element movably installed to the gun body and corresponding to the receiving element, such that the latching element can be turned to latch with the receiving element to fix the piston shell to the gun body, and the toy gun has a high structural stability after its assembling and can be assembled and disassembled easily. | 08-16-2012 |
Wei-Hung Hsu, Kuntien Hsiang TW
| Patent application number | Description | Published |
|---|---|---|
| 20120126016 | PLANAR ANTENNA HAVING RFID ELECTRIC TAGS - A planar antenna having RFID electric tags comprises: a substrate ( | 05-24-2012 |
| 20120127036 | CAPACITIVE ANTENNA STRUCTURE - A capacitive antenna structure comprises a substrate and a sheet-shaped capacitor. The substrate has a radiating metal layer and a grounding metal layer thereon. The radiating metal layer has a first groove to expose the front surface of the substrate, the first groove having a signal feeding hole therein and having a second groove on the edge. The grounding metal layer has a third groove on the edge to expose the substrate, the third groove being opposite to the second groove, the third groove having a first contact and a second contact on two sides respectively to electrically connect to the capacitor. The third groove may connect to a fourth groove to expose the substrate, the fourth groove having a signal transmission line therein, and the signal transmission line having the signal feeding hole to connect a cable. | 05-24-2012 |
Wei-Hung Huang, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090313523 | ENCODERS AND METHODS FOR ENCODING DIGITAL DATA WITH LOW-DENSITY PARITY CHECK MATRIX - A method for encoding digital data with a low-density parity check (LDPC) matrix includes: indirectly storing a non-regular portion of the LDPC matrix by storing a plurality of indices corresponding to a plurality of non-zero sub-matrices of the non-regular portion, and by storing a plurality of distance/location parameters respectively corresponding to numbers of zero sub-matrices between adjacent non-zero sub-matrices of the non-regular portion or respectively corresponding to distances between adjacent non-zero sub-matrices of the non-regular portion; generating at least one address according to at least one distance/location parameter; accessing information bits corresponding to the address; and recovering at least one element of the LDPC matrix according to at least one index and the information bits to encode the digital data according to the LDPC matrix. | 12-17-2009 |
| 20100326357 | NOZZLE AND FURNACE HAVING THE SAME - A nozzle and a furnace having the same are provided. The furnace has a high vacuum fitting used to assemble the nozzle to the furnace. The nozzle includes a first tube part and a second tube part connecting to the first tube part. In addition, an immobilization device is disposed on a surface of the first tube part. The immobilization device is corresponding to an o-ring of the high vacuum fitting and sheathed by the o-ring to steadily immobilize the nozzle to the furnace. | 12-30-2010 |
| 20120185758 | INFORMATION BROWSING METHOD FOR PARTITIONING CONTENTS OF PAGE AND ASSIGNING IDENTIFIERS TO DATA PARTITIONS AND RELATED MACHINE-READABLE MEDIUM THEREOF - An information browsing method includes: partitioning contents of a page into a plurality of first data partitions by analyzing the contents of the page; assigning a plurality of first identifiers to the first data partitions, respectively; driving a display screen according to at least the first data partitions; and when receiving a partition selection input, determining a selected first data partition according to a first identifier corresponding to the partition selection input, wherein the selected first data partition is assigned with the first identifier. | 07-19-2012 |
Wei-Hung Hung, New Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20130096780 | METHOD OF ACTUATING EXTERNAL ACTIVE SAFETY SYSTEM FOR VEHICLE - A method of actuating an external active safety system for a vehicle is used for cushioning the impact on the vehicle generated in an accident to effectively reduce injury and death as well as vehicle damage rates after an accident. The present invention mainly installs multiple sets of shock absorption devices (for example, airbags) outside the vehicle, for example, on front and rear bumpers, respectively, and the sets of shock absorption devices is able to function in advance in a segmental manner, so that the shock absorption devices installed outside the vehicle function before and during a collision in a segmental manner, so as to cushion an impact on the vehicle body when impacting or being impacted, and the shock absorption devices have an automatic release function, which, when activated, automatically releases an inflated condition of airbags in a very short time. | 04-18-2013 |
Wei-Hung Kuo, Changhua County TW
| Patent application number | Description | Published |
|---|---|---|
| 20110148743 | PIXEL ARRAY - A pixel array including scan lines, data lines and pixels is provided. The data lines and the scan lines are intersected so as to define sub-pixel regions arranged in array. Each pixel is disposed in a pixel region including (m×n) sub-pixel regions, wherein m is a positive integral and n is a positive integral larger than one. Each pixel includes a plurality of sub-pixels, wherein each sub-pixel includes an active device, a pixel electrode and a storage capacitor. At least a portion of the storage capacitors of the sub-pixels within the same pixel is concentrically disposed in one of the sub-pixel regions. | 06-23-2011 |
| 20110148781 | TOUCH DISPLAY PANEL - A touch display panel including a first substrate, a second substrate, a light shielding pattern layer, a touch sensing layer and a display medium is provided. The light shielding pattern layer is disposed on the first substrate or the second substrate. Pixel units are defined by the light shielding pattern layer, each pixel unit has a pixel edge length, and each pixel unit is disposed corresponding to one of the pixel structures. The touch sensing layer is disposed on the second substrate and has a plurality of first touch series and a plurality of second touch series. Each first touch series and each touch series respectively have mesh touch pads serially connected to each other. Each mesh touch pad has a plurality of grid patterns, each grid pattern has a grid edge length, and the grid edge length is ⅛˜⅗ of the pixel edge length. | 06-23-2011 |
Wei-Hung Lai, Tainan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100051150 | BAG WITH A MECHANICAL MUSIC DEVICE - A bag includes a bag body, a mounting component, and a mechanical music device. The bag body defines a receiving space, and has a bag wall formed with a sound hole therethrough. The mounting component is disposed in the receiving space. The mechanical music device is mounted in the receiving space, and includes a case and a music producing unit. The case is mounted on the mounting component, and includes a first case wall, a second case wall, and a connecting wall. The first and second case walls and the connecting wall cooperate to define an accommodating space. The case has a sound port that is in spatial communication with the accommodating space. The music producing unit is disposed in the case for producing music, and includes a base, a cylinder, a comb, a spring motor, and a knob. | 03-04-2010 |
Wei-Hung Lin, Hsin-Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20080210459 | WARPAGE-PROOF CIRCUIT BOARD STRUCTURE - The invention provides a warpage-proof circuit board structure, including: an inner layer circuit board; at least one dielectric layer formed on at least one surface of the inner layer circuit board; at least one first groove formed in the at least one dielectric layer corresponding in position thereto; a solder mask formed on the surface of the dielectric layer, a second groove formed in the solder mask and corresponding in position to the first groove formed in the dielectric layer; and a metal frame formed in the first and second grooves and protruding from the surface of the solder mask, thereby strengthening the circuit board to prevent it from warping in thermal processing and further using the metal frame as a heat-dissipating means for the package structure. | 09-04-2008 |
Wei-Hung Lin, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100091469 | STORAGE APPARATUS - A storage apparatus including a circuit board, a first flash memory, a first golden finger, a control unit, and a supporting component is provided. The circuit board has a first surface and a second surface. The first flash memory is disposed on the circuit board. The first golden finger and the control unit are disposed on an end of the circuit board, in which the first golden finger is disposed on the first surface, and the control unit is disposed on the second surface, and the control unit is substantially on the backside of the first golden finger. The control unit is electrically connected with the first memory and the first golden finger. The supporting component is used for supporting the circuit board. | 04-15-2010 |
| 20100110643 | FLASH DRIVE AND HOUSING ASSEMBLY THEREOF - A flash drive and a housing assembly thereof is provided. The housing assembly comprises a housing, a base and a rotating mechanism. The housing has a first opening, a second opening, and a space, the first opening is situated at a side surface of the housing, and the second opening is situated on a top surface of the housing. The base is used for accommodating a storage device which has a connecting member, the base is movably disposed in the space and has a slot facing the second opening. The rotating mechanism is disposed at the second opening and mounted to the housing, the rotating mechanism has a protrusion portion movably engaged in the slot. When the rotating mechanism rotates relative to the housing, the protrusion portion moves along the slot and drives the base to reciprocate between a first position and a second position. | 05-06-2010 |
| 20120020151 | STORAGE APPARATUS AND METHOD OF MANUFACTURING THE SAME - A storage apparatus including a circuit board, a control circuit element, a terminal module and a storage circuit element is provided. The circuit board includes a first surface, a second surface, a connect part, openings, metal contacts and metal units. The openings pass through the circuit board from the first surface to the second surface and the metal contacts are exposed on the first surface. The terminal module is disposed on the first surface and has elastic terminals and each of the elastic terminals has a first contact part and a second contact part. The first contact parts respectively contact with the metal contacts and the second contact parts respectively pass through the openings to protrude from the second surface. The metal units are disposed on the second surface and located between the openings and the connect part. Accordingly, the volume of the storage apparatus can be reduced. | 01-26-2012 |
Wei-Hung Lin, Xinfeng Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20120018494 | Thermal Compress Bonding - A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together. | 01-26-2012 |
| 20120021183 | Forming Low Stress Joints Using Thermal Compress Bonding - A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer. | 01-26-2012 |
| 20120267423 | Methods and Apparatus for Thin Die Processing - A vacuum tip and methods for processing thin integrated circuit dies. A vacuum tip for attaching to an integrated circuit die is disclosed comprising a vacuum port configured to connect to a vacuum supply on an upper surface and having a bottom surface; and at least one vacuum hole extending through the vacuum tip and exposed at the bottom surface of the vacuum tip; wherein the vacuum tip is configured to physically contact a surface of an integrated circuit die. Methods for processing integrated circuit dies are disclosed. | 10-25-2012 |
| 20120299181 | Package-on-Package Process for Applying Molding Compound - A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film. | 11-29-2012 |
| 20130062761 | Packaging Methods and Structures for Semiconductor Devices - Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL. | 03-14-2013 |
| 20130089952 | Packaging Process Tools and Packaging Methods for Semiconductor Devices - Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region. | 04-11-2013 |
| 20130093076 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME - A method of a semiconductor package includes providing a substrate having a conductive trace coated with an organic solderability preservative (OSP) layer, removing the OSP layer from the conductive trace, and then coupling a chip to the substrate to form a semiconductor package. | 04-18-2013 |
| 20130095608 | Methods for Forming 3DIC Package - A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening. | 04-18-2013 |
| 20130095611 | Packaging Methods for Semiconductor Devices - Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates. | 04-18-2013 |
Wei-Hung Liu, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20090135147 | INPUT METHOD AND CONTENT DISPLAYING METHOD FOR AN ELECTRONIC DEVICE, AND APPLICATIONS THEREOF - In an input method and an input system for an electronic device, an electronic device having input functionality and content displaying functionality, and a content displaying method and a displaying system for an electronic device, the electronic device is provided with a sensing screen, and the input method includes the following steps: displaying a plurality of virtual keys; receiving an input signal; displaying a corresponding enlarged virtual key on the sensing screen; and detecting whether there is an input of a confirm input signal, and outputting a virtual key code corresponding to the confirm input signal if affirmative. | 05-28-2009 |
Wei-Hung Liu, New Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120042159 | APPLICATION METHOD FOR INTEGRATING HETEROGENEOUS OPERATING SYSTEMS BASED ON THE SAME SYSTEM KERNEL - An application method for integrating heterogeneous operating systems based on the same system kernel is disclosed. The application method includes opening a master virtual console corresponding to a master operating system, opening a slave virtual console corresponding to a slave operating system in the master virtual console, and establishing a share information area for the master operating system and the slave operating system and switching to slave virtual console to operate on the slave operating system. | 02-16-2012 |
Wei-Hung Wu, Hsin-Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20130051070 | LED LIGHT BAR AND BACKLIGHT MODULE - A light-emitting diode light bar includes a printed circuit board and a light-emitting diode. The printed circuit board has a protective layer, a first signal line, and a first extension line. The LED is disposed on the first signal line and the first extension line. The protective layer is formed above the first signal line and the first extension line, and has an opening that exposes a portion of the first signal line, and a portion of the extension line, such that a first exposed length of the first signal line is substantially equal to a second exposed length of the first extension line. | 02-28-2013 |