Wei-Hung
Wei-Hung Chang, Taichung City TW
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20140109343 | AUTO-CLOSING DEVICE FOR A SLIDING DOOR - An auto-closing device has a base, a cylinder, a slider, a spring and an adjusting device. The adjusting device is connected to an end of the spring opposite to the slider and has an adjusting frame and an adjusting bolt. The adjusting frame has a first end connected securely to the spring and a second end provided with a threaded hole. The adjusting bolt is mounted rotatably on the base and is screwed into the threaded hole in the adjusting frame. Accordingly, when the adjusting bolt is rotated, the adjusting frame is moved relative to the body so that the pulling force provided by the spring is adjusted to fit with different door panels with different weights. | 04-24-2014 |
20140109635 | LOCK ASSEMBLY - A lock assembly has a body, a latching device, a linking device and a locking mechanism. The linking device is connected to and driven by the latching device. The locking mechanism is moveably mounted in the body and has a bolt base, a pushing element, a lever element and a locking bolt. The bolt base is mounted slidably in the body. The locking bolt is slidably mounted on the bolt base and is driven to retract into or completely extends out from the body with the transmission of the pushing element and the lever element. | 04-24-2014 |
20140265362 | MAGNETIC LOCKING APPARATUS - A magnetic locking apparatus has a body and an engaging mount. The body has a casing, a bolt and a driving device. The bolt is retractably mounted in the casing and has a connecting section, an engaging section and at least one magnetic element. The driving device is mounted in the casing and has a handle mount. The engaging mount faces the casing and the bolt and has a locking hole and at least one magnetic element mounted at two sides of the locking hole to attract the at least one magnetic element of the bolt. | 09-18-2014 |
20150033504 | HYDRAULIC HINGE BUFFER ASSEMBLY FOR A DOOR - A hydraulic hinge buffer assembly for a door has a fastening device, a buffering device and a clamping device. The fastening device has a holding mount and a pivot block. The buffering device is mounted in the fastening device and has a pivot pin and a piston element. The pivot pin has an abutting face and at least one holding hook. The piston element is mounted between the holding mount and the pivot pin and has a pushing piston. The pushing piston has a pressing face selectively abutting the abutting face and at least one engaging hook axially formed on and protruding from the pressing face and engaging with the at least one holding hook. The clamping device is connected to the buffering device to rotate relative to the fastening device and has two clamping panels. | 02-05-2015 |
20150096149 | SLIDING-DOOR HANDLE DEVICE - A sliding-door handle device has an outside handle and an inside handle. The outside handle is mounted on and abuts the sliding door and has a connecting board and a pulling tab. The connecting board is shaped as an elongated strip and abuts an outer side of the sliding door. The pulling tab is formed on and protrudes perpendicularly from a front end of the connecting board such that the outside handle is formed in a T shape. The pulling tab has a pulling end and a pressing end. The inside handle is detachably connected to the outside handle via the sliding door to connect the outside handle with the sliding door and has an assembling mount. | 04-09-2015 |
20150259962 | MULTIFUNCTION FRAME FOR AN ELECTRIC SLIDING DOOR - A multifunction frame for an electric sliding door has a body, a holding segment, a connecting segment, a positioning rod and a hub frame. The body has a mounting recess, a rear opening and two side holes. The rear opening and the side holes communicate with the mounting recess. The holding segment is formed on and protrudes from a bottom of the body and has two holding hooks. The connecting segment is formed on and protrudes from a top of the body and has at least one connecting hook. The positioning rod is formed on and protrudes from a front side of the body near the top of the body. The hub frame is formed on and protrudes from the front side of the body below the positioning rod and has a front opening formed through a front side of the hub frame. | 09-17-2015 |
Wei-Hung Chen, New Taipei TW
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20130209699 | Long-lasting water-repellent textile treatment process using an ambient temperature curable polydimethylsiloxane-containing polyurethane PU system - A long-lasting water-repellency textile application that uses a polydimethylsiloxane (PDMS)-containing polyurethane (PU) involves a manufacturing process of NCO-terminated PU prepolymer of PDMS diols and polyisocyanate with a catalyst for forming a moisture-curable PDMS-containing PU oligomer, or becoming an UV-curable PDMS-containing PU oligomer after a chemical reaction takes place. The PU oligomer owns PDMS moiety with water-repellent properties. The moisture- or UV-curable PU with NCO and acrylate end-groups can create cross-linked polymeric networks between fibers of textiles by exposing to the air or UV-radiation. The final cross-linked PDMS-containing PU treated textile demonstrates long-lasting water-repellent properties with an excellent soft hand feel and a breathable feature. Furthermore, the textile water-repellent treatment is cost-effective, and most importantly these two different curing processes could be carried out at ambient temperature without requiring any waste water discharge. Therefore, these textile water repellent treatments are considered as environmental friendly green processes. | 08-15-2013 |
Wei-Hung Chen, Taipei TW
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20100150105 | Apparatus And Method For Splicing Multimedia Session On Communication Networks - The present invention relates to an apparatus and method for splicing multimedia session on communication networks. The apparatus comprises a handoff manager, a session migration manager and a session splicing module. The handoff manager monitors whether a mobile host is roaming to other subnets or not, and acquires a new IP address and issues a control signal when a handoff event is triggered. When a user triggers a migration action, the session migration manager, based on the monitoring status of an ongoing session, sends a state message to a target host for performing session migration, enables a media player, and issues another control signal. The session splicing module respectively receives the two control signals, and performs a corresponding session splicing for each control signal to persist session connection. | 06-17-2010 |
20120297222 | BRIDGES AND OPERATION METHODS THEREFOR - A bridge is provided. The bridge is coupled between a host and a peripheral apparatus and includes a connector, a power circuit, and a bridge circuit. The connector connects the host and comprises a power pin. The power circuit converts a supplying power to a driving voltage when the power circuit is enabled. The bridge circuit is powered by the driving voltage and performs a data transmission procedure between the host and the peripheral apparatus. An enabling terminal of the power circuit is coupled to the power pin to receive an enabling signal transmitted by the host through the power pin. The power circuit is enabled to provide the driving voltage when the enabling signal is provided with a first potential. The power circuit is disabled to stop providing the driving voltage when the enabling signal is provided with a second potential. | 11-22-2012 |
Wei-Hung Chen, Chia-Yi TW
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20110070192 | Method of preparation of novel nucleoside analogs and uses - Processes for the preparation of racemic and optically active nucleoside analogs of formula (A) are described. These compounds are useful as anti-infective agents, antisense therapeutic agents and hybridization assay probes. | 03-24-2011 |
Wei-Hung Chen, Tamsui TW
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20100092689 | Long-lasting water-repellent textile treatment process using an ambient temperature curable polydimethylsiloxane-containing polyurethane PU system - A long-lasting water-repellency textile application that uses a polydimethylsiloxane (PDMS)-containing polyurethane (PU) involves a manufacturing process of NCO-terminated PU prepolymer of PDMS diols and polyisocyanate with a catalyst for forming a moisture-curable PDMS-containing PU oligomer, or becoming an UV-curable PDMS-containing PU oligomer after a chemical reaction takes place. The PU oligomer owns PDMS moiety with water-repellent properties. The moisture- or UV-curable PU with NCO and acrylate end-groups can create cross-linked polymeric networks between fibers of textiles by exposing to the air or UV-radiation. The final cross-linked PDMS-containing PU treated textile demonstrates long-lasting water-repellent properties with an excellent soft hand feel and a breathable feature. Furthermore, the textile water-repellent treatment is cost-effective, and most importantly these two different curing processes could be carried out at ambient temperature without requiring any waste water discharge. Therefore, these textile water repellent treatments are considered as environmental friendly green processes. | 04-15-2010 |
Wei-Hung Chen, Taichung TW
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20150204865 | SENSING METHOD - A sensing method, comprising steps of causing a first molecule to be adjacent to one of a plurality of first nanoparticles spacedly disposed on a detachable chip; adding a target object to contact the first molecule; and measuring a spectral signal, wherein a variation of the spectral signal of the plurality of first nanoparticles occurs when the target object demonstrates a first specific binding with the first molecule. | 07-23-2015 |
Wei-Hung Chen, New Taipei City TW
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20120277400 | Modified Polyesters and Processes for Manufacturing the Same - Disclosed herein are processes for manufacturing modified polyesters. An esterification reaction of diacid, diol and a branching agent having at least three carboxyl groups is carried out at a temperature of about 180 to 300° C. and a pressure of about 1 to 4 bar to obtain a product of esterification. A polycondensation reaction of the product of esterification and a diamine is carried out at a pressure below about 0.01 bars to obtain the modified polyester. | 11-01-2012 |
20130132746 | BRIDGING DEVICE AND POWER SAVING METHOD THEREOF - A bridging device and a power saving method thereof are disclosed. The disclosed bridging device includes a connector, a connection detector and a bridging chip. The connector is operative to connect to a host and includes a power pin and a command pin. The connection detector is coupled to the power pin to determine whether the connector is floating, and, outputs a linked signal when the connection is non-floating. The bridging chip is coupled to the command pin and the connection detector. When the bridging chip receives a power saving command transferred from the host via the command pin and the linked signal transferred from the connection detector, the bridging chip executes a power saving operation. | 05-23-2013 |
20140175697 | Modified Long Chain Polyamide - A modified long chain polyamide is provided. The modified long chain polyamide is polymerized by monomers comprising a long-aliphatic-chain monomer, and equimolar of an aromatic diacid and polyethyleneoxy diamine. A fiber made from the modified long chain polyamide is also provided. | 06-26-2014 |
20140179189 | Nylon Composite Fiber and Fabric Thereof - A nylon composite fiber and a nylon fabric thereof are provided. This nylon composite fiber is a dual-component fiber, and contains a long chain polyamide and a polyether modified polyamide polyamide. One monomer of the long chain polyamide contains a long aliphatic chain. One monomer of the polyether modified polyamide contains a polyether chain. | 06-26-2014 |
20150368395 | MODIFIED POLYESTERS AND PROCESSES FOR MANUFACTURING THE SAME - Disclosed herein are processes for manufacturing modified polyesters. An esterification reaction of diacid, diol and a branching agent having at least three carboxyl groups is carried out at a temperature of about 180 to 300° C. and a pressure of about 1 to 4 bar to obtain a product of esterification. A polycondensation reaction of the product of esterification and a diamine is carried out at a pressure below about 0.01 bars to obtain the modified polyester. | 12-24-2015 |
Wei-Hung Chen, Taipei City TW
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20110134006 | Broadband circularly polarized annular ring slot antenna - A broadband circularly polarized annular ring slot antenna is disclosed, which includes a substrate, an annular ring slot antenna portion located on the upper surface of the substrate, and a microstrip feeding portion located on the lower surface of the substrate. The annular ring slot antenna portion includes a grounding unit, an annular ring slot unit, a central metal unit, a first perturbation metal unit and a second perturbation metal unit. The first perturbation metal unit and the second perturbation metal unit are extended from the grounding unit, towards the central metal unit, respectively. The microstrip feeding portion includes a vertical feeding unit, a bent feeding unit and a rectangular microstrip unit. | 06-09-2011 |
20120108741 | AMBIENT-TEMPERATURE SELF-CURABLE AND FLUORINE CONTAINING AQUEOUS-BASED POLYURETHANE (PU) DISPERSION AND METHOD OF MANUFACTURING THE SAME AND ITS MODIFIED COATED FILM APPLICATIONS - An ambient-temperature self-curable fluorine containing aqueous-based polyurethane dispersion, a method of manufacturing the same and its modified coated film applications are provided. The ambient-temperature self-curable fluorine containing aqueous-based PU dispersion includes water, an ambient temperature cross-linking agent and a fluorine containing PU resin dispersed in water phase. The fluorine containing PU resin includes | 05-03-2012 |
Wei-Hung Chen, Shanghai CN
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20110239128 | DATA TRANSMISSION METHOD AND DATA TRANSMISSION SYSTEM - The present invention relates to a data transmission method and system. The system includes a connection module for setting up a transmission path between a computer end and a device end, a display unit, a capture unit disposed at the device end for capturing an image of the screen including an icon, and a computing unit for recognizing the image to determine that the icon corresponding to an object is shown on the image. The method includes the steps of: displaying a screen including an icon at the computer end; capturing an image including an icon of the screen; recognizing the image to determine that the icon corresponding to an object is shown on the image; and transmitting the object from the computer end to the device end through the transmission path. The present invention does not require complicated operation at the computer end and improves convenience for the application. | 09-29-2011 |
20130033426 | HANDHELD PROJECTOR AND PROJECTION METHOD THEREOF - The invention provides a handheld projector and a projection method thereof. The handheld projector includes a projection module, a control module, a detecting module and a steering module. The control module drives the projection module to project an image towards an object, which includes a cursor. The detecting module generates a shift signal according to shift of the handheld projector, and transmits the shift signal to the control module. The control modules drives the steering module to rotate the projection module towards an opposite direction of the shift of the handheld projector, so as to make the image projected by the projection module stay in a fixed position of the object. Through the invention, projected image is not easily shocked, and the user only need move the handheld projector when change of the cursor position is desired, and thus operation convenience is greatly enhanced. | 02-07-2013 |
Wei-Hung Chen, Millburn, NJ US
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20140086364 | APPARATUS AND METHODS FOR QUADRATURE CLOCK SIGNAL GENERATION - Apparatus and methods for quadrature clock signal generation are provided. In certain implementations, a quadrature clock signal generator includes a sine-shaping filter and a polyphase filter. The sine-shaping filter can receive an input clock signal such as a square or rectangular wave and can filter the input clock signal to generate a sinusoidal clock signal. Additionally, the polyphase filter can use the sinusoidal clock signal to generate in-phase (I) and quadrature-phase (Q) clock signals, which can have a phase difference of about ninety degrees. In certain configurations, the in-phase and quadrature-phase clock signals generated by the polyphase filter can be buffered by a buffer circuit to generate in-phase and quadrature-phase sinusoidal reference clock signals suitable for use in a clock and data recover (CDR) system. | 03-27-2014 |
Wei-Hung Chin, New Taipei City TW
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20150185947 | METHOD AND ELECTRONIC DEVICE FOR MANAGING EVENT NOTIFICATION - A method and an electronic device for managing an event notification are provided. The method for managing the event notification is adapted for the electronic device having a touch screen, and the method includes following steps. At least one event triggered through at least one application program is detected. A notification of each of the at least one event is displayed on the touch screen. A first touch operation performed on one of the notifications is received. According to the received first touch operation, deletion of the one of the notifications is prompted, and a blocking option is displayed. A second touch operation performed on the blocking option is received, and an event notification function associated with the one of the notifications in the application program corresponding to the one of the notifications is disabled according to the received second touch operation within a set period. | 07-02-2015 |
Wei-Hung Chung, New Taipei City TW
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20120208430 | LOADING/UNLOADING MODULE OF ELECTRIC TOY GUN - In a loading/unloading module of an electric toy gun, and the toy gun includes a gun body, a piston shell installed to the gun body, and a loading/unloading module corresponding to the piston shell, and the loading/unloading module is provided for loading/unloading the piston shell to/from the gun body, and the loading/unloading module includes a fixing assembly, and the fixing assembly includes a receiving element of the piston shell installed to the piston shell and a latching element movably installed to the gun body and corresponding to the receiving element, such that the latching element can be turned to latch with the receiving element to fix the piston shell to the gun body, and the toy gun has a high structural stability after its assembling and can be assembled and disassembled easily. | 08-16-2012 |
20140000578 | SINGLE/CONTINUOUS FIRING AIR SOFT GUN AND FIRING SWITCH THEREOF | 01-02-2014 |
20150083102 | FIRING SWITCH OF THE SINGLE/CONTINUOUS FIRING AIR SOFT GUN - In a firing switch of the single/continuous firing air soft gun, the air soft gun includes a gun body and a barrel fixed in the gun body, and the firing switch includes a piston seat and a firing switch device, wherein the piston seat is disposed in the gun body and capable of reciprocally moving in horizontal with respect to the barrel; and the firing switch device is installed on the piston seat, and includes a stop piece and a toggle piece connected with the stop piece, and the stop piece is disposed corresponding to the trigger assembly. | 03-26-2015 |
Wei-Hung Hsu, Taipei City TW
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20150177355 | COMPENSATING APPARATUS FOR A NON-CONTACT CURRENT SENSOR INSTALLING VARIATION IN TWO WIRE POWER CABLE - A compensating apparatus for installing variation of a non-contact current sensor on a two-wire power cable includes a non-contact current sensor, a sensing element characteristic measuring unit and a non-contact current measurement module. The non-contact current sensor mounted top to the two-wire power cable further has a first current sensor, a second current sensor, and a third current sensor. The sensing element characteristic measuring unit is to construct a space characteristic measuring database for the non-contact current sensor respective to the two-wire power cable. The non-contact current measurement module is to pair the space characteristic measuring database so as to compute and further output a measured value of the current I in the two-wire power cable. | 06-25-2015 |
Wei-Hung Hsu, Kuntien Hsiang TW
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20120126016 | PLANAR ANTENNA HAVING RFID ELECTRIC TAGS - A planar antenna having RFID electric tags comprises: a substrate ( | 05-24-2012 |
20120127036 | CAPACITIVE ANTENNA STRUCTURE - A capacitive antenna structure comprises a substrate and a sheet-shaped capacitor. The substrate has a radiating metal layer and a grounding metal layer thereon. The radiating metal layer has a first groove to expose the front surface of the substrate, the first groove having a signal feeding hole therein and having a second groove on the edge. The grounding metal layer has a third groove on the edge to expose the substrate, the third groove being opposite to the second groove, the third groove having a first contact and a second contact on two sides respectively to electrically connect to the capacitor. The third groove may connect to a fourth groove to expose the substrate, the fourth groove having a signal transmission line therein, and the signal transmission line having the signal feeding hole to connect a cable. | 05-24-2012 |
Wei-Hung Huang, Hsinchu City TW
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20090313523 | ENCODERS AND METHODS FOR ENCODING DIGITAL DATA WITH LOW-DENSITY PARITY CHECK MATRIX - A method for encoding digital data with a low-density parity check (LDPC) matrix includes: indirectly storing a non-regular portion of the LDPC matrix by storing a plurality of indices corresponding to a plurality of non-zero sub-matrices of the non-regular portion, and by storing a plurality of distance/location parameters respectively corresponding to numbers of zero sub-matrices between adjacent non-zero sub-matrices of the non-regular portion or respectively corresponding to distances between adjacent non-zero sub-matrices of the non-regular portion; generating at least one address according to at least one distance/location parameter; accessing information bits corresponding to the address; and recovering at least one element of the LDPC matrix according to at least one index and the information bits to encode the digital data according to the LDPC matrix. | 12-17-2009 |
20100326357 | NOZZLE AND FURNACE HAVING THE SAME - A nozzle and a furnace having the same are provided. The furnace has a high vacuum fitting used to assemble the nozzle to the furnace. The nozzle includes a first tube part and a second tube part connecting to the first tube part. In addition, an immobilization device is disposed on a surface of the first tube part. The immobilization device is corresponding to an o-ring of the high vacuum fitting and sheathed by the o-ring to steadily immobilize the nozzle to the furnace. | 12-30-2010 |
20120185758 | INFORMATION BROWSING METHOD FOR PARTITIONING CONTENTS OF PAGE AND ASSIGNING IDENTIFIERS TO DATA PARTITIONS AND RELATED MACHINE-READABLE MEDIUM THEREOF - An information browsing method includes: partitioning contents of a page into a plurality of first data partitions by analyzing the contents of the page; assigning a plurality of first identifiers to the first data partitions, respectively; driving a display screen according to at least the first data partitions; and when receiving a partition selection input, determining a selected first data partition according to a first identifier corresponding to the partition selection input, wherein the selected first data partition is assigned with the first identifier. | 07-19-2012 |
Wei-Hung Hung, New Taipei TW
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20130096780 | METHOD OF ACTUATING EXTERNAL ACTIVE SAFETY SYSTEM FOR VEHICLE - A method of actuating an external active safety system for a vehicle is used for cushioning the impact on the vehicle generated in an accident to effectively reduce injury and death as well as vehicle damage rates after an accident. The present invention mainly installs multiple sets of shock absorption devices (for example, airbags) outside the vehicle, for example, on front and rear bumpers, respectively, and the sets of shock absorption devices is able to function in advance in a segmental manner, so that the shock absorption devices installed outside the vehicle function before and during a collision in a segmental manner, so as to cushion an impact on the vehicle body when impacting or being impacted, and the shock absorption devices have an automatic release function, which, when activated, automatically releases an inflated condition of airbags in a very short time. | 04-18-2013 |
Wei-Hung Kuo, Changhua County TW
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20110148743 | PIXEL ARRAY - A pixel array including scan lines, data lines and pixels is provided. The data lines and the scan lines are intersected so as to define sub-pixel regions arranged in array. Each pixel is disposed in a pixel region including (m×n) sub-pixel regions, wherein m is a positive integral and n is a positive integral larger than one. Each pixel includes a plurality of sub-pixels, wherein each sub-pixel includes an active device, a pixel electrode and a storage capacitor. At least a portion of the storage capacitors of the sub-pixels within the same pixel is concentrically disposed in one of the sub-pixel regions. | 06-23-2011 |
20110148781 | TOUCH DISPLAY PANEL - A touch display panel including a first substrate, a second substrate, a light shielding pattern layer, a touch sensing layer and a display medium is provided. The light shielding pattern layer is disposed on the first substrate or the second substrate. Pixel units are defined by the light shielding pattern layer, each pixel unit has a pixel edge length, and each pixel unit is disposed corresponding to one of the pixel structures. The touch sensing layer is disposed on the second substrate and has a plurality of first touch series and a plurality of second touch series. Each first touch series and each touch series respectively have mesh touch pads serially connected to each other. Each mesh touch pad has a plurality of grid patterns, each grid pattern has a grid edge length, and the grid edge length is ⅛˜⅗ of the pixel edge length. | 06-23-2011 |
Wei-Hung Lai, Tainan City TW
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20100051150 | BAG WITH A MECHANICAL MUSIC DEVICE - A bag includes a bag body, a mounting component, and a mechanical music device. The bag body defines a receiving space, and has a bag wall formed with a sound hole therethrough. The mounting component is disposed in the receiving space. The mechanical music device is mounted in the receiving space, and includes a case and a music producing unit. The case is mounted on the mounting component, and includes a first case wall, a second case wall, and a connecting wall. The first and second case walls and the connecting wall cooperate to define an accommodating space. The case has a sound port that is in spatial communication with the accommodating space. The music producing unit is disposed in the case for producing music, and includes a base, a cylinder, a comb, a spring motor, and a knob. | 03-04-2010 |
Wei-Hung Li, New Taipei City TW
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20160049812 | BATTERY EXPANSION SYSTEM HAVING A SINGLE ROUTE FOR CHARGING AND DISCHARGING AND BATTERY CHARGING AND DISCHARGING CONTROL METHOD THEREOF - A battery expansion system and a battery charging and discharging control method configure the cells as an expansion form to connect to a system host such that the charger IC of the system host treats the battery expansion system as a single battery cell for DC charging and discharging control. The battery expansion system utilizes a controller in control of the charge/discharge route for each battery cell. In such way, each battery cell is capable of providing power for the system host or charging another cell until the battery cells are balanced with one another. With the control of a current control device and a charging switch in the charging/discharging route, the controller may effectively limit the charging current toward each cell under the maximum design charging current once a current impulse or in-rush current occurs. | 02-18-2016 |
Wei-Hung Lin, Hsin-Chu TW
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20080210459 | WARPAGE-PROOF CIRCUIT BOARD STRUCTURE - The invention provides a warpage-proof circuit board structure, including: an inner layer circuit board; at least one dielectric layer formed on at least one surface of the inner layer circuit board; at least one first groove formed in the at least one dielectric layer corresponding in position thereto; a solder mask formed on the surface of the dielectric layer, a second groove formed in the solder mask and corresponding in position to the first groove formed in the dielectric layer; and a metal frame formed in the first and second grooves and protruding from the surface of the solder mask, thereby strengthening the circuit board to prevent it from warping in thermal processing and further using the metal frame as a heat-dissipating means for the package structure. | 09-04-2008 |
20130126591 | Thermal Compress Bonding - A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together. | 05-23-2013 |
20140183732 | PACKAGE ON PACKAGE BONDING STRUCTURE AND METHOD FOR FORMING THE SAME - The described embodiments of mechanisms of forming a die package and package on package (PoP) structure involve forming a solder paste layer over metal balls of external connectors of a die package. The solder paste layer protects the metal balls from oxidation. In addition, the solder paste layer enables solder to solder bonding with another die package. Further, the solder paste layer moves an intermetallic compound (IMC) layer formed between the solder paste layer and the metal balls below a surface of a molding compound of the die package. Having the IMC layer below the surface strengthens the bonding structure between the two die packages. | 07-03-2014 |
20140252594 | Package Structures and Methods for Forming the Same - A packaging structure and a method of forming a packaging structure are provided. The packaging structure, such as an interposer, is formed by optionally bonding two carrier substrates together and simultaneously processing two carrier substrates. The processing includes forming a sacrificial layer over the carrier substrates. Openings are formed in the sacrificial layers and pillars are formed in the openings. Substrates are attached to the sacrificial layer. Redistribution lines may be formed on an opposing side of the substrates and vias may be formed to provide electrical contacts to the pillars. A debond process may be performed to separate the carrier substrates. Integrated circuit dies may be attached to one side of the redistribution lines and the sacrificial layer is removed. | 09-11-2014 |
20140264856 | Package-on-Package Structures and Methods for Forming the Same - A package includes a package component, which further includes a top surface and a metal pad at the top surface of the package component. The package further includes a non-reflowable electrical connector over and bonded to the metal pad, and a molding material over the package component. The non-reflowable electrical connector is molded in the molding material and in contact with the molding material. The non-reflowable electrical connector has a top surface lower than a top surface of the molding compound. | 09-18-2014 |
20140374922 | Alignment in the Packaging of Integrated Circuits - A method includes aligning a top package to a bottom package using an alignment mark in the bottom package, and placing the top package over the bottom package, wherein the top package is aligned to the bottom package after the placing the top package over the bottom package. A reflow is then performed to bond the top package to the bottom package. | 12-25-2014 |
Wei-Hung Lin, Hsinchu County TW
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20100091469 | STORAGE APPARATUS - A storage apparatus including a circuit board, a first flash memory, a first golden finger, a control unit, and a supporting component is provided. The circuit board has a first surface and a second surface. The first flash memory is disposed on the circuit board. The first golden finger and the control unit are disposed on an end of the circuit board, in which the first golden finger is disposed on the first surface, and the control unit is disposed on the second surface, and the control unit is substantially on the backside of the first golden finger. The control unit is electrically connected with the first memory and the first golden finger. The supporting component is used for supporting the circuit board. | 04-15-2010 |
20100110643 | FLASH DRIVE AND HOUSING ASSEMBLY THEREOF - A flash drive and a housing assembly thereof is provided. The housing assembly comprises a housing, a base and a rotating mechanism. The housing has a first opening, a second opening, and a space, the first opening is situated at a side surface of the housing, and the second opening is situated on a top surface of the housing. The base is used for accommodating a storage device which has a connecting member, the base is movably disposed in the space and has a slot facing the second opening. The rotating mechanism is disposed at the second opening and mounted to the housing, the rotating mechanism has a protrusion portion movably engaged in the slot. When the rotating mechanism rotates relative to the housing, the protrusion portion moves along the slot and drives the base to reciprocate between a first position and a second position. | 05-06-2010 |
20120020151 | STORAGE APPARATUS AND METHOD OF MANUFACTURING THE SAME - A storage apparatus including a circuit board, a control circuit element, a terminal module and a storage circuit element is provided. The circuit board includes a first surface, a second surface, a connect part, openings, metal contacts and metal units. The openings pass through the circuit board from the first surface to the second surface and the metal contacts are exposed on the first surface. The terminal module is disposed on the first surface and has elastic terminals and each of the elastic terminals has a first contact part and a second contact part. The first contact parts respectively contact with the metal contacts and the second contact parts respectively pass through the openings to protrude from the second surface. The metal units are disposed on the second surface and located between the openings and the connect part. Accordingly, the volume of the storage apparatus can be reduced. | 01-26-2012 |
20130107440 | STORAGE DEVICE AND METHOD FOR PRODUCING THE SAME | 05-02-2013 |
20130133191 | METHOD OF MANUFACTURING STORAGE APPARATUS - A storage apparatus including a circuit board, a control circuit element, a terminal module and a storage circuit element is provided. The circuit board includes a first surface, a second surface, a connect part, openings, metal contacts and metal units. The openings pass through the circuit board from the first surface to the second surface and the metal contacts are exposed on the first surface. The terminal module is disposed on the first surface and has elastic terminals and each of the elastic terminals has a first contact part and a second contact part. The first contact parts respectively contact with the metal contacts and the second contact parts respectively pass through the openings to protrude from the second surface. The metal units are disposed on the second surface and located between the openings and the connect part. Accordingly, the volume of the storage apparatus can be reduced. | 05-30-2013 |
20140078662 | STORAGE DEVICE AND PRODUCING METHOD OF THE SAME - A storage device including a housing, a connector, and a storage element is provided. The housing has an opening. The connector and the storage element are disposed in the housing. The connector has a main body, a first terminal set, and a second terminal set, the first and the second terminal sets disposed at opposite ends of the main body are electrically connected to each other correspondingly. The second terminal set is connected to an external device. The storage element has a plurality of pads. The first terminal set connects to the pads correspondingly, such that the connector is electrically connected to the storage element. The first terminal set and the pads are exposed out of the housing through the opening. A producing method of the storage device is also provided. | 03-20-2014 |
20140256164 | STORAGE INTERFACE MODULE - A storage interface module including a substrate and a connecting member is provided. The substrate has a first surface, a second surface and a plurality of first openings. The first surface and the second surface are back to each other. Each of the first openings is connected through the first surface and the second surface. The connecting member is disposed on the first surface of the substrate. The connecting member has a first terminal set and a second terminal set, in which a first end of each of the terminals is connected to the first surface, and a second end of each of the terminals passes through the corresponding first opening and protrudes out of the second surface, and a third end of each of the terminals in the second terminal set is connected to the first surface. | 09-11-2014 |
20140337555 | FLASH DRIVE - A flash drive includes a storage module, a switching module, and a transforming mechanism. The storage module has a storage unit and a first interface electrically connected to each other. The switching module has a second interface and a third interface which are in different types but are electrically connected to each other, and the first interface corresponds to the second interface. The transforming mechanism is located at a first position or a second position relative to the storage module, and the switching module is located in the transforming mechanism. When the transforming mechanism is located at the first position, the first interface is electrically connected to the second interface, so that the storage unit is electrically connected to a host through the third interface. When the transforming mechanism is located at the second position, the first interface of the storage unit is electrically connected to the host. | 11-13-2014 |
20150087167 | CONNECTING PART OF STORAGE DEVICE - A connecting part of a storage device including a body, a plurality of connecting terminals, and a grounding member is provided. The body has a first end and a second end opposite to each other. The connecting terminals are disposed at the first end and the second end respectively. The grounding member is assembled to the body. At least a part of the grounding member extends from one of the first and the second ends to another one of the first and the second ends. The connecting part of the storage device is grounded by contacting the grounding member to a connector of an external device when the connecting part of the storage device is connected to the connector of the external device. | 03-26-2015 |
20150109725 | FLASH DRIVE AND OPERATING METHOD THEREOF - A flash drive including a storage element, a housing, and an integrating member is provided. The storage element has a first connector and a second connector. The integrating member is pivoted to the storage member and coupled to the housing, wherein the integrating member and the housing move relatively in a first path or a second path. The integrating member and the housing move relatively along the first path, such that the first connector is extended outside or hidden inside the housing. The integrating member and the housing move relatively along the second path and drive the storage element to move relative to the integrating member, such that the second connector is extended outside or hidden in the integrating member. An operating method of flash drive is also provided. | 04-23-2015 |
20150200188 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - According to an exemplary embodiment, a semiconductor package is provided. The A semiconductor package includes at least one chip, and at least one component adjacent to the at least one chip, wherein the at least one chip and the at least one component are molded in a same molding body. | 07-16-2015 |
20150235902 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes providing a wafer, grinding a backside of the wafer, disposing a backside film on the backside of the wafer, cutting the wafer to singulate a plurality of dies from the wafer, and forming a mark on the backside film disposed on each of the plurality of dies by a laser operation. | 08-20-2015 |
20150243573 | WAFER LEVEL CHIP SCALE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor structure includes a die including a top surface and a sidewall, and a molding surrounding the die and including a top surface, a sidewall interfacing with the sidewall of the die, and a curved surface including a curvature greater than zero and coupling the sidewall of the molding with the top surface of the molding. | 08-27-2015 |
20150243620 | SUBSTRATE AND PACKAGE STRUCTURE - According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area. | 08-27-2015 |
20150244125 | STORAGE DEVICE - A storage device includes a base and a storage unit. The base is a conductor of electricity. The storage unit has a first connecting interface and a second connecting interface. The storage unit is disposed on the base, and the base is electrically connected to the first connecting interface or the second connecting interface. | 08-27-2015 |
20150270668 | STORAGE DEVICE - A storage device including a storage module and a sheath member is provided. The storage module has a substrate, a first terminal set and a second terminal set, and the first and the second terminal sets are disposed on opposite sides of the substrate. The sheath member has an opening and a third terminal set. A portion of the third terminal set is exposed out of the sheath member. At least a portion of the storage module is sheathed into the sheath member, and the first terminal set is exposed out of the sheath member through the opening. The second terminal set is electrically connected to the third terminal set, and an connection interface is formed by the first terminal set exposed out of the sheath member and the portion of the third terminal set exposed out of the sheath member. | 09-24-2015 |
20150280378 | CONNECTOR AND STORAGE DEVICE USING THE SAME - A connector suitable for a storage device is provided. The storage device has a storage module. The connector includes a body, a plurality of terminals, and a housing. The terminals are disposed in the body, and a first end of each terminal protrudes from the body and is electrically connected to the storage module. The housing covers the body and has an indentation and a shielding portion. The first end of each terminal is located at the indentation. The shielding portion shields the indentation, and the first end of each terminal is located between the shielding portion and the storage module. A storage device is also provided. | 10-01-2015 |
20150348927 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor structure includes a substrate including a front side, a conductive bump disposed over the front side, and an opaque molding disposed over the front side and around a periphery portion of an outer surface of the conductive bump, wherein the opaque molding includes a recessed portion disposed above a portion of the front side adjacent to a corner of the substrate and extended through the opaque molding to expose the portion of the front side and an alignment feature disposed within the portion of the front side. | 12-03-2015 |
Wei-Hung Lin, Xinfeng Township TW
Patent application number | Description | Published |
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20120018494 | Thermal Compress Bonding - A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together. | 01-26-2012 |
20120021183 | Forming Low Stress Joints Using Thermal Compress Bonding - A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer. | 01-26-2012 |
20120267423 | Methods and Apparatus for Thin Die Processing - A vacuum tip and methods for processing thin integrated circuit dies. A vacuum tip for attaching to an integrated circuit die is disclosed comprising a vacuum port configured to connect to a vacuum supply on an upper surface and having a bottom surface; and at least one vacuum hole extending through the vacuum tip and exposed at the bottom surface of the vacuum tip; wherein the vacuum tip is configured to physically contact a surface of an integrated circuit die. Methods for processing integrated circuit dies are disclosed. | 10-25-2012 |
20120299181 | Package-on-Package Process for Applying Molding Compound - A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film. | 11-29-2012 |
20130062761 | Packaging Methods and Structures for Semiconductor Devices - Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL. | 03-14-2013 |
20130089952 | Packaging Process Tools and Packaging Methods for Semiconductor Devices - Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region. | 04-11-2013 |
20130093076 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME - A method of a semiconductor package includes providing a substrate having a conductive trace coated with an organic solderability preservative (OSP) layer, removing the OSP layer from the conductive trace, and then coupling a chip to the substrate to form a semiconductor package. | 04-18-2013 |
20130095608 | Methods for Forming 3DIC Package - A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening. | 04-18-2013 |
20130095611 | Packaging Methods for Semiconductor Devices - Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates. | 04-18-2013 |
20130102112 | Process for Forming Packages - A method includes loading a first package component on a concave boat, and placing a second package component over the first package component. A load clamp is placed over the second package component, wherein the load clamp is supported by a temperature-variable spacer of the concave boat. A reflow step is performed to bond the second package component to the first package component. During a temperature-elevation step of the reflow step, the temperature-variable spacer is softened in response to an increase in temperature, and a height of the softened temperature-variable spacer is reduced, until the load clamp is stopped by a rigid spacer of the concave boat. | 04-25-2013 |
20130113116 | Contact and Method of Formation - A system and method for forming contacts is provided. An embodiment comprises forming the contacts on a substrate and then coining the contacts by physically shaping them using, e.g., a molding chamber. The physical shaping of the contacts may be performed using a patterned portion of the molding chamber or else by placing a patterned stencil around the contacts prior before a force is applied to physically reshape the contacts. The contacts may be reshaped into a cylindrical, oval, cuboid, or rectangular shape, for example. | 05-09-2013 |
20130128486 | Forming Low Stress Joints Using Thermal Compress Bonding - A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer. | 05-23-2013 |
20130143361 | Packaging Process Tools and Systems, and Packaging Methods for Semiconductor Devices - Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon. | 06-06-2013 |
20130187268 | Semiconductor Packaging Structure and Method - A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections. | 07-25-2013 |
20130234317 | Packaging Methods and Packaged Semiconductor Devices - Packaging methods and packaged semiconductor devices are disclosed. In one embodiment, a packaging method includes providing a first die, partially packaging the first die, and forming a plurality of solder balls on a surface of the partially packaged first die. An epoxy flux is disposed over the plurality of solder balls. A second die is provided, and the second die is partially packaged. The plurality of solder balls is coupled to the partially packaged second die. | 09-12-2013 |
20130270700 | PACKAGE ON PACKAGE STRUCTURES AND METHODS FOR FORMING THE SAME - The described embodiments of mechanisms of forming a package on package (PoP) structure involve bonding with connectors with non-solder metal balls to a packaging substrate. The non-solder metal balls may include a solder coating layer. The connectors with non-solder metal balls can maintain substantially the shape of the connectors and control the height of the bonding structures between upper and lower packages. The connectors with non-solder metal balls are also less likely to result in bridging between connectors or disconnection (or cold joint) of bonded connectors. As a result, the pitch of the connectors with non-solder metal balls can be kept small. | 10-17-2013 |
20130334710 | Contact and Method of Formation - A system and method for forming contacts is provided. An embodiment comprises forming the contacts on a substrate and then coining the contacts by physically shaping them using, e.g., a molding chamber. The physical shaping of the contacts may be performed using a patterned portion of the molding chamber or else by placing a patterned stencil around the contacts prior before a force is applied to physically reshape the contacts. The contacts may be reshaped into a cylindrical, oval, cuboid, or rectangular shape, for example. | 12-19-2013 |
20140001652 | PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARPAGE CONTROL | 01-02-2014 |
20140008786 | BUMP-ON-TRACE PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME - A device comprises a first package component, and a first metal trace and a second metal trace on a top surface of the first package component. The device further includes a dielectric mask layer covering the top surface of the first package component, the first metal trace and the second metal trace, wherein the dielectric mask layer has an opening therein exposing the first metal trace. The device also includes a second package component and an interconnect formed on the second package component, the interconnect having a metal bump and a solder bump formed on the metal bump, wherein the solder bump contacts the first metal trace in the opening of the dielectric mask layer. | 01-09-2014 |
20140045300 | WARPAGE CONTROL IN A PACKAGE-ON-PACKAGE STRUCTURE - The present disclosure relates to a tool arrangement and method to reduce warpage within a package-on-package semiconductor structure, while minimizing void formation within an electrically-insulating adhesive which couples the packages. A pressure generator and a variable frequency microwave source are coupled to a process chamber which encapsulates a package-on-package semiconductor structure. The package-on-package semiconductor structure is simultaneously heated by the variable frequency microwave source at variable frequency, variable temperature, and variable duration and exposed to an elevated pressure by the pressure generator. This combination for microwave heating and elevated pressure limits the amount of warpage introduced while preventing void formation within an electrically-insulating adhesive which couples the substrates of the package-on-package semiconductor structure. | 02-13-2014 |
20140091509 | Methods for Forming 3DIC Package - A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening. | 04-03-2014 |
20140231988 | Packaging Methods and Packaged Semiconductor Devices - Packaging methods and packaged semiconductor devices are disclosed. In one embodiment, a packaging method includes providing a first die, partially packaging the first die, and forming a plurality of solder balls on a surface of the partially packaged first die. An epoxy flux is disposed over the plurality of solder balls. A second die is provided, and the second die is partially packaged. The plurality of solder balls is coupled to the partially packaged second die. | 08-21-2014 |
20140331462 | Packaging Process Tools and Packaging Methods for Semiconductor Devices - Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region. | 11-13-2014 |
20140367867 | Packaging Methods and Packaged Semiconductor Devices - An embodiment is a method including forming a first package and a second package. The first package includes packaging a first die, forming a plurality of solder balls on the first die, and coating the plurality of solder balls with an epoxy flux. The second package includes forming a first electrical connector, attaching a second die adjacent the first electrical connector, forming a interconnect structure over the first die and the first electrical connector, the interconnect structure being a frontside of the second package, forming a second electrical connector over the interconnect structure, and the second electrical connector being coupled to both the first die and the first electrical connector. The method further includes bonding the first package to the backside of the second package with the plurality of solder balls forming a plurality of solder joints, each of the plurality of solder joints being surrounded by the epoxy flux. | 12-18-2014 |
20150044819 | Packaging Methods and Structures for Semiconductor Devices - Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL. | 02-12-2015 |
20150091193 | Semiconductor Bonding Structures and Methods - A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once patterned other semiconductor devices, such as semiconductor dies or semiconductor packages may then be attached to the substrate through the underfill, with electrical connections from the other semiconductor devices extending into the pattern of the underfill. | 04-02-2015 |
20150155243 | Warpage Control in Package-on-Package Structures - A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A molding material molds at least a lower part of the bottom die therein, wherein the molding material is overlying the bottom substrate. | 06-04-2015 |
20150155249 | Solder Joint Structure for Ball Grid Array in Wafer Level Package - A semiconductor device package and a method for forming the same using an improved solder joint structure are disclosure. The package includes solder joints having a thinner bottom portion than a top portion. The bottom portion is surrounded by a molding compound and the top portion is not surrounded by a molding compound. The method includes depositing and forming a liquid molding compound around an intermediate solder joint using release film, and then etching the molding compound to a reduced height. The resulting solder joint has no waist at the interface of the molding compound and the solder joint. The molding compound has a greater roughness after the etch, greater than about 3 microns, than the molding compound as formed. | 06-04-2015 |
20150162316 | Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices - Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes forming a mask coating over a carrier, coupling an integrated circuit die over the mask coating, and disposing a molding compound around the integrated circuit die. The method includes forming an interconnect structure over the integrated circuit die and the molding compound. | 06-11-2015 |
20150187723 | Package on Package Bonding Structure and Method for Forming the Same - The described embodiments of mechanisms of forming a die package and package on package (PoP) structure involve forming a solder paste layer over metal balls of external connectors of a die package. The solder paste layer protects the metal balls from oxidation. In addition, the solder paste layer enables solder to solder bonding with another die package. Further, the solder paste layer moves an intermetallic compound (IMC) layer formed between the solder paste layer and the metal balls below a surface of a molding compound of the die package. Having the IMC layer below the surface strengthens the bonding structure between the two die packages. | 07-02-2015 |
20150206779 | SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR - Presented herein is a device comprising a device processing boat comprising a base at least one unit retainer disposed in the base. The device further comprises a cover having at least one recess configured to accept and retain at least one unit, the at least one recess aligned over, and configured to hold the at least one unit over, at least a portion of the at least one unit retainer. The cover is retained to the device processing boat by the at least one unit retainer. At least one pressure sensor having at least one sensel is disposed in the base and having the sensel configured to sense a clamping force applied by the cover to the at least one unit. | 07-23-2015 |
20150214077 | Methods of Packaging and Dicing Semiconductor Devices and Structures Thereof - Methods of packaging and dicing semiconductor devices, and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging and dicing semiconductor devices includes a first cutting process performed on a wafer to form a groove passing through a passivation layer and an interconnect structure on a scribe line region and a portion of a semiconductor substrate on the scribe line region. Next, a molding compound layer is formed on a frontside of the wafer to fill the groove. After performing a grinding process on a backside of the wafer to thin down the semiconductor substrate, a second cutting process is performed on the wafer to separate the individual dies. The second cutting process cuts through the molding compound layer in the groove and the semiconductor substrate underlying the groove. | 07-30-2015 |
20150228632 | Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices - Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a molding compound disposed around the integrated circuit die, and an interconnect structure disposed over the integrated circuit die and the molding compound. The molding compound is thicker than the integrated circuit die. | 08-13-2015 |
20160035667 | Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices - Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes providing a protective film, coupling dies to the protective film, and disposing a molding material around the dies. The protective film includes a substantially opaque material at predetermined wavelengths of light. | 02-04-2016 |
Wei-Hung Liu, Hsinchu City TW
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20140272678 | Structure and Method for Reflective-Type Mask - The present disclosure provides an embodiment of a reflective mask that includes a substrate; a reflective multilayer formed on the substrate; a capping layer formed on the reflective multilayer and having a hardness greater than about 8; and an absorber layer formed on the capping layer and patterned according to an integrated circuit layout. | 09-18-2014 |
20150261082 | Structure and Method for Reflective-Type Mask - A reflective mask includes a substrate; a reflective multilayer formed on the substrate; an absorber layer formed on the reflective multilayer, wherein the absorber layer is patterned to have openings according to an integrated circuit layout; and a protection layer formed over the reflective multilayer within the openings. | 09-17-2015 |
Wei-Hung Liu, Taipei TW
Patent application number | Description | Published |
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20090135147 | INPUT METHOD AND CONTENT DISPLAYING METHOD FOR AN ELECTRONIC DEVICE, AND APPLICATIONS THEREOF - In an input method and an input system for an electronic device, an electronic device having input functionality and content displaying functionality, and a content displaying method and a displaying system for an electronic device, the electronic device is provided with a sensing screen, and the input method includes the following steps: displaying a plurality of virtual keys; receiving an input signal; displaying a corresponding enlarged virtual key on the sensing screen; and detecting whether there is an input of a confirm input signal, and outputting a virtual key code corresponding to the confirm input signal if affirmative. | 05-28-2009 |
Wei-Hung Liu, Hsinchu TW
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20150145746 | Loop Antenna - A loop antenna is provided, which includes a first loop section, a second loop section and a third loop section. The first loop section surrounds and defines an empty area. The second loop section surrounds and connects the first loop section, and an annular groove is formed between the first loop section and the second loop section. The third loop section surrounds and connects the second loop section. The width of a gap between the third loop section and the second loop section is smaller than the width of the annular groove. | 05-28-2015 |
Wei-Hung Liu, Hsinchu County TW
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20130148518 | PACKET RECEIVER AND PACKET PROCESSING METHOD THEREOF - A packet processing method applied in a packet receiver is provided. An approximate bit rate is first determined according to time stamps of two different packets. The approximate bit rate is corrected according to a time stamp of another packet to generate a fine-tuned bit rate. According to the fine-tuned bit rate, one or more subsequent packets are read out from a buffer. The time stamp of a subsequent packet is provided according to the approximate bit rate. | 06-13-2013 |
Wei-Hung Liu, New Taipei City TW
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20120042159 | APPLICATION METHOD FOR INTEGRATING HETEROGENEOUS OPERATING SYSTEMS BASED ON THE SAME SYSTEM KERNEL - An application method for integrating heterogeneous operating systems based on the same system kernel is disclosed. The application method includes opening a master virtual console corresponding to a master operating system, opening a slave virtual console corresponding to a slave operating system in the master virtual console, and establishing a share information area for the master operating system and the slave operating system and switching to slave virtual console to operate on the slave operating system. | 02-16-2012 |
20150116229 | TOUCH CONTROL METHOD AND TOUCH CONTROL ELECTRONIC APPARATUS - A touch control method and a touch control electronic apparatus are provided. The touch control electronic apparatus comprises an angle database, a function database, a touch panel and a central processing unit (CPU). The touch panel senses a plurality of touch points. The CPU calculates a plurality of touch angles according to the touch points, and stores the touch angles to an angle queue. The CPU accesses a comparative model from the angle database, and compares the angle queue with the comparative model to generate a plurality of comparative results. The CPU sequentially stores the comparative results to a comparative queue. The CPU accesses a result queue from the function database, and determines whether the comparative queue matches the result queue. The CPU performs a function operation corresponding to the result queue if the comparative queue matches the result queue. | 04-30-2015 |
Wei-Hung Shih, Kaohsiung TW
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20140166251 | HEAT TRANSFERRING DEVICE AND METHOD FOR MANUFACTURING THE SAME - The disclosure provides a heat transferring device and a method for manufacturing the heat transferring device. The heat transferring device includes: a flexible heat transfer substrate including a first surface, a second surface, at least one solid portion and at least one characteristic hole portion. The at least one solid portion is formed between the first surface and the second surface. The at least one characteristic hole portion includes several characteristic holes penetrating through the first surface and the second surface. The flexible heat transfer substrate further includes: a first end and a second end, and the second end is corresponding to the first end. The flexible heat transfer substrate is rolled from the first end towards the second end to form the heat transferring device with a predetermined shape. | 06-19-2014 |
20150182306 | DENTAL BRACKET - A dental bracket is adapted to connect with a wire for repositioning of a tooth in a mouth of a patient, and includes a base member, a cap, and an adjustable unit. The cap is connected removably to the base member to define an accommodating chamber therebetween, and is formed with an opening in spatial communication with the accommodating chamber. The adjustable unit includes an inner end portion disposed within the accommodating chamber and retained at a selected one of a plurality of angular positions, and an outer end surface formed with at least one wire engaging groove that is disposed outwardly of the opening in the cap. The cap is removable from the base member to allow for angular position adjustment of the inner end portion of the adjusting member relative to the base member. | 07-02-2015 |
Wei-Hung Su, Miaoli County TW
Patent application number | Description | Published |
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20140223529 | Method of Sharing Credential and Wireless Communication System thereof - A method of sharing credential in a wireless communication system comprising a first user equipment, a second communication device and a network, includes transmitting a temporal credential and a credential custody request, from the first communication device, to the network; transmitting first custody information, by the network, to the first communication device; transmitting a credential acquiring request and second custody information, by the second communication device, to the network; and determining whether to transmit the temporal credential to the second communication device according to the second custody information. | 08-07-2014 |
Wei-Hung Tsai, Hsinchu TW
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20130230314 | METHOD FOR CONTROLLING OPTICAL POWER AND EXTINCTION RATIO OVER ENTIRE TEMPERATURE RANGE - The present invention is to provide a method applicable to a fiber-optic transceiver including a transmitter optical subassembly (TOSA) provided therein with a laser diode, but without a monitoring photodiode, a laser driver controlled by a controller IC for driving the laser diode to generate a laser beam, and a thermal sensor for sensing temperature of the laser diode. The method includes executing an approximation process to characteristic data, i.e. threshold currents of the laser diode at a plurality of specific temperatures and corresponding slope efficiencies (SE), provided by manufacturer for obtaining relationship therebetween over entire temperature range, manually adjusting operation parameters (such as bias current and modulation current) of the laser diode for generating expected optical power and extinction ratio at a normal temperature and for subsequently determining the operation parameters over the entire temperature range, and writing the relationship and operation parameters thus obtained into the controller IC. | 09-05-2013 |
20140198302 | IMAGE REARRANGING LENS AND PROJECTION APPARATUS - An image rearranging lens and a projection apparatus are provided. The image rearranging lens is used to rearrange a plurality of sub images provided by an image source and arranged along an arranging direction. The image rearranging lens includes a plurality of lens groups arranged along the arranging direction. Each of the sub images is imaged on a corresponding lens group. Optical axes of the lens groups are not aligned to each other along the arranging direction. The optical axis of each of the lens groups and the optical axis of the neighboring lens groups have an offset along a direction perpendicular to the arranging direction. | 07-17-2014 |
Wei-Hung Wu, Hsin-Chu TW
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20130051070 | LED LIGHT BAR AND BACKLIGHT MODULE - A light-emitting diode light bar includes a printed circuit board and a light-emitting diode. The printed circuit board has a protective layer, a first signal line, and a first extension line. The LED is disposed on the first signal line and the first extension line. The protective layer is formed above the first signal line and the first extension line, and has an opening that exposes a portion of the first signal line, and a portion of the extension line, such that a first exposed length of the first signal line is substantially equal to a second exposed length of the first extension line. | 02-28-2013 |
Wei-Hung Yang, New Taipei City TW
Patent application number | Description | Published |
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20140306078 | WALL FASTENER FOR WIRELESS TRANSMISSION MODULE - The wall fastener for a wireless transmission module includes a supporting frame and a case. The supporting frame has a front face, a rear face, a first engagement portion and a slot. The case has a rear plate which has an outer face, an inner face, a second engagement portion and a stopper. The stopper partially projects out of the outer face. The first and second engagement portions mate and the stopper is received by the slot. The wireless transmission module and the supporting frame are tightly engaged and easily disengaged by a tool. | 10-16-2014 |
Wei-Hung Yeh, Hsinchu City TW
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20150134525 | Method for Preventing Misappropriation of Plastic Money and Plastic Money - A method for preventing misappropriation of plastic money includes transmitting a first verification data from plastic money to an accompanied card through a wireless signal; comparing the first verification data with a second verification data stored in the accompanied card; if the comparison result is that the first verification data is identical to the second verification data, transmitting a verification success message from the accompanied card to the plastic money through the wireless signal; transmitting a first short message or E-mail including intended payment information from the plastic money to a cell phone number or an E-mail address of a cardholder of the plastic money through the wireless signal to inquire whether the cardholder of the plastic money agrees to pay or not; clicking a particular hyperlink in the first E-mail with a mobile device or pressing a particular button or icon of the mobile device by the cardholder of the plastic money to agree to pay and transmitting an approved payment message back to the plastic money through the wireless signal. | 05-14-2015 |