Patent application number | Description | Published |
20100044722 | Sensing Module - A sensing module comprises a carrier, a sensor, a substrate, and a plurality of chips. The carrier has a carrying surface and a back surface opposite to the carrying surface. The sensor and the substrate are disposed on the carrying surface and are electrically connected to the carrier respectively. The chips are disposed on the substrate and are electrically connected to the substrate respectively. The production cost of the sensing module is low. | 02-25-2010 |
20100181466 | Optical Sensing Module and Optical Mouse with the same - In an optical mouse, an optical sensing module includes a printed circuit board and a packaging body. The printed circuit board has an upper surface and a lower surface on opposite sides. The packaging body including a compound, an optical sensing die and a lead frame is disposed on the lower surface. The compound has a transparent surface. The optical sensing die used for receiving light is located inner the compound and has an optical sensing surface facing the transparent surface of the compound. The lead frame with a shoulder portion is electrically connected to the optical sensing die. The shoulder portion extends out from the compound along a direction that is parallel to the optical sensing surface of the optical sensing die. The shoulder portion is fixed on the lower surface. The optical sensing module may be used in an optical mouse. In the above optical sensing module, since the packaging body is positioned on the lower surface of the printed circuit board and the shoulder portion is fixed thereon, a preciseness of assembling the above optical sensing module can be easily improved. | 07-22-2010 |
20110261015 | OPTICAL TOUCH DISPLAY DEVICE - An optical touch device includes a display panel and at least a light emitting and receiving unit. The display panel includes a transparent substrate having a touch surface and a plurality of side surfaces adjacent to the touch surface. At least one of the side surfaces is a first light incidence surface and at least one of the side surfaces is a first light emitting surface. Each light emitting and receiving unit includes a linear light source and a light sensing component. The linear light source is disposed beside the first light incidence surface and is configured for providing optical signals into the transparent substrate. The light sensing component is disposed beside the first light emitting surface. The light sensing component is configured for receiving the optical signals from the linear light source. The optical touch display device has advantages of low cost. | 10-27-2011 |
20110285643 | OPTICAL TOUCH DISPLAY DEVICE - An optical touch display device includes a display unit and at least one light sensing module. The display unit includes a first substrate and a display layer. The first substrate has a display area and a non-display area surrounding the display area. The display layer is disposed on the display area of the first substrate. The light sensing module is disposed on an upper surface of the non-display area of the first substrate. A side surface of the light sensing module has a light sensing window, and at least a portion of the light sensing window is adapted to receive light above the display unit. The optical touch display device has a thin thickness. | 11-24-2011 |
20120168945 | CHIP PACKAGE STRUCTURE AND CHIP PACKAGING PROCESS - A chip package structure includes a silicon substrate, a sensing component, a metal circuit layer, a first insulating layer and a conductive metal layer. The silicon substrate has opposite first and second surfaces. The sensing component is disposed on the first surface. The metal circuit layer is disposed on the first surface and electrically connected to the sensing component. The first insulating layer covers the second surface and has a first through hole to expose a portion of the second surface. The conductive metal layer is disposed on the first insulating layer and includes first leads and a second lead. The first leads are electrically connected to the metal circuit layer. The second lead is filled in the first through hole to electrically connect to the silicon substrate and one of the first leads. A chip packaging process for fabricating the chip package structure is also provided. | 07-05-2012 |
20120176598 | APPARATUS AND METHOD FOR QUANTIFYING RESIDUAL STRESS OF A BIREFRINGENT MATERIAL - An apparatus for quantifying residual stress of a birefringent material comprises a light source generating light; a vertical polarizer converting a beam of light into a beam with vertical polarization; a standard material being mounted in front of the vertical polarizer; a horizontal polarizer converting a beam of light into a beam with horizontal polarization; an applied force unit applying different forces to the standard material; a spectrometer being mounted in front of the horizontal polarizer and recording intensity of light passing through the horizontal polarizer and transmittance of the standard material and a processing module being connected to the spectrometer, deriving a stress formula from the applied forces and transmittances of the standard material and obtaining a stress distribution of the birefringent material. A method for quantifying residual stress of a birefringent material is also disclosed. | 07-12-2012 |
20130070048 | Formation Apparatus Using Digital Image Correlation - The present disclosure uses at least three cameras to monitor even a large-scale area. Displacement and strain are measured in a fast, convenient and effective way. The present disclosure has advantages on whole field, far distance and convenience. | 03-21-2013 |
20150029514 | METHOD AND SYSTEM FOR ON-LINE REAL-TIME MEASURING THE SURFACE TOPOGRAPHY AND OUT-OF-PLANE DEFORMATION BY USING PHASE-SHIFTING SHADOW MOIRE METHOD - The present invention is directed to a system and method for on-line real-time measuring the surface topography and out-of-plane deformation by using phase-shifting shadow moiré method. Digital Phase-Shifting Shadow Moiré Method is applied to a system, which receives the reflected images from the surface of transparent or non-transparent plate projected under a light beam passing through a grating. Next, by image correction program, the skewed interference fringe pattern is recovered to the image as if the image acquisition equipment is placed normal to the surface. Furthermore, the received images are processed with Phase-Shifting to show the surface topography of the plate. | 01-29-2015 |