Patent application number | Description | Published |
20140051293 | MALE CONNECTOR AND FEMALE CONNECTOR FOR TUNER - A male connector is connected to a tuner and is dimensioned in accordance with a standard video graphics array (VGA) male connector. The male connector includes a red video male pin, a green video male pin, a blue video male pin, an inter-integrated circuit (I2C) data, and an I2C clock male pin. The red video male pin receives a left channel audio signal from the tuner. The green video male pin receives a right channel audio signal from the tuner. The blue video male pin receives a video signal from the tuner. The I2C data male pin transmits an I2C data signal to the tuner, the I2C clock male pin transmits an I2C clock signal to the tuner, the I2C data signal and the I2C clock signal control the tuner to select one of the television radio frequency signals. | 02-20-2014 |
20140085855 | ELECTRONIC DEVICE - An electronic device includes a first circuit board, a second circuit board, and a third circuit board. A plurality of loads are mounted on the first circuit board, a plurality of direct current (DC) to DC converters are mounted on the second circuit board, and an alternating current (AC) to DC converter is mounted on the third circuit board. The first circuit board is electrically connected to the second circuit board, the DC to DC converters are configured to convert an input DC voltage from the third circuit board to a plurality of output DC voltages correspondingly, and the output DC voltages power the loads correspondingly. The electronic device separates the voltage-conversion processes from other working components, thus the electronic device is protected from electromagnetic interference. | 03-27-2014 |
20140281630 | ELECTRONIC DEVICE WITH TWO DRIVING STRUCTURES - An electronic device with two driving structures is capable of switching between a standby state and a working state. The electronic device includes a power supply, a processor and a driving circuit. The power supply is capable of outputting a first driving voltage or a second driving voltage. The processor detects whether the power supply outputs a first driving voltage and whether the electronic device receives a power-on instruction for powering on the electronic device. The processor outputs different controlling signals to control the driving circuit to output different voltages. The processor works in different states of different driving structures based on the received voltage outputted by the driving circuit. | 09-18-2014 |
20140289431 | INTERFACE APPARATUS CONNECTED WITH ELECTRONIC DEVICE - An interface apparatus is capable of connecting with a plurality of external devices and an electronic device. The electronic device generates control signals and a selecting signal. The interface apparatus comprises a plurality of interface ports, an interface, a selection unit, and a switch. The interface ports connect with the external devices respectively. The interface controls the switch to establish a connection between the selection unit and the interface in response to the first control signal for transmitting the selecting signal to the selection unit. The selection unit selects the interface port corresponding to the selecting signal to connect with the switch. The interface further transmits information from the external device corresponding to the selected interface port to the electronic device through the switch and the interface in that order in response to the second control signal. | 09-25-2014 |
Patent application number | Description | Published |
20110261299 | THREE-DIMENSIONAL DISPLAY - A three-dimensional display includes a liquid crystal display (LCD) panel, a polarizer, a composite optical film, a phase retarder, and an adhesive layer. The LCD panel has a display surface and a rear surface opposite to the display surface. The polarizer is disposed on the rear surface. The composite optical film is disposed on the display surface. The composite optical film includes a quarter wave plate and at least one optical film located between the LCD panel and the quarter wave plate. The phase retarder has a plurality of phase retardation patterns separated from one another, and phase retardation of each phase retardation pattern is λ/2. The adhesive layer is disposed between the composite optical film and the phase retarder, and the phase retarder adheres to the quarter wave plate through the adhesive layer. | 10-27-2011 |
20120169714 | DISPLAY SYSTEM - A display system including a display apparatus for displaying a first image and a second image, two first lenses and two second lenses is provided. When a viewer sees the display apparatus via one first lenses and one second lenses, and the first image as well as the second image are parallax images, the first and second images are respectively saw by different eyes of the viewer. When the viewer sees the display apparatus through the two first lenses, and the first image as well as the second image are not parallax images, the first image irrelevant to the second image is saw by the viewer. When the viewer sees the display apparatus through the two second lenses, and the first image as well as the second image are not parallax images, the second image irrelevant to the first image is saw by the viewer. | 07-05-2012 |
Patent application number | Description | Published |
20140060772 | FLAKE AND METHOD FOR REDUCING TEMPERATURE OF WASTE HEAT DISCHARGED FROM AIR CONDITIONER - The invention provides a flake and method for reducing waste heat using water produced when an air conditioner operates and thereby heat exchange efficiency can increase. Accordingly, an energy-saving effect can be achieved. The flake is placed at an inner bottom side of the air conditioner and between a condenser fan and a condenser coil. When the condenser fan operates, wind power created by the condenser fan has a portion blowing toward the flake, and then blowing toward underlying water, produced when the air conditioner operates, along the flake such that the water can move to the condenser coil and cool the condenser coil. Thereby, the temperature of discharged waste heat can be reduced. When the condenser coil cools, heat exchange efficiency increases. Accordingly, an indoor cooling effect can be improved and an energy-saving effect can be achieved. | 03-06-2014 |
20140242901 | AIRFLOW OUTLET OF AIR-CONDITIONING DEVICE - The present invention provides an airflow outlet of air-conditioning device, which comprises a main body having one end forming an entrance opening and an opposite end forming a plurality of outward-projecting curved ridges. At least one of the curved ridges has a side wall forming at least one through hole to allow air to pass through the through hole. The present invention allows airflows generated by an air-conditioning device to be conducted to the through hole to be discharged therefrom. Since the through hole is formed in a side wall, airflows do not blow directly down as that occurring in the conventional devices and instead blowing sideways so as to eliminate any potential risk of causing discomfort of persons located under the airflow outlet. | 08-28-2014 |
20140374057 | HEAT DISSIPATION DEVICE - The heat dissipation device is installed on a building's exterior wall for blocking and dissipating the heat energy from sun. The heat dissipation device contains a cuboid body, a number of support elements. The cuboid body is hollow with openings on a top side and a bottom side, respectively. The support elements are positioned in the space inside the cuboid body, thereby partitioning the space into a number of heat dissipation channels. The heat dissipation channels independently connect the top and bottom openings of the cuboid body. A number of the heat dissipation devices can be installed on the outer surface of a building's exterior wall. Through the heat convection provided by the heat dissipation devices, the heat energy produced by sun is dissipated and the building's exterior wall is cooled down. The heat dissipation device can also prevent rain from permeating into the building. | 12-25-2014 |
Patent application number | Description | Published |
20120209267 | Support Instrument with Modular Intramedullary Nail - A supporting instrument with modular intramedullary nail comprising a plurality of intramedullary nails and a coupling module is presented. Each intramedullary nail is in a form of a long rod and has a coupling portion arranged between two ends of the intramedullary nail and an abutting surface along a longitudinal face of the intramedullary nail. The coupling module is mounted to the coupling portions of the plurality of intramedullary nails for the abutting surfaces of the plurality of intramedullary nails to abut against each other and assembling the plurality of intramedullary nails. | 08-16-2012 |
20120253346 | Three-Dimension-Extending Intramedullary Nail - A three-dimension-extending intramedullary nail, which is made of memory metal, comprises a rod-shaped body, two distal ends formed at two ends of the rod-shaped body, and a plurality of bent portions on the rod-shaped body and between the two distal ends. Each of the bent portions is bent around a curve center and defines a reference plane whereon the bent portion and the curve center are disposed, and at least two of the reference planes of the bent portions are different. | 10-04-2012 |
20130087460 | Method for Processing a Surface of a Metal Implant and the Metal Implant Produced by the Method - A method for treating a surface of a metal implant includes a polishing step, a grafting step. The polishing step includes polishing a surface of a metal implant to remove an uneven, natural oxide layer on the surface of the metal implant and to generate an even oxide layer on the surface of the metal implant. The grafting step includes grafting an anti-adhesion macromolecule on an outer face of the even oxide layer. A covalent bond between the anti-adhesion macromolecule and oxygen atoms on the outer face of the even oxide layer is formed, thus that a macromolecular anti-adhesion layer on the outer face of the even oxide layer can be created. The surface modifying step includes changing a property of the surface of the metal implant with the macromolecular anti-adhesion layer by high temperature and high pressure, providing the metal implant with high hydrophilicity. | 04-11-2013 |
20140187912 | POSITIONING DEVICE, IMAGE PROJECTING SYSTEM AND METHOD FOR OVERLAPPING IMAGES - A positioning device, an image projecting system and a method for overlapping images are provided. The positioning device is applied to a Computed Tomography process and a Magnetic Resonance Imaging process. The positioning device includes a patch and a positioning mark. The positioning mark is adapted to be mounted on the patch, and includes a Computed Tomography mark and a Magnetic Resonance Imaging mark. | 07-03-2014 |
Patent application number | Description | Published |
20130099314 | Semiconductor Device With Multiple Stress Structures And Method Of Forming The Same - A method of fabricating and a semiconductor device with multiple dislocation structures is disclosed. The exemplary semiconductor device includes gate structure overlying a top surface of a semiconductor substrate and a first gate spacer disposed on a sidewall of the gate structure and overlying the top surface of the substrate. The semiconductor device further includes a crystallized semiconductor material overlying the top surface of the semiconductor substrate and adjacent to a sidewall of the first gate spacer. The semiconductor device further includes a second gate spacer disposed on the sidewall of the first gate spacer and overlying the crystallized semiconductor material. The semiconductor device further includes a first stressor region disposed in the semiconductor substrate and a second stressor region disposed in the semiconductor substrate and in the crystallized semiconductor material. | 04-25-2013 |
20130187221 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A method of forming a semiconductor device includes performing a first pre-amorphous implantation process on a substrate, where the substrate has a gate stack. The method further includes forming a first stress film over the substrate. The method also includes performing a first annealing process on the substrate and the first stress film. The method further includes performing a second pre-amorphous implantation process on the annealed substrate, forming a second stress film over the substrate, and performing a second annealing process on the substrate and the second stress film. | 07-25-2013 |
20140346614 | SEMICONDUCTOR DEVICE - A semiconductor device includes a gate structure over a substrate, a source region in the substrate, where the source region is adjacent to the gate structure. Additionally, the semiconductor device includes a drain region in the substrate, where the drain region is adjacent to the gate structure. Moreover, the semiconductor device includes a first dislocation in the substrate between the source region and the drain region. Furthermore, the semiconductor device includes a second dislocation in the substrate between the source region and the drain region, where the second dislocation is substantially parallel to the first dislocation. | 11-27-2014 |