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Weber, Jr., NY
Gerard Weber, Jr., Saugerties, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20090041079 | Bidirectional and Expandable Heat Flow Measurement Tool for Units of Air Cooled Electrical Equipment - A tool is disclosed, for measuring the important thermal characteristics of a unit of electronic equipment, which obtains air flow and temperature readings at both air inlet and air outlet openings of the unit without disturbing cable or wiring connections or otherwise interrupting device operation. The tool pressure sensing element is rotatable between detented positions to permit the tool to be used at both air inlet and air outlet openings. The tool air duct portion may be formed of separate duct portions to enable a single duct portion including the sensing instrumentation to be used with multiple duct portions that conform to electronic device air inlet and outlet openings to impart added flexibility to the tool. | 02-12-2009 |
Gerard V. Weber, Jr., Poughkeepsie, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20110051372 | STRESS RELIEVED HOSE ROUTING TO LIQUID-COOLED ELECTRONICS RACK DOOR - A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door. | 03-03-2011 |
| 20110056675 | APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) - Apparatuses and methods are presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies. | 03-10-2011 |
Gerard V. Weber, Jr., Saugerties, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20090154159 | LIGHT SOURCE FOR ILLUMINATING AN ELECTRONICS RACK TO FACILITATE SERVICING THEREOF - An apparatus is provided for facilitating servicing of an electronics rack. The apparatus includes a light source, which includes a plurality of light-emitting diodes. The plurality of light-emitting diodes are secured to the electronics rack or a floor tile disposed adjacent to the electronics rack, and are configured to illuminate at least a lower portion of the electronics rack at either the air inlet or air outlet side of the rack. A power supply is also provided for selectively supplying power to the plurality of light-emitting diodes. In one implementation, the light source includes an elongate light bar, which is configured to mount to either the inlet door or outlet door of the electronics rack, and the plurality of light-emitting diodes are secured to an elongate housing structure which pivotally couples to a base plate for adjustment of a direction of illumination by the light-emitting diodes. | 06-18-2009 |
| 20090156114 | APPARATUS AND METHOD FOR FACILITATING AIR COOLING OF AN ELECTRONICS RACK - Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly. | 06-18-2009 |
| 20090157333 | METHOD AND SYSTEM FOR AUTOMATED ENERGY USAGE MONITORING WITHIN A DATA CENTER - An automated method and system are provided for facilitating monitoring of energy usage within a data center. The method includes automatically determining energy usage of one or more electronics racks of a data center by automatically ascertaining time-based energy usage of the electronics racks. The automatically ascertaining includes obtaining multiple measurements of instantaneous energy usage by each of the electronics racks in the data center over a period of time, and then separately averaging the multiple measurements for each electronics rack to obtain the time-based energy usage of each electronics racks. The method also includes outputting the time-based energy usage of the electronic(s) racks to facilitate monitoring of the data center. | 06-18-2009 |
Gerard Vincent Weber, Jr., Saugerties, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20100029193 | METHOD FOR PREVENTING AIR RECIRCULATION AND OVERSUPPLY IN DATA CENTERS - A method for preventing air recirculation in a data center is provided. The method includes specifying a target temperature of IT equipment and a flow volume of cold air entering an IT equipment rack, detecting an under-floor air temperature using a first temperature sensor provided in an under-floor plenum positioned adjacent to a cooling mechanism, detecting an IT equipment inlet temperature using a second temperature sensor positioned adjacent to a top portion of an IT equipment rack including the IT equipment, the IT equipment rack formed on a floor surface of the data center, the floor surface separating the under-floor plenum from the IT equipment rack, removing warm air exhausted from the IT equipment rack into a CRAC, chilling the warm air removed into the CRAC, the warm air being transformed by the CRAC into the cold air, exhausting the cold air from the CRAC to the under-floor plenum, controlling the cooling mechanism to regulate a cooling mechanism flow volume of the cold air in the under-floor plenum to the IT equipment rack such that the target temperature of IT equipment approximates the IT equipment inlet temperature and the cooling mechanism flow volume of the cold air equals the flow volume of the cold air entering into the IT equipment rack, and drawing the cold air into the IT equipment rack, the cold air being transformed by heat generated by the IT equipment into the warm air. | 02-04-2010 |
| 20100195694 | Heat Flow Measurement Tool for a Rack Mounted Assembly of Electronic Equipment - A rack mount assembly measurement tool, for determining physical values including air flow and heat loads, includes a front assembly and a rear duct assembly that are non-intrusively and releasably mounted on the front and rear of such rack mount enclosure. Physical values are sensed at multiple vertical locations to enable a determination of overall and localized heat loads within the enclosure. Front sensor values are collected and wirelessly transmitted from the front assembly to a receiver/processor supported on the rear duct, which generates computed values that are displayed in addition to the sensed values. | 08-05-2010 |