Patent application number | Description | Published |
20090093371 | MEMBRANE ARRAYS AND METHODS OF MANUFACTURE - The invention relates to G protein-coupled receptor (GPCR) microarrays on porous substrates for structural or functional analyses of GPCRs, and methods of preparing porous substrate surfaces for receiving membranes that comprise GPCRs. In one embodiment, a GPCR microarray of the invention comprises a membrane adhered to an upper surface of a porous substrate, the membrane spanning across a plurality of pores on the porous substrate to form a plurality of cavities having sufficient geometry to permit entry of assay reagents into each cavity, thereby allowing access of assay reagents to both sides of GPCR in the membrane. | 04-09-2009 |
20090186776 | Microcolumn-platform based array for high-throughput analysis - A device and methods for performing biological or chemical analysis is provided. The device includes an array of three-dimensional microcolumns projecting away from a support plate. Each microcolumn has a relatively planar, first surface remote from the support plate. An array of multiple, different biological materials may be attached to the first surface. The device, when used in combination with existent micro-titer well plates, can improve efficiency of binding assays using microarrays for high-throughput capacity. | 07-23-2009 |
20100152060 | ASSAY SOLUTION COMPOSITIONS AND METHODS FOR GPCR ARRAYS - Buffered assay solutions for performing 1) binding or 2) functional assays on GPCR arrays, along with methods for their use are described. The buffered assay solution has an underlying composition having: a buffer reagent with a pH in the range of about 6.5 to about 7.9; an inorganic salt of either a monovalent or divalent species, at a concentration from about 1 mM to about 500 mM; and optionally a combination of: c) a blocker reagent at a concentration of about 0.01 wt. % to about 2 wt. % of the composition, or d) protease-inhibitor at a concentration of about 0.001 mM to about 100 mM. In an embodiment for functional assay uses, the composition is modified to also include a GTP-analogue, a guanosine 5′-diphosphate (GDP) salt, and/or an anti-oxidant reagent. | 06-17-2010 |
20100323915 | Porous Substrate Plates And The Use Thereof - A substrate plate or device adapted for use with biological or chemical assays is disclosed. The device may take the form of a multi-well plate having a three-dimensional, porous layer as part of a support surface within each well for immobilizing probe species. The porous layer is characterized as having a plurality of interconnected voids defined by a matrix of contiguous solid material. A method and its variants are also described. | 12-23-2010 |
20120083428 | Method and Device for Protein Delivery into Cells - Methods for performing surface-mediated protein delivery into living cells, and fabricating protein-transfected cell cluster arrays are provided. The method comprises providing a protein-containing mixture; depositing said protein-containing mixture onto a surface at defined locations; affixing the protein-containing mixture to the surface as microspots; and plating cells onto the surface in sufficient density and under conditions for the proteins to be delivered into the cells. The protein-containing mixture comprises any suitable amino acid sequence, including peptides, proteins, protein-domains, antibodies, or protein-nucleic acid conjugates, etc., with a carrier reagent. Protein-transfected cell arrays may be used for rapid and direct, screening of protein or enzymatic functions or any given intracellular protein interaction in the natural environment of a living cell, as well as for high-throughput screening of other biological and chemical analytes, which affect the functions of these proteins. | 04-05-2012 |
20120088695 | Method and Device for Protein Delivery into Cells - Methods for performing surface-mediated protein delivery into living cells, and fabricating protein-transfected cell cluster arrays are provided. The method comprises providing a protein-containing mixture; depositing said protein-containing mixture onto a surface at defined locations; affixing the protein-containing mixture to the surface as microspots; and plating cells onto the surface in sufficient density and under conditions for the proteins to be delivered into the cells. The protein-containing mixture comprises any suitable amino acid sequence, including peptides, proteins, protein-domains, antibodies, or protein-nucleic acid conjugates, etc., with a carrier reagent. Protein-transfected cell arrays may be used for rapid and direct, screening of protein or enzymatic functions or any given intracellular protein interaction in the natural environment of a living cell, as well as for high-throughput screening of other biological and chemical analytes, which affect the functions of these proteins. | 04-12-2012 |
Patent application number | Description | Published |
20090294955 | COOLING DEVICE WITH A PREFORMED COMPLIANT INTERFACE - An integrated circuit package includes: a substrate; an electronic circuit located on the substrate, the electronic circuit comprising a topography of at least one level; a cooling device located over the electronic circuit; a compliant interface disposed between the electronic circuit and the cooling device, wherein the compliant interface comprises a first surface and a second surface and wherein the first surface is in thermal contact with the electronic circuit, and wherein the compliant interface is preformed from a compliant material such that the first surface substantially conforms to the topography of the electronic circuit. | 12-03-2009 |
20100276796 | REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD - An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal expansivity, and the interposer and integrated circuit chip are fabricated of a second material having a second thermal expansivity. The second thermal expansivity is different from the first thermal expansivity so that there is a coefficient of thermal expansion mismatch between the substrate and the interposer or chip. The interposer is coupled to the substrate via a first plurality of electrical contacts and an underfill adhesive at least partially surrounding the electrical contacts to bond the interposer to the substrate and thereby reduce strain on the first plurality of electrical contacts. The integrated circuit chip is coupled to the interposer via a second plurality of electrical contacts only, without use of an adhesive surrounding the second plurality of electrical contacts. | 11-04-2010 |
20110102116 | MAGNETIC WRITER HAVING MULTIPLE GAPS WITH MORE UNIFORM MAGNETIC FIELDS ACROSS THE GAPS - A magnetic device according to one embodiment includes a source of flux; a magnetic pole coupled to the source of flux, the magnetic pole having two or more gaps; and a low reluctance path positioned towards at least one of the gaps and not positioned towards at least one other of the gaps for affecting a magnetic field formed at the at least one of the gaps when the source of flux is generating flux. Other disclosed embodiments include devices having coil turns with a non-uniform placement in the magnetic yoke for altering a magnetic field formed at the at least one of the gaps during writing. In further embodiments, a geometry of the magnetic pole near or at one of the gaps is different than a geometry of the magnetic pole near or at another of the gaps to help equalize fields formed at the gaps when the source of flux is generating flux. | 05-05-2011 |
20120292779 | SEMICONDUCTOR STRUCTURE HAVING OFFSET PASSIVATION TO REDUCE ELECTROMIGRATION - A semiconductor structure which includes a plurality of stacked semiconductor chips in a three dimensional configuration. There is a first semiconductor chip in contact with a second semiconductor chip. The first semiconductor chip includes a through silicon via (TSV) extending through the first semiconductor chip; an electrically conducting pad at a surface of the first semiconductor chip, the TSV terminating in contact at a first side of the electrically conducting pad; a passivation layer covering the electrically conducting pad, the passivation layer having a plurality of openings; and a plurality of electrically conducting structures formed in the plurality of openings and in contact with a second side of the electrically conducting pad, the contact of the plurality of electrically conducting structures with the electrically conducting pad being offset with respect to the contact of the TSV with the electrically conducting pad. | 11-22-2012 |
20130207765 | INTEGRATED TRANSFORMERS - Systems, methods and devices directed to transformers are disclosed. One transformer system includes a set of transformer cells and a controller. The set of transformer cells is coupled in series to form a series coupling, where each transformer cell includes at least one first coil and at least one second coil. The second coil is configured to receive electrical energy from the first coil through magnetic interaction. The controller is configured to modify electrical aspects at ends of the series coupling by independently driving the transformer cells such that at least one of the transformer cells is driven differently from at least one other transformer cell in the set. | 08-15-2013 |
20130334701 | THROUGH SILICON VIA WAFER AND METHODS OF MANUFACTURING - A through silicon via with sidewall roughness and methods of manufacturing the same are disclosed. The method includes forming a via in a substrate and roughening a sidewall of the via by depositing material within the via. The method further includes removing a backside of the substrate to form a through via with a roughened sidewall structure. | 12-19-2013 |
20140087557 | THROUGH SILICON VIA WAFER, CONTACTS AND DESIGN STRUCTURES - Disclosed herein are through silicon vias (TSVs) and contacts formed on a semiconductor material, methods of manufacturing, and design structures. The method includes forming a contact hole in a dielectric material formed on a substrate. The method further includes forming a via in the substrate and through the dielectric material. The method further includes lining the contact hole and the dielectric material with a metal liner using a deposition technique that will avoid formation of the liner in the viaformed in the substrate. The method further includes filling the contact hole and the via with a metal such that the metal is formed on the liner in the contact hole and directly on the substrate in the via. | 03-27-2014 |
20140216939 | LAMINATING MAGNETIC CORES FOR ON-CHIP MAGNETIC DEVICES - A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer. | 08-07-2014 |
20140216943 | LAMINATING MAGNETIC CORES FOR ON-CHIP MAGNETIC DEVICES - A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer. | 08-07-2014 |
20140284816 | THROUGH SILICON VIA WAFER, CONTACTS AND DESIGN STRUCTURES - Disclosed herein are through silicon vias (TSVs) and contacts formed on a semiconductor material, methods of manufacturing, and design structures. The method includes forming a contact hole in a dielectric material formed on a substrate. The method further includes forming a via in the substrate and through the dielectric material. The method further includes lining the contact hole and the dielectric material with a metal liner using a deposition technique that will avoid formation of the liner in the viaformed in the substrate. The method further includes filling the contact hole and the via with a metal such that the metal is formed on the liner in the contact hole and directly on the substrate in the via. | 09-25-2014 |
20140312467 | THROUGH-VIAS FOR WIRING LAYERS OF SEMICONDUCTOR DEVICES - Through-via structures and methods of their formation are disclosed. One such structure includes a conductor structure, a dielectric via lining and a stress-abating dielectric material. The conductor structure is formed of conducting material extending through a wiring layer of a semiconductor device and through a semiconductor layer below the wiring layer. Here, the wiring layer of the semiconductor device includes a first dielectric material. The dielectric via lining extends along the conductor structure at least in the semiconductor layer. Further, the stress-abating dielectric material is disposed between the conductor structure and the first dielectric material in at least the wiring layer, where the stress-abating dielectric material is disposed over portions of the semiconductor layer that are outside outer boundaries of the via lining. | 10-23-2014 |
20140312502 | THROUGH-VIAS FOR WIRING LAYERS OF SEMICONDUCTOR DEVICES - Through-via structures and methods of their formation are disclosed. In one such method, a first etch through at least a first dielectric material of a wiring layer is performed such that a first hole outlining a collar structure for the through-via is formed. In addition, a stress-abating dielectric material is deposited in the hole such that the stress-abating dielectric material is disposed at least laterally from the first dielectric material. Further, a second etching through at least a semiconductor material of a semiconductor layer that is disposed below the wiring layer is performed, where the second etching forms a via hole in the semiconductor material. Additionally, at least a portion of the via hole is filled with conductive material to form the through-via such that the stress-abating dielectric material, at least in the wiring layer, provides a buffer between the conductive material and the first dielectric material. | 10-23-2014 |
20150097297 | SEMICONDUCTOR ARTICLE HAVING A ZIG-ZAG GUARD RING - A semiconductor article which includes a semiconductor base portion including a semiconductor material; a back end of the line (BEOL) wiring portion on the semiconductor base portion and comprising a plurality of wiring layers having metallic wiring and insulating material, said BEOL wiring portion excluding a semiconductor material; and a guard ring in the BEOL wiring portion and surrounding a structure in the semiconductor chip, the guard ring having a zig-zag configuration. | 04-09-2015 |
20150200231 | MAGNETIC MULTILAYER STRUCTURE - A mechanism is provided for an integrated laminated magnetic device. A substrate and a multilayer stack structure form the device. The multilayer stack structure includes alternating magnetic layers and diode structures formed on the substrate. Each magnetic layer in the multilayer stack structure is separated from another magnetic layer in the multilayer stack structure by a diode structure. | 07-16-2015 |
Patent application number | Description | Published |
20080265428 | VIA AND SOLDER BALL SHAPES TO MAXIMIZE CHIP OR SILICON CARRIER STRENGTH RELATIVE TO THERMAL OR BENDING LOAD ZERO POINT - A method of modifying via and solder ball shapes for maximizing semiconductor chip or silicon carrier strengths relative to thermal expansion and bending load zero points. The method entails modifying circular annular vias into elliptical annular vias so as to reduce stress concentration factors in the chip or carrier at the vias and solder balls. The reduction in the stress concentration is effected in the semiconductor chip or silicon carrier in regions proximate the vias and in wiring layers at the ends of the vias. | 10-30-2008 |
20080298016 | COOLING AN ELECTRONIC DEVICE UTILIZING SPRING ELEMENTS WITH FINS - A method for cooling an electronic device includes forming a spring structure by coupling a plurality of spring elements with a fin portion oriented at an angle, wherein a first end of the fin portion has a narrowed tip; coupling the spring structure with a planar heat-conducting material to form a first heat-conducting layer; positioning the first heat-conducting layer such that the planar heat-conducting material is on top; and placing the first heat-conducting layer over the electronic device such that the fin portion is oriented at an angle toward the electronic device, and such that the narrowed tip of the fin portion is in contact with the top surface of the electronic device. | 12-04-2008 |
20090027860 | COOLING DEVICE WITH A PREFORMED COMPLIANT INTERFACE - An integrated circuit package includes: a substrate; an electronic circuit located on the substrate, the electronic circuit comprising a topography of at least one level; a cooling device located over the electronic circuit; a compliant interface disposed between the electronic circuit and the cooling device, wherein the compliant interface comprises a first surface and a second surface and wherein the first surface is in thermal contact with the electronic circuit, and wherein the compliant interface is preformed from a compliant material such that the first surface substantially conforms to the topography of the electronic circuit. | 01-29-2009 |
20110108958 | Metal Oxide Semiconductor (MOS)-Compatible High-Aspect Ratio Through-Wafer Vias and Low-Stress Configuration Thereof - A structure includes a wafer having a top wafer surface. The wafer defines an opening. The top wafer surface defines a first reference direction perpendicular to the top wafer surface. The wafer has a thickness in the first reference direction. The structure also includes a through-wafer via formed in the opening. The through-wafer via has a shape, when viewed in a plane perpendicular to the first reference direction and parallel to the top wafer surface, of at least one of a spiral and a C-shape. The through-wafer via has a height in the first reference direction essentially equal to the thickness of the wafer in the first reference direction. Manufacturing techniques are also disclosed. | 05-12-2011 |
20110171756 | REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD - An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal expansivity, and the interposer and integrated circuit chip are fabricated of a second material having a second thermal expansivity. The second thermal expansivity is different from the first thermal expansivity so that there is a coefficient of thermal expansion mismatch between the substrate and the interposer or chip. The interposer is coupled to the substrate via a first plurality of electrical contacts and an underfill adhesive at least partially surrounding the electrical contacts to bond the interposer to the substrate and thereby reduce strain on the first plurality of electrical contacts. The integrated circuit chip is coupled to the interposer via a second plurality of electrical contacts only, without use of an adhesive surrounding the second plurality of electrical contacts. | 07-14-2011 |
20130039733 | PICK AND PLACE TAPE RELEASE FOR THIN SEMICONDUCTOR DIES - Pick and place tape release techniques and tools that allow thin, fragile semiconductor dies to be removed from wafer tape with reduced tape release forces applied to the semiconductor dies. For example, a method for removing semiconductor die from wafer tape includes mounting a wafer ring having wafer tape and one or more dies attached to the wafer tape, and aligning an ejector pin assembly under a target die to be removed from the wafer tape. The ejector pin assembly includes a vacuum housing, an ejector pin, a suction plate, and an aperture formed in the suction plate in alignment with the ejector pin. A vacuum is generated in the vacuum housing to draw the tape against a surface of the suction plate. The ejector pin is extended through the vacuum housing out from the aperture of the suction plate to push against a backside of the target die and release the tape from the backside of the target die, and as the tape is released from the backside of the target die, the tape is drawn down against the suction plate by suction force of the vacuum. | 02-14-2013 |
20130093032 | SEMICONDUCTOR TRENCH INDUCTORS AND TRANSFORMERS - Semiconductor trench inductor and transformer structures are provided, which include thin film conductive layers and magnetic layers formed within trenches etched in semiconductor substrates. Semiconductor trench devices effectively provide vertical oriented inductor and transformer structures whereby conductive coils and magnetic layers are vertically oriented on edge within trenches, thereby providing a space-saving compact design, and which allows the conductive layers within the trench to be enclosed by magnetic material, thereby providing a density of magnetic material that increases the storable energy density. | 04-18-2013 |
20130106552 | INDUCTOR WITH MULTIPLE POLYMERIC LAYERS | 05-02-2013 |
20130120872 | MAGNETIC WRITER HAVING MULTIPLE GAPS WITH MORE UNIFORM MAGNETIC FIELDS ACROSS THE GAPS - A magnetic device according to one embodiment includes a source of flux; a magnetic pole coupled to the source of flux, the magnetic pole having two or more gaps; and a low reluctance path positioned towards at least one of the gaps and not positioned towards at least one other of the gaps for affecting a magnetic field formed at the at least one of the gaps when the source of flux is generating flux. Other disclosed embodiments include devices having coil turns with a non-uniform placement in the magnetic yoke for altering a magnetic field formed at the at least one of the gaps during writing. In further embodiments, a geometry of the magnetic pole near or at one of the gaps is different than a geometry of the magnetic pole near or at another of the gaps to help equalize fields formed at the gaps when the source of flux is generating flux. | 05-16-2013 |
20130176095 | INDUCTOR WITH LAMINATED YOKE - A thin film inductor having yokes, one or more of which is laminated, and one or more conductors passing between the yokes. The laminated yoke or yokes help reduce eddy currents and/or hysteresis losses. | 07-11-2013 |
20130314192 | INDUCTOR WITH STACKED CONDUCTORS - A thin film coupled inductor, a thin film spiral inductor, and a system that includes an electronic device and a power supply or power converter incorporating one or more such inductors. A thin film coupled inductor includes a wafer substrate; a bottom yoke comprising a magnetic material above the wafer substrate; a first insulating layer above the bottom yoke; a first conductor above the bottom yoke and separated therefrom by the first insulating layer; a second insulating layer above the first conductor; a second conductor above the second insulating layer; a third insulating layer above the second conductor; and a non-planar top yoke above the third insulating layer, the top yoke comprising a magnetic material. | 11-28-2013 |
20140013606 | UNDERFILL MATERIAL DISPENSING FOR STACKED SEMICONDUCTOR CHIPS - A template having tapered openings can be employed to enable injection of underfill material through gaps having a width less than a lateral dimension of an injector needle for the underfill material. Each tapered opening has a first lateral dimension on an upper side and a second lateral dimension on a lower side. Compliant material portions can be employed to accommodate variations in distance between the template and stacked semiconductor chips and/or an injector head. Optionally, another head can be employed to apply compressed gas to push out the underfill material after the underfill material is applied to the gaps. Multiple injector heads can be employed to simultaneously inject the underfill material at different sites. An adhesive layer can be substituted for the at least one lower compliant material portion. | 01-16-2014 |
20140026431 | UNDERFILL MATERIAL DISPENSING FOR STACKED SEMICONDUCTOR CHIPS - A template having tapered openings can be employed to enable injection of underfill material through gaps having a width less than a lateral dimension of an injector needle for the underfill material. Each tapered opening has a first lateral dimension on an upper side and a second lateral dimension on a lower side. Compliant material portions can be employed to accommodate variations in distance between the template and stacked semiconductor chips and/or an injector head. Optionally, another head can be employed to apply compressed gas to push out the underfill material after the underfill material is applied to the gaps. Multiple injector heads can be employed to simultaneously inject the underfill material at different sites. An adhesive layer can be substituted for the at least one lower compliant material portion. | 01-30-2014 |
20140061853 | PLATED LAMINATION STRUCTURES FOR INTEGRATED MAGNETIC DEVICES - Semiconductor integrated magnetic devices such as inductors, transformers, etc., having laminated magnetic-insulator stack structures are provided, wherein the laminated magnetic-insulator stack structures are formed using electroplating techniques. For example, an integrated laminated magnetic device includes a multilayer stack structure having alternating magnetic and insulating layers formed on a substrate, wherein each magnetic layer in the multilayer stack structure is separated from another magnetic layer in the multilayer stack structure by an insulating layer, and a local shorting structure to electrically connect each magnetic layer in the multilayer stack structure to an underlying magnetic layer in the multilayer stack structure to facilitate electroplating of the magnetic layers using an underlying conductive layer (magnetic or seed layer) in the stack as an electrical cathode/anode for each electroplated magnetic layer in the stack structure. | 03-06-2014 |
20140126078 | MAGNETIC WRITER HAVING MULTIPLE GAPS WITH MORE UNIFORM MAGNETIC FIELDS ACROSS THE GAPS - A magnetic device according to one embodiment includes a source of flux; a magnetic pole having two or more gaps; and a low reluctance path positioned towards at least one of the gaps and riot positioned towards at least one other of the gaps for affecting a magnetic field formed at the at least one of the gaps when the source of flux is generating flux. Other disclosed embodiments include devices having coil turns with a non-uniform placement in the magnetic yoke for altering a magnetic field formed at the at least one of the gaps during writing. In further embodiments, a geometry of the magnetic pole near or at one of the gaps is different than a geometry of the magnetic pole near or at another of the gaps to help equalize fields formed at the gaps when the source of flux is generating flux. | 05-08-2014 |
20140190003 | INDUCTOR WITH LAMINATED YOKE - A method for forming a thin film inductor having yokes, one or more of which is laminated, and one or more conductors passing between the yokes. The laminated yoke or yokes help reduce eddy currents and/or hysteresis losses. | 07-10-2014 |
20150061815 | PLANAR INDUCTORS WITH CLOSED MAGNETIC LOOPS - A planar closed-magnetic-loop inductor and a method of fabricating the inductor are described. The inductor includes a first material comprising a cross-sectional shape including at least four segments, at least one of the at least four segments including a first edge and a second edge on opposite sides of an axial line through the at least one of the at least four segments. The first edge and the second edge are not parallel. | 03-05-2015 |
20150064362 | PLANAR INDUCTORS WITH CLOSED MAGNETIC LOOPS - A planar closed-magnetic-loop inductor and a method of fabricating the inductor are described. The inductor includes a first material comprising a cross-sectional shape including at least four segments, at least one of the at least four segments including a first edge and a second edge on opposite sides of an axial line through the at least one of the at least four segments. The first edge and the second edge are not parallel. | 03-05-2015 |
Patent application number | Description | Published |
20090050486 | Enhanced Magnetic Plating Method and Apparatus - An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate. | 02-26-2009 |
20090079071 | STRESS RELIEF STRUCTURES FOR SILICON INTERPOSERS - An electronic device and method of making the device. The device includes: a carrier; a silicon interposer connected to a top surface of the carrier, the interposer having wires extending from a top surface of the interposer, through the interposer, to a bottom surface of the interposer, the wires at the bottom surface of the interposer electrically connected to wires in a top surface of the carrier; an integrated circuit chip connected to the top surface of the interposer, wires at a surface of the integrated circuit chip electrically connected to the wires in the top surface of the interposer; and a stress relief structure attached to the interposer, the stress relief structure either (i) not electrically connected to the wires of the interposer or integrated circuit chip or (ii) electrically connected to ground by wires of the interposer or wires of the integrated circuit chip. | 03-26-2009 |
20100188774 | PLANAR MAGNETIC WRITER HAVING OFFSET PORTIONS - A magnetic head in one embodiment includes a bottom pole; a top pole positioned above a plane extending through the bottom pole and parallel to a plane of deposition of the bottom pole, wherein the top pole is at least partially offset from the bottom pole in a direction parallel to a plane of deposition of the top pole; a first write gap in the top pole; and a first coil for generating a magnetic flux across the first write gap. A method in one embodiment includes forming a bottom pole; forming a top pole above a plane extending through the bottom pole and parallel to a plane of deposition of the bottom pole, wherein the top pole is at least partially offset from the bottom pole in a direction parallel to a plane of deposition of the top pole, wherein at least one write gap is formed in the top pole; forming side poles for coupling the top and bottom poles; and forming a first coil for generating a magnetic flux across the first write gap. | 07-29-2010 |
20100276786 | Through Substrate Vias - Methods and apparatus for forming through-vias are presented, for example, a method for forming a via in a portion of a semiconductor wafer comprising a substrate. The method comprises forming a trench surrounding a first part of the substrate such that the first part is separated from a second part of the substrate, forming a hole through the substrate within the first part, and forming a first metal within the hole. The trench extends through the substrate. The first metal extends from a front surface of the substrate to a back surface of the substrate. The via comprises the hole and the first metal. | 11-04-2010 |
20110220020 | ENHANCED MAGNETIC PLATING METHOD - An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate. | 09-15-2011 |
20120217651 | THROUGH SUBSTRATE VIAS - Methods and apparatus for forming through-vias are presented, for example, a method for forming a via in a portion of a semiconductor wafer comprising a substrate. The method comprises forming a trench surrounding a first part of the substrate such that the first part is separated from a second part of the substrate, forming a hole through the substrate within the first part, and forming a first metal within the hole. The trench extends through the substrate. The first metal extends from a front surface of the substrate to a back surface of the substrate. The via comprises the hole and the first metal. | 08-30-2012 |
Patent application number | Description | Published |
20100052863 | RFID-based systems and methods for collecting telecommunications network information - Radio-frequency identification—(RFID)-based systems and methods for collecting telecommunications information is disclosed. The methods include storing transceiver information in a transceiver and connector information in an optical fiber connector, and then operably connecting the connector to the transceiver. The connection results in an electrical connection that allows the transceiver information to be communicated to the connector. The connector has a RFID tag that generates a connector RFID-tag signal that includes the connector information and the transceiver information. When electronics equipment are connected to the transceiver, electronics-equipment information is passed through the transceiver to the connector so that the electronics-equipment information can be included in the connector RFID-tag signal. The transceiver may also include a transceiver RFID tag that can receive connector information and electronics-equipment information and generate a transceiver RFID-tag signal that includes connector, transceiver and/or electronics-equipment information. A Portable test device is also used to connect to the transceiver or the electronics equipment to effectuate the transfer of transceiver and/or electronics-equipment information. | 03-04-2010 |
20120134666 | OPTICAL FIBER-BASED DISTRIBUTED ANTENNA SYSTEMS, COMPONENTS, AND RELATED METHODS FOR MONITORING AND CONFIGURING THEREOF - Optical fiber-based wireless systems and related components and methods are disclosed. The systems support radio frequency (RF) communications with clients over optical fiber, including Radio-over-Fiber (RoF) communications. The systems may be provided as part of an indoor distributed antenna system (IDAS) to provide wireless communication services to clients inside a building or other facility. The communications can be distributed between a head end unit (HEU) that receives carrier signals from one or more service or carrier providers and converts the signals to RoF signals for distribution over optical fibers to end points, which may be remote antenna units (RAUs). A microprocessor-based control system or systems may also be employed. The control systems may include one or more microprocessors or microcontrollers in one or more of the components of the system that execute software instructions to control the various components and provide various features for the optical fiber-based distributed antenna systems. | 05-31-2012 |
20120134673 | OPTICAL FIBER-BASED DISTRIBUTED ANTENNA SYSTEMS, COMPONENTS, AND RELATED METHODS FOR CALIBRATION THEREOF - Optical fiber-based wireless systems and related components and methods are disclosed. The systems support radio frequency (RF) communications with clients over optical fiber, including Radio-over-Fiber (RoF) communications. The systems may be provided as part of an indoor distributed antenna system (IDAS) to provide wireless communication services to clients inside a building or other facility. The communications can be distributed between a head end unit (HEU) that receives carrier signals from one or more service or carrier providers and converts the signals to RoF signals for distribution over optical fibers to end points, which may be remote antenna units (RAUs). In one embodiment, calibration of communication downlinks and communication uplinks is performed to compensate for signal strength losses in the system. | 05-31-2012 |
20130328666 | RFID-BASED SYSTEMS AND METHODS FOR COLLECTING TELECOMMUNICATIONS NETWORK INFORMATION - Radio-frequency identification-(RFID)-based systems and methods for collecting telecommunications information is disclosed. The methods include storing transceiver information in a transceiver and connector information in an optical fiber connector, and then operably connecting the connector to the transceiver. The connection results in an electrical connection that allows the transceiver information to be communicated to the connector. The connector has a RFID tag that generates a connector RFID-tag signal that includes the connector information and the transceiver information. When electronics equipment are connected to the transceiver, electronics-equipment information is passed through the transceiver to the connector so that the electronics-equipment information can be included in the connector RFID-tag signal. The transceiver may also include a transceiver RFID tag that can receive connector information and electronics-equipment information and generate a transceiver RFID-tag signal that includes connector, transceiver and/or electronics-equipment information. A Portable test device is also used to connect to the transceiver or the electronics equipment to effectuate the transfer of transceiver and/or electronics-equipment information. | 12-12-2013 |
Patent application number | Description | Published |
20090195363 | RFID SYSTEMS AND METHODS FOR AUTOMATICALLY DETECTING AND/OR DIRECTING THE PHYSICAL CONFIGURATION OF A COMPLEX SYSTEM - A radio-frequency identification (RFID)-based configuration detection system for automatically detecting, directing, and/or configuring the physical configuration of a complex system constituted by a set of one or more types of mateable components. The RFID configuration detection system utilizes a set of mateable RFID tags arranged so that each mateable component includes at least one mateable RFID tag. Each RFID tag includes information about its associated component and is arranged so that when the components are mated, their associated RFID tags also are mated. The system uses at least one RFID reader to read RFID tag signals from the RFID tags. The RFID tag signals provide information about mating status of the component, as well as information about components themselves. An information processing system operably connected to the RFID reader receives and process information concerning the number and type of mated connections and thus the configuration. Changes to the configuration, such as mated connections being unmated, can be tracked to provide real-time configuration information. | 08-06-2009 |
20100051817 | Systems and methods for determining the shape of glass sheets - Disclosed are systems and methods for determining the shape of a glass sheet during and/or after the forming process. In one example, a system for determining the shape of a glass sheet defining an interior bulk can include a light source, an image capture device and a processor that are configured to calculate the location of an energy centroid within a selected portion of the bulk of the glass sheet. | 03-04-2010 |
20100245057 | COMPONENTS, SYSTEMS, AND METHODS FOR ASSOCIATING SENSOR DATA WITH COMPONENT LOCATION - Components having one or more sensors adapted to provide sensor data relating to a condition(s) of the component are disclosed. The component is adapted to communicate with another mating component to associate sensor data with identity information of the mating component. The sensor and identity information can be communicated remotely including via radio-frequency communications employing RF identification devices (RFIDs). Location of the mating component can be determined using the identity information of the mating component. In this manner, the sensor data can be associated with the location of the mating component using the identity information in a “component-to-component” configuration to provide location-specific sensor data. Having the ability to localize sensor data to a specific location can assist in pinpointing areas where performance or other condition issues may exist in a component, a mating component, an article of manufacture associated with the components, and/or communication and/or transmissions lines coupled between components. | 09-30-2010 |
20110140856 | RFID Condition Latching - A passive radio-frequency identification (RFID) system has an RFID reader that communicates with and provides power to an RFID tag. The RFID tag has an RFID integrated circuit chip that contains a memory device for storing information to be transmitted to the RFID reader, and energy storage device that stores energy for powering the integrated circuit chip. In the event that the RFID tag is activated during periods when the RFID integrated circuit chip is not receiving sufficient energy from the RFID reader, then either an energy storage device is provided to allow the activation event to be recorded at the RFID integrated circuit chip, or a memory device is provided that senses and records the activation event and communicates this activation event once power has been restored. | 06-16-2011 |
20120126949 | Radio Frequency Identification (RFID) Connected Tag Communications Protocol And Related Systems And Methods - Protocols, systems, and methods are disclosed for two or more RFID tags to communicate with each other using direct connections, wherein the two or more RFID tags are configured to mate and directly exchange identification information. A disclosed method includes detecting that a first RFID tag is connected to a second RFID tag. A first message comprising a first tag identification is sent directly from the first RFID tag to the second RFID tag, and the first RFID tag receives a first acknowledgement from the second RFID tag if the first tag identification was correctly received. A second message comprising a second tag identification may be sent directly from the second RFID tag to the first RFID tag and a second acknowledgement may be received from the first RFID tag if the second tag identification was correctly received. | 05-24-2012 |
20120126950 | Protocol For Communications Between A Radio Frequency Identification (RFID) Tag And A Connected Device, And Related Systems And Methods - Protocols, systems, and methods are disclosed for at least one RFID tag and a device, to communicate with each other using direct connections, wherein the at least one RFID tag and the device are configured to mate and directly exchange identification information. A message comprising a tag identification may be sent directly from the RFID tag to the device, and the RFID tag may receive a first acknowledgement from the device if the first tag identification was correctly received. A connection may be detected between the RFID tag and the device prior to directly exchanging information. The exchange of information may include sending data from the device to the RFID tag. | 05-24-2012 |
20120133490 | Communications Between Multiple Radio Frequency Identification (RFID) Connected Tags And One Or More Devices, And Related Systems And Methods - Protocols, systems, and methods are disclosed for two or more RFID tags to communicate with each other and a device using direct connections. A disclosed system includes a first RFID tag, a second RFID tag, and a device. The first and second RFID tags are configured to mate to each other and directly exchange information. The second RFID tag is further configured to directly exchange information with the device such that information received directly at the second RFID tag from the first RFID tag may then be directly exchanged with the device. The first RFID tag may send a first tag identification directly from the first RFID tag to the second RFID tag. The second RFID tag may then send a first acknowledgement to the first RFID tag if the first tag identification was correctly received by the second RFID tag. | 05-31-2012 |
20120274452 | RADIO FREQUENCY (RF)-ENABLED LATCHES AND RELATED COMPONENTS, ASSEMBLIES, SYSTEMS, AND METHODS - Radio frequency (RF)-enabled latches and related components, assemblies, systems, and methods are disclosed that affect control of mating and/or demating of components. In one embodiment, a component is provided that includes a body configured to be mated to a second component to establish a connection. A latch is disposed in the body and configured to either affect demating of the body from the second component or mating of the body to the second component, when the latch is not actuated. A transponder disposed in the body can be configured to actuate the latch to either affect demating of the body from the second component or mating of the body to the second component. The transponder can also be configured to actuate the latch based on the identification information of the second transponder received through the communication connection or lack of receiving identification information from a second transponder or reader. | 11-01-2012 |
20120326844 | RADIO-FREQUENCY IDENTIFICATION (RFID) TAG EVENT OCCURRENCE DETECTION, REPORTING, AND MONITORING, AND RELATED RFID READERS, SYSTEMS, AND METHODS - Disclosed herein are radio-frequency identification (RFID) tag event occurrence detection, generation, and monitoring. Related components, RFID readers, systems, and methods are also disclosed. The RFID tags are configured to sense an event(s) that occurred in the RFID tag or in proximity thereto. In response, the RFID tags are configured to set an event occurrence indicator(s) in a memory of the RFID tag indicating the occurrence of the sensed event(s). A RFID reader is configured to perform a query of a population of RFID tags in communication range to detect which RFID tags have a set event occurrence indicator(s), so a RFID reader can then specifically communiate with RFID tags that experienced an event(s) to request and service the event(s) type without having to perform those same operations for the entire RFID tag population. The RFID reader can be configured to take desired actions based on detection of events. | 12-27-2012 |
20130272696 | OPTICAL FIBER-BASED DISTRIBUTED ANTENNA SYSTEMS, COMPONENTS, AND RELATED METHODS FOR CALIBRATION THEREOF - Optical fiber-based wireless systems and related components and methods are disclosed. The systems support radio frequency (RF) communications with clients over optical fiber, including Radio-over-Fiber (RoF) communications. The systems may be provided as part of an indoor distributed antenna system (IDAS) to provide wireless communication services to clients inside a building or other facility. The communications can be distributed between a head end unit (HEU) that receives carrier signals from one or more service or carrier providers and converts the signals to RoF signals for distribution over optical fibers to end points, which may be remote antenna units (RAUs). In one embodiment, calibration of communication downlinks and communication uplinks is performed to compensate for signal strength losses in the system. | 10-17-2013 |
20140153919 | OPTICAL FIBER-BASED DISTRIBUTED ANTENNA SYSTEMS, COMPONENTS, AND RELATED METHODS FOR MONITORING AND CONFIGURING THEREOF - Optical fiber-based wireless systems and related components and methods support radio frequency (RF) communications with clients over optical fiber, including Radio-over-Fiber (RoF) communications. The systems may be provided as part of an indoor distributed antenna system (IDAS) to provide wireless communication services to clients inside a building or other facility. The communications can be distributed between a head end unit (HEU) that receives carrier signals from one or more service or carrier providers and converts the signals to RoF signals for distribution over optical fibers to end points, which may be remote antenna units (RAUs). A microprocessor-based control system or systems may also be employed. The control systems may include one or more microprocessors or microcontrollers in one or more of the components of the system that execute software instructions to control the various components and provide various features for the optical fiber-based distributed antenna systems. | 06-05-2014 |
Patent application number | Description | Published |
20120302721 | Methods for Preparation of Macrocyclic Polyester Oligomer via Heterogeneous Catalysis - The invention relates to methods and systems for preparing macrocyclic polyester oligomer (MPO) directly from monomer via heterogeneous catalysis, rather than by depolymerizing a polyester. For example, in an exemplary embodiment, cyclic poly(butylene terephthalate) (cPBT) is produced by reacting butanediol (BDO) and dimethylterephthalate (DMT) in an organic solvent—for example, ortho-dichlorobenzene (oDCB). The mixture flows over (or otherwise contacts) the catalyst-coated fiberglass or silica gel, e.g., which is packed in a column or bed. MPO is produced in the reaction mixture, while residual linears and catalyst residue remain in the column/bed. | 11-29-2012 |
20140343244 | METHODS FOR PREPARATION OF POLYESTER OLIGOMER VIA BASE CATALYSIS - The invention relates to methods and systems for preparing macrocyclic polyester oligomer (MPO) via base catalysis. It is found that base catalysts are effective in the production of MPO, and they reduce the potential for undesired byproducts such as furans (e.g., THF) and acetaldehyde, which result from diol side reactions. | 11-20-2014 |
20140378644 | METHODS FOR PREPARATION OF MACROCYCLIC POLYESTER OLIGOMER VIA HETEROGENEOUS CATALYSIS - The invention relates to methods and systems for preparing macrocyclic polyester oligomer (MPO) directly from monomer via heterogeneous catalysis, rather than by depolymerizing a polyester. For example, in an exemplary embodiment, cyclic poly(butylene terephthalate) (cPBT) is produced by reacting butanediol (BDO) and dimethylterephthalate (DMT) in an organic solvent—for example, ortho-dichlorobenzene (oDCB). The mixture flows over (or otherwise contacts) the catalyst-coated fiberglass or silica gel, e.g., which is packed in a column or bed. MPO is produced in the reaction mixture, while residual linears and catalyst residue remain in the column/bed. | 12-25-2014 |
Patent application number | Description | Published |
20080213481 | Method for creating a reference region and a sample region on a biosensor - A method is described herein that can use any one of a number of deposition techniques to create a reference region and a sample region on a single biosensor which in the preferred embodiment is located within a single well of a microplate. The deposition techniques that can be used to help create the reference region and the sample region on a surface of the biosensor include: (1) the printing/stamping of a deactivating agent on a reactive surface of the biosensor; (2) the printing/stamping of a target molecule (target protein) on a reactive surface of the biosensor; or (3) the printing/stamping of a reactive agent on an otherwise unreactive surface of the biosensor. | 09-04-2008 |
20090027693 | Optical interrogation system and microplate position correction method - An optical interrogation system and method are described herein that are capable of detecting and correcting a positional misalignment of a label independent detection (LID) microplate so that the LID microplate can be properly interrogated after being removed from and then re-inserted back into a microplate holder/XY translation stage. | 01-29-2009 |
20090138205 | OPTIMIZED METHOD FOR LID BIOSENSOR RESONANCE DETECTION - An optical interrogation system is described herein that can interrogate a label-independent-detection (LID) biosensor and monitor a biological event on top of the biosensor without suffering from problematical parasitic reflections and/or problematical pixelation effects. In one embodiment, the optical interrogation system is capable of interrogating a biosensor and using a low pass filter algorithm to digitally remove problematic parasitic reflections contained in the spectrum of an optical resonance which makes it easier to determine whether or not a biological event occurred on the biosensor. In another embodiment, the optical interrogation system is capable of interrogating a biosensor and using an oversampling/smoothing algorithm to reduce oscillations in the estimated location of an optical resonance caused by the problematical pixelation effect which makes it easier to determine whether or not a biological event occurred on the biosensor. | 05-28-2009 |
20100105148 | MULTI-CHANNEL SWEPT WAVELENGTH OPTICAL INTERROGATION SYSTEM AND METHOD FOR USING SAME - A multi-channel swept wavelength optical interrogation system and a method are described herein that enable the interrogation of one or more biosensors which for example could be located within the wells of a microplate. In one embodiment, the optical interrogation system comprises: (a) a tunable laser that emits an optical beam which has a predetermined sequence of distinct wavelengths over a predetermined time period; (b) a distribution unit that splits the optical beam into a plurality of interrogation beams; (c) an array of optical interrogation units that receive and direct the interrogation beams towards an array of biosensors; (d) the array of optical interrogation units receive a plurality of reflected interrogation beams from the array of biosensors; (e) a data processing device that receives and processes information associated with the reflected interrogation beams to determine for example whether or not there was a biochemical interaction on anyone of the biosensors. | 04-29-2010 |
20100296089 | WAVELENGTH TRACKER FOR SWEPT WAVELENGTH SENSOR INTERROGATION SYSTEM - A swept wavelength interrogation system includes a tunable light source for outputting a light beam that is tunable over a range of wavelengths and an optical reader head for distributing the light beam among a plurality of sensors and for measuring response spectra from the sensors. A wavelength-tracking device measures centroid wavelengths of the light beam. A processor calculates a centroid wavelength of the response spectra from the sensors based on the measured centroid wavelengths of the light beam. | 11-25-2010 |
20110043828 | OPTICAL READER SYSTEM AND METHOD FOR MONITORING AND CORRECTING LATERAL AND ANGULAR MISALIGNMENTS OF LABEL INDEPENDENT BIOSENSORS - An optical reader system and method are described herein that can detect a lateral and/or angular misalignment of one or more biosensors so that the biosensors can be properly re-located after being removed from and then reinserted into the optical reader system. In one embodiment, the biosensors are incorporated within the wells of a microplate. | 02-24-2011 |
20110238382 | OPTIMIZED METHOD FOR LID BIOSENSOR RESONANCE DETECTION - An optical interrogation system is described herein that can interrogate a label-independent-detection (LID) biosensor and monitor a biological event on top of the biosensor without suffering from problematical parasitic reflections and/or problematical pixelation effects. | 09-29-2011 |
20120134666 | OPTICAL FIBER-BASED DISTRIBUTED ANTENNA SYSTEMS, COMPONENTS, AND RELATED METHODS FOR MONITORING AND CONFIGURING THEREOF - Optical fiber-based wireless systems and related components and methods are disclosed. The systems support radio frequency (RF) communications with clients over optical fiber, including Radio-over-Fiber (RoF) communications. The systems may be provided as part of an indoor distributed antenna system (IDAS) to provide wireless communication services to clients inside a building or other facility. The communications can be distributed between a head end unit (HEU) that receives carrier signals from one or more service or carrier providers and converts the signals to RoF signals for distribution over optical fibers to end points, which may be remote antenna units (RAUs). A microprocessor-based control system or systems may also be employed. The control systems may include one or more microprocessors or microcontrollers in one or more of the components of the system that execute software instructions to control the various components and provide various features for the optical fiber-based distributed antenna systems. | 05-31-2012 |
Patent application number | Description | Published |
20080227654 | Method for sequencing nucleic acid molecules - The present invention is directed to a method of sequencing a target nucleic acid molecule having a plurality of bases. In its principle, the temporal order of base additions during the polymerization reaction is measured on a molecule of nucleic acid, i.e. the activity of a nucleic acid polymerizing enzyme on the template nucleic acid molecule to be sequenced is followed in real time. The sequence is deduced by identifying which base is being incorporated into the growing complementary strand of the target nucleic acid by the catalytic activity of the nucleic acid polymerizing enzyme at each step in the sequence of base additions. A polymerase on the target nucleic acid molecule complex is provided in a position suitable to move along the target nucleic acid molecule and extend the oligonuelcotide primer at an active site. A plurality of labelled types of nucleotide analogs are provided proximate to the active site, with each distinguishable type of nucleotide analog being complementary to a different nucleotide in the target nucleic acid sequence. The growing nucleic acid strand is extended by using the polymeras to add a nucleotide analog to the nucleic acid strand at the active site, where the nucleotide analog being added is complementary to the nucleotide of the target nucleic acid at the active site. The nucleotide analog added to the oligonucleotide primer as a result of the polymerizing step is identified. The steps of providing labelled nucleotide analogs, polymerizing the growing nucleic acid strand, and identifying the added nucleotide analog are repeated so that the nucleic acid strand is further extended and the sequence of the target nucleic acid is determined. | 09-18-2008 |
20090137007 | Method for sequencing nucleic acid molecules - The present invention is directed to a method of sequencing a target nucleic acid molecule having a plurality of bases. In its principle, the temporal order of base additions during the polymerization reaction is measured on a molecule of nucleic acid, i.e. the activity of a nucleic acid polymerizing enzyme on the template nucleic acid molecule to be sequenced is followed in real time. The sequence is deduced by identifying which base is being incorporated into the growing complementary strand of the target nucleic acid by the catalytic activity of the nucleic acid polymerizing enzyme at each step in the sequence of base additions. A polymerase on the target nucleic acid molecule complex is provided in a position suitable to move along the target nucleic acid molecule and extend the oligonucleotide primer at an active site. A plurality of labelled types of nucleotide analogs are provided proximate to the active site, with each distinguishable type of nucleotide analog being complementary to a different nucleotide in the target nucleic acid sequence. The growing nucleic acid strand is extended by using the polymerase to add a nucleotide analog to the nucleic acid strand at the active site, where the nucleotide analog being added is complementary to the nucleotide of the target nucleic acid at the active site. The nucleotide analog added to the oligonucleotide primer as a result of the polymerizing step is identified. The steps of providing labelled nucleotide analogs, polymerizing the growing nucleic acid strand, and identifying the added nucleotide analog are repeated so that the nucleic acid strand is further extended and the sequence of the target nucleic acid is determined. | 05-28-2009 |
20100261958 | MULTI-PATH, MULTI-MAGNIFICATION, NON-CONFOCAL FLUORESCENCE EMISSION ENDOSCOPY APPARATUS AND METHODS - Embodiments of the invention include an optical system and an optical system module, coupled to a distal end of a fluorescence emission endoscope apparatus, an optical waveguide-based fluorescence emission endoscopy system, and a method for remotely-controlled, multi-magnification imaging of a target or fluorescence emission collection from a target with a fluorescence emission endoscope apparatus. An exemplary system includes an objective lens disposed in a distal end of an endoscope apparatus. The lens is adapted to transmit both a visible target illumination and a fluorescence-emission-inducing target illumination as well as fluorescence-emission and visible light from the target. The system can thus simultaneously provide low magnification, large field of view imaging and high magnification, high-resolution multiphoton imaging with a single lens system. | 10-14-2010 |
20100270479 | NON-IMAGING, WEAKLY FOCUSED FLUORESCENCE EMISSION APPARATUS AND METHOD - Apparatus and methods relating to non-imaging, multiphoton fluorescence and optical second harmonic generation (SHG) (and higher harmonic generation) emission and detection. A weakly focused excitation beam is used to generate fluorescence emission in a volume of between about 0.1 cm | 10-28-2010 |
20110111401 | METHOD FOR SEQUENCING NUCLEIC ACID MOLECULES - The present invention is directed to a method of sequencing a target nucleic acid molecule having a plurality of bases. In its principle, the temporal order of base additions during the polymerization reaction is measured on a molecule of nucleic acid, i.e. the activity of a nucleic acid polymerizing enzyme on the template nucleic acid molecule to be sequenced is followed in real time. The sequence is deduced by identifying which base is being incorporated into the growing complementary strand of the target nucleic acid by the catalytic activity of the nucleic acid polymerizing enzyme at each step in the sequence of base additions. A polymerase on the target nucleic acid molecule complex is provided in a position suitable to move along the target nucleic acid molecule and extend the oligonucleotide primer at an active site. A plurality of labelled types of nucleotide analogs are provided proximate to the active site, with each distinguishable type of nucleotide analog being complementary to a different nucleotide in the target nucleic acid sequence. The growing nucleic acid strand is extended by using the polymerase to add a nucleotide analog to the nucleic acid strand at the active site, where the nucleotide analog being added is complementary to the nucleotide of the target nucleic acid at the active site. The nucleotide analog added to the oligonucleotide primer as a result of the polymerizing step is identified. The steps of providing labelled nucleotide analogs, polymerizing the growing nucleic acid strand, and identifying the added nucleotide analog are repeated so that the nucleic acid strand is further extended and the sequence of the target nucleic acid is determined. | 05-12-2011 |
20110158575 | EXTRAORDINARY LIGHT TRANSMISSION APPARATUS AND METHOD - An optical apparatus that provides extraordinary light transmission through a sub-wavelength-sized light transmitting region of the apparatus includes a core region of dielectric material having a complex dielectric constant, ε | 06-30-2011 |
20120140301 | MULTI-PATH, MULTI-MAGNIFICATION, NON-CONFOCAL FLUORESCENCE EMISSION ENDOSCOPY APPARATUS AND METHODS - An optical scanner, scanner apparatus, or scanner assembly, which may be particularly advantageous for use in a multiphoton microscope, includes a first drivable bending component, a second drivable bending component mounted perpendicularly to the first component, and at least one optical waveguide coupled one or both of the first and second bending components, wherein the at least one optical waveguide provides both a propagation path for a multiphoton excitation radiation delivery between a light source and a target and a multiphoton-induced emission radiation delivery between the target and a detector. A GRIN relay lens. A multiphoton microscope incorporating the scanner and the GRIN relay lens. | 06-07-2012 |
20130006056 | MULTI-FOCAL OPTICAL COMPONENT, OPTICAL SYSTEM, AND IMAGING METHOD - An optical lens comprising a lens body that transmits light in an optical path there through, wherein the lens body consists of an anterior surface, a posterior surface, and a medium there between, further wherein one of the anterior surface and the posterior surface has a single curvature and the other of the anterior surface and the posterior surface has at, least two optical zones each having a different curvature. An optical system, comprising a multi-photon endoscope having a distal end, and the optical lens disposed in the distal end. A method for obtaining an image of an object comprising providing the multi-photon endoscope, propagating light from the endoscope scanner one optical zone of the lens to focus the light at a focus location, and propagating light from the scanner through a different optical zones of the lens to focus the light at a different focus location. | 01-03-2013 |
20130324858 | MULTI-PATH, MULTI-MAGNIFICATION, NON-CONFOCAL FLUORESCENCE EMISSION ENDOSCOPY APPARATUS AND METHODS - An optical scanner, scanner apparatus, or scanner assembly, which may be particularly advantageous for use in a multiphoton microscope, includes a first drivable bending component, a second drivable bending component mounted perpendicularly to the first component, and at least one optical waveguide coupled one or both of the first and second bending components, wherein the at least one optical waveguide provides both a propagation path for a multiphoton excitation radiation delivery between a light source and a target and a multiphoton-induced emission radiation delivery between the target and a detector. A GRIN relay lens. A multiphoton microscope incorporating the scanner and the GRIN relay lens. | 12-05-2013 |
20150131147 | DUAL MODE MICROENDOSCOPE APPARATUS, METHOD AND APPLICATIONS - A microendoscope, and a microendoscopy method related to the microendoscope, each include a tube housing, where an end of the tube housing is shaped and finished to facilitate collection of light emitted from a sample when examined using the microendoscope. In addition, a catadioptric lens assembly, an endomicroscope that includes the catadioptric lens assembly and a microendoscopy method for microscopic analysis that uses the endomicroscope are predicated upon a second element and a third element within the catadioptric lens assembly that each has a dichroic coating. The placement of the dichroic coating on the second element and the third element provides for different magnification factors as a function of illumination wavelength when using the microendoscopy method. | 05-14-2015 |