| Patent application number | Description | Published |
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| 20100024156 | Head for a cleaning implement having a removable dirt bin - A cleaning implement having a dirt bin for collecting debris from a floor. The dirt bin has at least one of a cleaning sheet and/or air filter attached thereto, as presented to the user. This arrangement allows for more efficient disposal of debris from the dirt bin and soiled components. The dirt bin may be emptied and reused or may be discarded after a single use. | 02-04-2010 |
| 20100024157 | Head for a cleaning implement - A cleaning implement having a dirt bin for collecting debris from a floor, a cleaning sheet and optionally an air filter. The implement has a head with opposed top and bottom surfaces. The bottom surface may receive a cleaning sheet for cleaning a floor. The cleaning sheet is attached at a separate surface recessed relative to the bottom surface of the cleaning implement. | 02-04-2010 |
| 20110226721 | THREADED CLOSURE ASSEMBLY - A threaded closure assembly comprising a transition and a cap is disclosed. The threaded closure assembly may be utilized to seal a liquid containing bottle, particularly one containing a liquid fabric composition. | 09-22-2011 |
| 20110290756 | THREADED CAP - A threaded cap is disclosed. The threaded cap may form a portion of a closure assembly comprising also comprising a threaded transition. The closure assembly may be utilized to seal a liquid containing bottle, particularly one containing a liquid fabric composition. | 12-01-2011 |
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| 20090098488 | Thick Film Layers and Methods relating thereto - Thick film layers for a micro-fluid ejection head, micro-fluid ejection heads, and methods for making micro-fluid ejection head and thick film layers. One such thick film layer is derived from a difunctional epoxy component having a weight average molecular weight ranging from about 2500 to about 4000 Daltons, a photoacid generator, an aryl ketone solvent, and an adhesion enhancing component. One such thick film layer has a cross-link density upon curing that increases the dimensional stability of the thick film layer sufficient to provide flow features therein having substantially vertical walls. | 04-16-2009 |
| 20090155729 | Photoimageable Nozzle Members and Methods Relating Thereto - Nozzle members, such as for a micro-fluid ejection head, micro-fluid ejection heads, and a method for making the same. One such nozzle member includes a negative photoresist composition derived from a first di-functional epoxy compound, a relatively high molecular weight polyhydroxy ether, a photoacid generator devoid of aryl sulfonium salts, an adhesion enhancer, and an aliphatic ketone solvent. The nozzle member has a thickness ranging from about 10 microns to about 30 microns. | 06-18-2009 |
| 20090269707 | Thick Film Layers and Methods Relating Thereto - Thick film layers for a micro-fluid ejection head, micro-fluid ejection heads, and methods for making micro-fluid ejection head and thick film layers. One such thick film layer is derived from a difunctional epoxy component having a weight average molecular weight ranging from about 2500 to about 4000 Daltons, a photoacid generator, an aryl ketone solvent, and an adhesion enhancing component. One such thick film layer has a cross-link density upon curing that increases the dimensional stability of the thick film layer sufficient to provide flow features therein having substantially vertical walls. | 10-29-2009 |
| Patent application number | Description | Published |
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| 20090091600 | MICRO-FLUID EJECTION HEAD AND STRESS RELIEVED ORIFICE PLATE THEREFOR - A micro-fluid ejection head and methods for improving the fabrication and operation of the micro-fluid ejection head. The ejection head includes a photoimaged thick film layer attached to a substrate containing fluid ejection actuators. An orifice plate is laminated to the thick film layer. The orifice plate has a plurality of concentric orifices therein and is derived from a first photoresist material that is heated to a temperature sufficient to relieve film stresses in the photoresist material prior to exposing and developing the orifices in the orifice plate. | 04-09-2009 |
| 20090091604 | PROCESS FOR MAKING A MICRO-FLUID EJECTION HEAD STRUCTURE - A method of making a micro-fluid ejection head structure and micro-fluid ejection heads made by the method. The method includes applying a tantalum oxide layer to a surface of a fluid ejection actuator disposed on a device surface of a substrate so that the tantalum oxide layer is the topmost layer of a plurality of layers including a resistive layer, and a protective layer selected from a passivation layer, a cavitation layer, and a combination of a passivation layer and a cavitation layer. The tantalum oxide layer has a thickness (t) that satisfies an equation t=(¼*W/n), wherein W is a wavelength of radiation from a radiation source, and n is a refractive index of the tantalum oxide layer. A photoimageable layer is also applied to the substrate. The photoimageable layer is imaged with the radiation source and then developed. | 04-09-2009 |
| 20100199497 | Micro-Fluid Ejection Heads with Chips in Pockets - Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip. | 08-12-2010 |
| 20100210759 | Adhesive Compositions, Micro-fluid Ejection Devices and Methods for Attaching Mirco-Fluid Ejection Heads - Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.). | 08-19-2010 |
| 20100229392 | PROCESS FOR MAKING A MICRO-FLUID EJECTION HEAD STRUCTURE - A method of making a micro-fluid ejection head structure and micro-fluid ejection heads made by the method. The method includes applying a tantalum oxide layer to a surface of a fluid ejection actuator disposed on a device surface of a substrate so that the tantalum oxide layer is the topmost layer of a plurality of layers including a resistive layer, and a protective layer selected from a passivation layer, a cavitation layer, and a combination of a passivation layer and a cavitation layer. The tantalum oxide layer has a thickness (t) that satisfies an equation t=(¼*W/n), wherein W is a wavelength of radiation from a radiation source, and n is a refractive index of the tantalum oxide layer. A photoimageable layer is also applied to the substrate. The photoimageable layer is imaged with the radiation source and then developed. | 09-16-2010 |
| 20110014354 | ADHESIVE COMPOSITIONS AND METHODS FOR USE IN FAILURE ANALYSIS - Thermally curable adhesive compositions and method for failure analysis in micro-fluid ejections heads. The adhesive composition may be provided by a composition including from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin, from about 0.1 to about 30.0 percent by weight of at least one thermal curative agent, and from about 0.0 to about 5.0 percent by weight filler, from about 0.1 to about 10.0 percent by weight fluorescent pigment. Upon curing, the adhesive composition exhibits a relatively low shear modulus. | 01-20-2011 |
