Patent application number | Description | Published |
20090087966 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor film is formed on a GaAs substrate (semiconductor substrate). An SiO | 04-02-2009 |
20090166807 | INTEGRATED SEMICONDUCTOR OPTICAL DEVICE - A semiconductor laser (a first semiconductor optical device) and an optical modulator (a second semiconductor optical device) are integrated on the same n-type InP substrate. The semiconductor laser butt-joined to the optical modulator. Each of the semiconductor laser and the optical modulator has a Be-doped p-type InGaAs contact layer. The p-type InGaAs contact layers have a Be-doping concentration of 7×10 | 07-02-2009 |
20090246903 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - The present invention includes forming an optical guide layer on a substrate, forming a cap layer on the optical guide layer, and forming openings in parts of the optical guide layer and the cap layer to form a diffraction grating from part of the optical guide layer. The substrate is heated to a temperature less than a growth temperature of the cap layer and equal to at least a temperature at which mass transport of the cap layer occurs to cover, with part of the cap layer, the lateral faces of the optical guide layer exposed by the openings. A burying layer burying the diffraction grating is formed on the substrate, after the mass transport. | 10-01-2009 |
20100272389 | SEMICONDUCTOR OPTICAL ELEMENT AND METHOD FOR MANUFACTURING THE SAME - A semiconductor optical element having a mesa structure formed by wet etching, includes a mesa structure having a ridge-type mesa structure or a high-mesa-type mesa structure, the mesa structure being disposed on a semiconductor substrate, and an extended mesa on the semiconductor substrate, the extended mesa being connected to a corner of the mesa structure and being the same material as the mesa structure. | 10-28-2010 |
20100316080 | SEMICONDUCTOR OPTICAL ELEMENT - A semiconductor optical element includes a p-type InP substrate doped with Zn; and a diffusion blocking layer doped with Ru, a p-type InP cladding layer, an active layer, and an n-type InP cladding layer sequentially arranged on the p-type InP substrate. | 12-16-2010 |
20150118827 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes: forming electrodes on a first major surface of a semiconductor substrate having first and second major surfaces facing in opposite directions; and forming a cleavage-inducing pattern on the first major surface of the semiconductor substrate. The cleavage-inducing pattern extends over a target cleavage position located between the electrodes, has a recess extending over the target cleavage position, and is made of a material different from the material of the semiconductor substrate. The method includes forming a scribed groove in the second major surface of the semiconductor substrate and in a position facing the target cleavage position; and cleaving the semiconductor substrate having the scribed groove and the cleavage-inducing pattern by applying pressure, through a cleaving blade, to the first major surface of the semiconductor substrate. | 04-30-2015 |
Patent application number | Description | Published |
20100177579 | SEMICONDUCTOR MEMORY DEVICE HAVING FAULTY CELLS - In response to a read command received by a system interface unit for accessing a plurality of blocks of data stored in said non-volatile semiconductor memory, a controller carries out selective read operations of blocks of data to two memories from the non-volatile semiconductor memory. The controller also carries out parallel operations of data transferring a first block of data, which has already been subjected to error detection and error correction operations by an error correction unit, from one of the two memories to a host system via said system interface unit and of data transferring of a second block of data to be subjected to the error detection and error correction operation, from said non-volatile semiconductor memory to the other of the two memories. | 07-15-2010 |
20120213002 | SEMICONDUCTOR MEMORY DEVICE HAVING FAULTY CELLS - In response to a read command received by a system interface unit for accessing a plurality of blocks of data stored in said non-volatile semiconductor memory, a controller carries out selective read operations of blocks of data to two memories from the non-volatile semiconductor memory. The controller also carries out parallel operations of data transferring a first block of data, which has already been subjected to error detection and error correction operations by an error correction unit, from one of the two memories to a host system via said system interface unit and of data transferring of a second block of data to be subjected to the error detection and error correction operation, from said non-volatile semiconductor memory to the other of the two memories. | 08-23-2012 |
20140185380 | SEMICONDUCTOR MEMORY DEVICE HAVING FAULTY CELLS - In response to a read command received by a system interface unit for accessing a plurality of blocks of data stored in said non-volatile semiconductor memory, a controller carries out selective read operations of blocks of data to two memories from the non-volatile semiconductor memory. The controller also carries out parallel operations of data transferring a first block of data, which has already been subjected to error detection and error correction operations by an error correction unit, from one of the two memories to a host system via said system interface unit and of data transferring of a second block of data to be subjected to the error detection and error correction operation, from said non-volatile semiconductor memory to the other of the two memories. | 07-03-2014 |
Patent application number | Description | Published |
20130136510 | Fixing Unit, Image Forming Apparatus Including the Same, and Method for Separating Recording Medium - A fixing unit includes a heating member, a pressing member, a casing, a separating member, and an urging member. The separating member has a separation claw and a rotating unit. The urging member urges the separation claw toward the surface of the heating member. The rotating unit has an engaging portion and guide surfaces opposing at an interval smaller than that of the engaging portion. The supporting portion includes an engagement supporting portion that rotatably engages the engaging portion and an insertion opening. The separating member rotates to retract guide surfaces from a position facing the inner wall surfaces of the insertion opening. The guide surfaces oppose the inner wall surfaces of the insertion opening to bring the engaging portion to the engagement supporting portion and thereafter mounting the heating member on the casing. | 05-30-2013 |
20140339763 | FIXING DEVICE, IMAGE FORMING APPARATUS, AND SHEET DETECTING MECHANISM - A fixing device includes a sheet detecting mechanism configured to detect a sheet. The sheet detecting mechanism includes an actuator, a link member, and a detecting part. The actuator swings by being pushed by the sheet. The link member swings in conjunction with the swing of the actuator. The detecting part detects the swing of the link member. When a shift of a position of the actuator with respect to the detecting part is caused, the actuator slides with respect to the link member to absorb the shift. | 11-20-2014 |
20150301486 | FIXING DEVICE AND IMAGE FORMING APPARATUS - A fixing device includes a heating roller and a pressuring roller, a first holding member, a supporting member and a temperature detecting part. The heating roller and pressuring roller sandwiches and heats a sheet to fix a toner image formed on the sheet onto the sheet. The first holding member has a facing part facing to a circumference face of the heating roller to hold the heating roller. The supporting member is made of material with high heat resisting property as compared with the first holding member, arranged between the facing part of the first holding member and the circumference face of the heating roller so as to face to the circumference face of the heating roller, and formed in an elongated shape along an axial direction of the heating roller. The temperature detecting part is arranged in the supporting member to detect temperature of the heating roller. | 10-22-2015 |