| Patent application number | Description | Published |
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| 20110030290 | ENERGY EFFICIENT FENESTRATION PRODUCT WITH SUSPENDED PARTICLE DEVICE - A fenestration product in accordance with an embodiment of the present application includes an insulated glass unit with a frame, an SPD film mounted in the frame and a pane of glass mounted in the frame adjacent to the SPD film with a gap formed between the pane of glass and the pane of glass. The gap is preferably filled with Argon gas. | 02-10-2011 |
| 20110100709 | SPD FILMS AND LIGHT VALVE LAMINATES WITH IMPROVED BUS-BAR CONNECTIONS - A connection between a power bus and a conducting layer of a suspended particle device in accordance with an embodiment of the present application includes an adhesive combined with metallic particles to impart both good adhesion and electrical conductivity. The adhesive is applied to a surface of the conducting layer. A conducting copper foil or conducting fabric is adhered to the adhesive and forms at least a portion of the power bus. | 05-05-2011 |
| 20120013969 | SPD FILMS AND LIGHT VALVE LAMINATES WITH IMPROVED DURABILITY - A moisture-resistant suspended particle device film comprising a cured suspended particle device emulsion having a plurality of uncrosslinked droplets of a liquid light valve suspension distributed throughout the cured emulsion; first and second glass or plastic sheets located outwardly from and sandwiching the cured emulsion, wherein located on an inner aspect of each sheet, adjacent the cured emulsion, is a thin, transparent, electrically conductive coating , the coating serving as an electrode to permit passage of an applied electric field through the cured emulsion; and a moisture-resistant barrier located around an entire outer peripheral edge portion of the film, wherein the barrier is comprised of a barrier material that eliminates or at least reduces passage of moisture from outside the film into the cured emulsion, thus preventing development of a light-frame pattern in the film that would otherwise be caused by the moisture. The disclosure also discloses forming a laminate comprising the above-described film, as well as methods of forming such films and laminates. | 01-19-2012 |
| 20120236393 | SPD FILMS FORMED WITH CONDUCTIVE POLYMER-COATED SUBSTRATES - A suspended particle device (SPD) film or laminate thereof. The film includes substrates coated on their inner surface with a polythiophene-based conductive polymer serving as electrode means. The polymer may be applied in the form of an aqueous composition also comprising solvent(s) and binder(s). A preferred polymer is a polyethylene dioxythiophene (PEDT) polymer. The polymer may be doped with polystyrene sulfonate. The polymer may be connected to a conductive material that extends beyond an outer boundary of the film to connect with a voltage source. Adhesive strength between the cured emulsion and the polymer is at least 1.46 N/25 mm. A further aspect constitutes a method for increasing adhesion between a cured suspended particle device emulsion and electrode means in a light valve film. The method comprises applying the polymer on an inner surface of the substrates constituting the film to serve as the electrode means. | 09-20-2012 |
| Patent application number | Description | Published |
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| 20080290138 | Method for bonding refractory ceramic and metal - A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising attaching an anchor material to at least a portion of one surface of the metal component, and then applying the ceramic material to at least a portion of the one surface of the metal component, such that after the ceramic material solidifies, the anchor material is substantially embedded in at least a portion of the ceramic material, thereby forming a mechanical bond between the metal component and the ceramic material via the anchor material. Also disclosed is an article comprising a metal component and a ceramic material mechanically bonded thereto through an anchor material attached to at least a portion of the metal component. | 11-27-2008 |
| 20090142608 | Method for bonding refractory ceramic and metal - A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit. | 06-04-2009 |
| 20090218320 | Frit sealing using direct resistive heating - An frit-sealed device comprising a resistive heating element having an electrically-closed-loop structure and process for frit-sealing a device by using such heating element. The element can be advantageously made of a metal such as Invar® and/or Kovar®. The invention enables hermetic frit sealing with low residual stress in the seal. The invention is particularly advantageous for hermetic sealing of OLED display devices. | 09-03-2009 |
| 20090218932 | Frit sealing of large device - A hermetically sealed device comprising a spacing unit and a resistive heating element desirably having a closed-loop structure and process for hermetically sealing a device by using such heating element and spacing unit. The frit can form multiple closed-loops to prevent crack propagation. The heating element can be advantageously made of a metal such as Invar® and/or Kovar®. The invention enables hermetic frit sealing with low residual stress in the seal for large-area displays. The invention is particularly advantageous for hermetic sealing of OLED display devices having a large area, such as those above 10 inches (25 cm). | 09-03-2009 |
| 20100038836 | Mandrel To Facilitate Thin Sheet Fabrication | 02-18-2010 |
