Walczyk
Daniel Walczyk, Troy, NY US
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20100181697 | PROCESS FOR PRODUCING A PROTON-CONDUCTING, POLYAZOLE-CONTAINING MEMBRANE - A method for producing a proton-conducting, polyazole-containing membrane, in which | 07-22-2010 |
20130202984 | METHOD FOR THE PRODUCTION OF AN ELECTROCHEMICAL CELL - The present invention relates to a new method for the production of electrochemical cells, in particular individual cells for fuel cells and stacks, in which the individual components of a membrane electrode assembly are compressed and bonded by use of ultrasonic waves and the absence of any further additional heating. The method according to the invention allows faster cycles during the lamination of the membrane electrode assemblies. | 08-08-2013 |
Daniel Walczyk, Brunswick, NY US
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20100181018 | Consolidating and Curing of Thermoset Composite Parts by Pressing Between a Heated Rigid Mold and Customized Rubber-faced Mold - Method and apparatus for consolidating and curing a composite part places and registers a composite laminate layer of thermoset polymer matrix and reinforcing fibers onto the temperature-controlled curing surface of a heated curing mold and provides a base mold with base surface covered by a rubber mask having a mask surface. Three-dimensional surfaces of the curing, base and mask surfaces complement each other so with the curing and base molds adjacent, a pressure space is formed between the base and curing surfaces that contains the compressed rubber mask, a bleeder layer for removing excess air and polymer matrix, and the composite laminate, the pressure space having a perimeter. The base and curing molds are pressed together with a particular force, thereby creating a uniform hydrostatic pressure at the rubber mask and composite laminate interface by virtue of the mold and mask three-dimensional surfaces and rubber mask thickness distribution, to squeeze the composite laminate during consolidation and curing of the part. A vacuum is also applied to the perimeter of the composite laminate during consolidation. | 07-22-2010 |
Daniel F. Walczyk, Brunswick, NY US
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20120251688 | ADDITIVE MANUFACTURING SYSTEM AND METHOD FOR PRINTING CUSTOMIZED CHOCOLATE CONFECTIONS - An additive manufacturing system for printing a chocolate confection, the system comprising a platen, a recirculation loop configured to circulate a flow of a chocolate material, and further configured to maintain a temper of the chocolate material; and a print head the print head being configured to receive at least a portion of the chocolate material from the recirculation loop, and further configured to extrude and deposit the chocolate material onto the platen to print at least a portion of the chocolate confection based on the commands from a controller. | 10-04-2012 |
20150282911 | Tooth cleaning mechanism - A tooth cleaning device for the disabled eliminates the need for the user to rotate her/his wrist while brushing teeth, and provides approximately the same profile as a standard manual toothbrush. The device is capable of effectively brushing all three sides of all upper or lower teeth simultaneously, and utilizes a commercially available battery powered toothbrush power source to provide the power necessary for effective teeth cleaning action. An open top U-shaped track has a number of distinct operatively connected brush bristle mounting heads reciprocal and retained within the track, with a number of bristles extending up from each of the heads. A device, such as an opening in a central head, a linkage, and a battery powered oscillating shaft, provide back and forth arcuate reciprocal movement of the heads within the track to provide tooth cleaning by the bristles. | 10-08-2015 |
Ewa Walczyk, Caledon CA
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20110092424 | PRODUCTION OF GLUCAGON LIKE PEPTIDE 2 AND ANALOGS - GLP-2 peptides and analogs thereof are produced in high yield and with desired, authentic termini by isolation from a GLP-2 peptide multimer in which at least two units of GLP-2 peptide are coupled through a linker that presents an N-terminal acid cleavage site and a C-terminal enzyme cleavage site. In a specific embodiment, [Gly | 04-21-2011 |
Joe Walczyk, Tigard, OR US
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20140125367 | SEAL METHOD FOR DIRECT LIQUID COOLING OF PROBES USED AT FIRST LEVEL INTERCONNECT - Embodiments of an apparatus and method for providing cooling of probes for testing of integrated circuits are generally described herein. In some embodiments, an apparatus comprises a probe head assembly configured to hold one or more probes that are adapted to provide electrical contact with an integrated circuit device under test (DUT), a DUT chuck adapted to hold the DUT for contact with the probes, a seal arranged between the probe head assembly and the DUT chuck to form a chamber when the seal is in contact with the probe head assembly and the DUT chuck, and a first port and a second port arranged to provide fluid flow into and fluid flow out of the chamber. | 05-08-2014 |
20140158416 | ACTUATION MECHANISMS FOR ELECTRICAL INTERCONNECTIONS - Some embodiments described herein include apparatuses and methods of forming such apparatuses. In one such embodiment, an apparatus may include an electronic arrangement, a first die, and a second die coupled to the first die and the electronic arrangement. The electronic arrangement may include an opening. At least a portion of the die may occupy at least a portion of the opening in the electronic arrangement. Other embodiments including additional apparatuses and methods are described. | 06-12-2014 |
Joe F. Walczyk, Tigard, OR US
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20130337666 | SUBSTRATE EMBEDDED ELECTRICAL INTERCONNECT - Electronic assemblies and methods including the formation of interconnect assemblies are described. An electrical interconnection assembly may include a contact structure and a printed circuit board electrically coupled to the contact structure, the printed circuit board including an opening therein. The contact structure is positioned to extend within the opening in the printed circuit board and is movable in relation to the printed circuit board when a sufficient force is applied to the contact structure. Other embodiments are described and claimed. | 12-19-2013 |
20140091824 | MECHANISM FOR FACILITATING A DYNAMIC ELECTRO-MECHANICAL INTERCONNECT HAVING A CAVITY FOR EMBEDDING ELECTRICAL COMPONENTS AND ISOLATING ELECTRICAL PATHS - A mechanism is described for facilitating a dynamic electro-mechanical interconnect capable of being employed in a test system according to one embodiment. A method of embodiments of the invention may include separating, via a cavity, a first conductor of an interconnect from a second conductor of the interconnect, and isolating, via the cavity serving as a buffer, a first electrical path provided through the first conductor from a second electrical path provided through the second conductor. | 04-03-2014 |
20140139247 | INTERPOSER APPARATUS AND METHODS - Embodiments of the present disclosure describe interposer apparatus and methods for their fabrication and use. In some embodiments, an interposer includes a first frame having a first opening, a second frame having a second opening, and a body frame, disposed between the first frame and the second frame. A first end portion of a pin is disposed in the first opening, a second end portion of the pin is disposed in the second opening, and a body portion of the pin is disposed in the body opening between the first and second frames. Other embodiments may be described and/or claimed. | 05-22-2014 |
20140262129 | THERMAL CONTROL OF DEVICE USING FLUID COOLANT - Assemblies, methods, and systems for controlling the temperature of an electronic device are described. One method includes positioning an electronic device in a chamber and electrically coupling a probe to the electronic device. The method also includes flowing a fluid in contact with the electronic device at a flow rate, the fluid comprising a liquid. A current is applied to the probe to carry out an electronic device testing operation, and a temperature of the electronic device is monitored during the electronic testing operation. The method may also include determining whether a change to the flow rate or temperature is necessary based on the monitored temperature of the electronic device. In one aspect of certain embodiments, the electronic device may be positioned so that each of the sides of the electronic device may be at least partially in contact with the fluid during the electronic device testing operation. | 09-18-2014 |
20140354318 | INTERCONNECTS INCLUDING LIQUID METAL - Embodiments of the present disclosure are directed to interconnects that include liquid metal, and associated techniques and configurations. The individual interconnects may electrically couple a contact of a printed circuit board (PCB) to a contact of a device under test (DUT). The interconnect may be disposed in or on the PCB. In various embodiments, the interconnect may include a carrier that defines a well (e.g., an opening in the carrier), and the liquid metal may be disposed in the well. In some embodiments, the contact of the DUT, or a contact of an intermediary device, may extend into the well and directly contact the liquid metal. In other embodiments, a flex circuit may be disposed over the well to seal the well. The flex circuit may include a conductive pad to electrically couple the liquid metal to the contact of the DUT. Other embodiments may be described and claimed. | 12-04-2014 |
20150185252 | ORGANIC SPACE TRANSFORMER ATTACHMENT AND ASSEMBLY - Electronic device assemblies and methods including an organic substrate based space transformer are described. One assembly includes a space transformer comprising an organic substrate. The assembly also includes a carrier on which the space transformer is positioned, and a clamp positioned to couple the space transformer to the carrier. The assembly also includes a probe array positioned on the space transformer, wherein the space transformer is positioned between the probe array and the carrier. The assembly also includes a printed circuit board, wherein the carrier is positioned between the printed circuit board and the space transformer. The assembly also includes electrical connections to electrically couple the space transformer to the printed circuit board. Other embodiments are described and claimed. | 07-02-2015 |
Joseph Walczyk, Tigard, OR US
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20150276798 | THERMAL INTERFACE MATERIAL HANDLING FOR THERMAL CONTROL OF AN ELECTRONIC COMPONENT UNDER TEST - Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal. | 10-01-2015 |
Joseph Walczyk, Syracuse, NY US
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20100012717 | CUSTOMIZABLE OPTICAL READER - An optical reader, which is operable in a “host commands” mode and a “host routines” mode. In the “host commands” mode, the reader receives and executes a script routine module from a host. In the “host routines” mode, the reader receives a script routine Module identifier from the host, and the reader, in turn, executes a selected one of a plurality of reader-stored script routine modules based on the identifier. | 01-21-2010 |
Joseph A. Walczyk, Syracuse, NY US
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20150040378 | METHOD FOR MANUFACTURING LASER SCANNERS - A method for manufacturing laser scanners is provided. Laser scanners are configured to drive their light-deflecting assemblies at a fixed drive frequency. By selecting for inclusion in the laser scanners only those light-deflecting assemblies that have resonant oscillation frequencies falling within a specified range, operation of the laser scanners remains within engineering tolerances even through extreme environmental changes. Moreover, the method results in laser scanner having greater unit-to-unit consistency during operation even in extreme environments. | 02-12-2015 |
20150287290 | MULTIFUNCTION POINT OF SALE SYSTEM - A point of sale system capable of operating in an indicia-reading mode or a verification mode is disclosed. In the indicia-reading mode, the point of sale system configures its illumination, imaging, and processing to read indicia as part of a normal checkout process. If triggered by a user or by an event, the point of sale system may operate in a verification mode. In the verification mode, the point of sale system enables the necessary illumination, imaging, and processing to verify an item. This verification includes illuminating the item in a way that causes a noticeable response from a security mark (or marks) on the item. An image of the response may be captured and processed to authenticate/verify the item. The point of sale system may then respond to the verification and/or may store the image/results as a record of the verification. | 10-08-2015 |
Joseph F. Walczyk, Tigard, OR US
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20140002994 | THERMAL INTERFACE FOR MULTI-CHIP PACKAGES | 01-02-2014 |
Mathew J. Walczyk, Penfield, NY US
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20120036422 | SYSTEM AND METHOD FOR RENDERING FORMS BASED ON AN IDENTIFICATION NUMBER - A system and method for rendering a form based on an identification number. A client device including an extensible interface platform (EIP) application can be configured in association with a centralized server via a network. A form category can be selected and the identification number with respect to a form can be entered on a user interface associated with the client device. The form that matches the identification number can be collected from a database associated with the centralized server. The information required for retrieving instruction to populate the form can be entered in the user interface and the form can be rendered based on a user preference. Such an approach reduces the cost of rendering and shipping a large number of forms to a number of locations. | 02-09-2012 |
20150116759 | STORING PRINT OPTIONS AND PRINT ACCOUNTING CREDENTIALS WHEN PRINTING VIA E-MAIL - Methods and systems provide a network-based site for obtaining user preferences, using a computerized device connected to a computer network. User preferences are received through the network-based site, and the user preferences comprise printer option selections that are specific to a specific printing device and a specific user. Such methods and systems store the user preferences using the computerized device. After storing the user preferences, the methods and systems receive a print job and an indication to apply the user preferences. In response to only receiving the print job and the indication to apply the user preferences, the methods and systems automatically print the print job according to the user preferences using the specific printing device. | 04-30-2015 |
Sven Walczyk, Waalve NL
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20130140705 | Circuit connector apparatus and method therefor - Aspects of the present invention are directed to circuits, circuit packages and related methods. In accordance with various example embodiments, respective electrodes are implemented to facilitate contact to a semiconductor device via different surfaces and/or sidewalls, as may be useful in connecting the device to an external package having a plurality of semiconductor devices in which same-surface connections to the devices are spatially restricted. The semiconductor device has opposing surfaces and sidewalls connecting the surfaces, and contacts to respective different regions in the device. Respective electrodes are coupled to the respective contacts and extend along/around the device to provide access to the contacts via different surfaces. | 06-06-2013 |
Sven Walczyk, Waalre NL
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20120112351 | SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE - Disclosed is a method of manufacturing a discrete semiconductor device package ( | 05-10-2012 |
20120286399 | LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE - In one embodiment, a method is provided for packaging a semiconductor die. A leadframe having a die-pad and one or more lead-pads is placed ( | 11-15-2012 |
20120286410 | SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE - Disclosed is a discrete semiconductor device package ( | 11-15-2012 |
20130320551 | DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD - Disclosed is a discrete semiconductor device package ( | 12-05-2013 |
20130334695 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE - The invention relates to an electronic device ( | 12-19-2013 |
20150140739 | DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD - Disclosed is a discrete semiconductor device package ( | 05-21-2015 |
20160005710 | METHODS OF ATTACHING ELECTRONIC COMPONENTS - A method of attaching an electronic component to a metal substrate, wherein the electronic component comprises solder provided on an exposed solder region. The method comprising: forming a metal-based compound layer on the substrate; placing the electronic component on the metal substrate such that the solder region is in contact with a contact region of the metal-based compound layer; and heating the solder region such that the contact region of the metal-based compound layer dissolves and the solder region forms an electrical connection between the electronic component and the metal substrate. The metal-based compound layer can have a minimum thickness of 10 nm. | 01-07-2016 |
Teresa A. Walczyk, Royal Oak, MI US
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20130327581 | Divided Dual Inlet Housing for an Air-Based Hybrid Battery Thermal Conditioning System - A divided dual inlet housing for an air-based hybrid battery thermal conditioning system which is configured such that HVAC air entering at the HVAC air inlet is prevented from partly backflowing out the cabin air inlet via a dividing wall disposed therein so that all the HVAC air exits the divided dual inlet housing at the air outlet. | 12-12-2013 |
Wolfgang Walczyk, Heringen DE
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20140360239 | COMPOSITION OF A MAGNESIUM SULFATE/UREA COMPOUND - The subject of the invention is a composition containing at least 80 wt. %, with reference to the total weight of the composition, of a magnesium-sulfate-urea compound of Formula (I): | 12-11-2014 |
20160046534 | COMPOSITION OF A MAGNESIUM SULPHATE-UREA COMPOUND - The present invention relates to compositions containing at least 80% by weight, especially at least 90% by weight, based on the total weight of the composition, of at least one magnesium sulfate-urea compound selected from the compound of the formula (I) and mixtures of the compound of the formula (I) with the compound of the formula (II): [MgSO | 02-18-2016 |
Wolfgang Walczyk US
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20160046534 | COMPOSITION OF A MAGNESIUM SULPHATE-UREA COMPOUND - The present invention relates to compositions containing at least 80% by weight, especially at least 90% by weight, based on the total weight of the composition, of at least one magnesium sulfate-urea compound selected from the compound of the formula (I) and mixtures of the compound of the formula (I) with the compound of the formula (II): [MgSO | 02-18-2016 |