Patent application number | Description | Published |
20100117202 | MOLD AND SUBSTRATE FOR USE WITH MOLD | 05-13-2010 |
20110244637 | MOLD AND SUBSTRATE FOR USE WITH MOLD | 10-06-2011 |
20120104583 | SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME - A semiconductor device includes a lead frame that has a die interconnect portion and at least first and second die pads. The die interconnect portion is isolated from the die pads. The device also includes a first die and a second die attached to the first and second die pads and electrically connected to each other by way of the die interconnect portion. The first die is encapsulated in a first medium and the second die is encapsulated in a second medium, the first medium being different from the second medium. | 05-03-2012 |
20130264693 | LEAD FRAME WITH GROOVED LEAD FINGER - A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding. | 10-10-2013 |
20140120664 | LEAD FRAME WITH GROOVED LEAD FINGER - A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding. | 05-01-2014 |
20150221572 | METHOD OF LIMITING CAPILLARY ACTION OF GEL MATERIAL DURING ASSEMBLY OF PRESSURE SENSOR - A method for applying a pressure-sensitive gel material during assembly of an array of pre-singulated packaged semiconductor devices. In the method, pressure-sensitive gel material is dispensed onto a first semiconductor device of the array, where the first semiconductor device is disposed within a first cavity. A first curing process is performed to partially cure the pressure-sensitive gel material in the first cavity. Pressure-sensitive gel material is then dispensed onto another semiconductor device of the array, where the other semiconductor device is disposed within another cavity. The first curing process is initiated before the dispensing of the pressure-sensitive gel material inside of the other cavity is completed and initially cures pressure-sensitive gel material for fewer than all of the pre-singulated packaged semiconductor devices of the array. | 08-06-2015 |
20150228601 | SUBSTRATE WITH CORNER CUT-OUTS AND SEMICONDUCTOR DEVICE ASSEMBLED THEREWITH - A semiconductor device is assembled from a rectangular substrate sheet. The substrate sheet has die mounting pads accessible from a first side and package mounting pads accessible from an opposite side. Corner regions of the substrate sheet have receding edges. A semiconductor die is attached to the substrate sheet such that electrodes or bonding pads of the die are mounted to respective die mounting pads of the substrate sheet. An encapsulating material covers the semiconductor die and the first side of the substrate sheet. Corner covering sections of the encapsulating material further cover the receding edges of the corner regions. | 08-13-2015 |
20150270195 | LEAD FRAME WITH MOLD LOCK STRUCTURE - A lead frame for a semiconductor device includes a die paddle and leads situated on a perimeter of the lead frame. The die paddle has a metal frame and a number of substantially linear metal connecting bars within the frame. The connecting bars interconnect different locations of the frame to form a multiple triangles, where a triangular-shaped cavity is formed within each triangle. An overall area of the cavities is greater than an overall area of the connecting bars. | 09-24-2015 |