| Patent application number | Description | Published |
|---|
| 20080315886 | Field imager - A detection apparatus for detecting the presence of a sample, the detection apparatus comprising a chamber, ports for introducing a sample within the chamber, an actuation unit for establishing a controllable electromagnetic field in the chamber; and a sensing unit for sensing changes in the electromagnetic field due to the presence of the sample within the chamber. The sensing unit comprises a sensor device comprising a source and a drain embedded in a FET a gate for the FET, in which the gate is formed of a material whose conductivity is related to the electromagnetic field established in a nonconductive medium in contact with the gate. | 12-25-2008 |
| 20090136141 | ANALYZING A SEGMENT OF VIDEO - There is disclosed a quick and efficient method for analyzing a segment of video, the segment of video having a plurality of frames. A reference portion is acquired from a reference frame of the plurality of frames. Plural subsequent portions are then acquired from a corresponding subsequent frame of the plurality of frames. Each subsequent portion is then compared with the reference portion, and an event is detected based upon each comparison. There is also disclosed a method of optimizing video including selectively storing, labeling, or viewing video based on the occurrence of events in the video. Furthermore, there is disclosed a method for creating a video summary of video which allows a used to scroll through and access selected parts of a video. The methods disclosed also provide advancements in the field of video surveillance analysis. | 05-28-2009 |
| 20100086050 | MESH BASED FRAME PROCESSING AND APPLICATIONS - A method of processing sequential frames of data comprises repeating the following steps for successive frames of data: acquiring at least a reference frame containing data points and a current frame of data points; identifying a set of anchor points in the reference frame; assigning to each anchor point in the reference frame a respective motion vector that estimates the location of the anchor point in the current frame; defining polygons formed of anchor points in the reference frame, each polygon containing data points in the reference frame, each polygon and each data point contained within the polygon having a predicted location in the current frame based on the motion vectors assigned to anchor points in the polygon; for one or more polygons in the reference frame, adjusting the number of anchor points in the reference frame based on accuracy of the predicted locations of data points in the current frame; and if the number of anchor points is increased by addition of new anchor points, then assigning motion vectors to the new anchor points that estimate the location of the anchor points in the current frame. | 04-08-2010 |
| Patent application number | Description | Published |
|---|
| 20090124822 | PROCESS FOR PREPARING MALATHION FOR PHARMACEUTICAL USE - The present invention provides a process for preparing a highly pure form of malathion having a reduced level of toxic impurities. In addition, the malathion prepared by the process of this invention is storage stable. The level of toxic impurities in the malathion, e.g., isomalathion, O,O,S-trimethyl phosphorodithioate (MeOOSPS), O,O,S-trimethyl phosphorothioate (MeOOSPO), O,S,S-trimethyl phosphorodithioate (MeOSSPO), malaoxon, isomalathion, diethyl fumarate, methyl malathion, dimethyl malathion, O,O-methyl,ethyl-S-(1,2-dicarboethoxy)ethyl-phosphorodithioate are lower than that of any other commercial preparation of malathion that may be used for pharmaceutical purposes. | 05-14-2009 |
| 20090124823 | PROCESS FOR PREPARING MALATHION FOR PHARMACEUTICAL USE - The present invention provides a process for preparing a highly pure form of malathion having a reduced level of toxic impurities. In addition, the malathion prepared by the process of this invention is storage stable. The level of toxic impurities in the malathion, e.g., isomalathion, O,O,S-trimethyl phosphorodithioate (MeOOSPS), O,O,S-trimethyl phosphorothioate (MeOOSPO), O,S,S-trimethyl phosphorodithioate (MeOSSPO), malaoxon, isomalathion, diethyl fumarate, methyl malathion, dimethyl malathion, O,O-methyl,ethyl-S-(1,2-dicarboethoxy)ethyl-phosphorodithioate are lower than that of any other commercial preparation of malathion that may be used for pharmaceutical purposes. | 05-14-2009 |
| 20120010175 | PROCESS FOR PREPARING MALATHION FOR PHARMACEUTICAL USE - The present invention provides a process for preparing a highly pure form of malathion having a reduced level of toxic impurities. In addition, the malathion prepared by the process of this invention is storage stable. The level of toxic impurities in the malathion, e.g., isomalathion, O,O,S-trimethyl phosphorodithioate (MeOOSPS), O,O,S-trimethyl phosphorothioate (MeOOSPO), O,S,S-trimethyl phosphorodithioate (MeOSSPO), malaoxon, isomalathion, diethyl fumarate, methyl malathion, dimethyl malathion, O,O-methyl,ethyl-S-(1,2-dicarboethoxy)ethyl-phosphorodithioate are lower than that of any other commercial preparation of malathion that may be used for pharmaceutical purposes. | 01-12-2012 |
| Patent application number | Description | Published |
|---|
| 20120200285 | WIRE MANAGEMENT METHOD WITH CURRENT AND VOLTAGE SENSING - A wire management method using a wire manager including current sensing features provides input for power measurement and management systems. The wire manager may be a single wire or single bundle retaining device with a current sensor such as a hall effect sensor integrated therein, or may be a multi-wire management housing with multiple current sensing devices disposed inside for measuring the current through multiple wires. The wires may be multiple branch circuits in a power distribution panel or raceway, and the wire manager may be adapted for mounting in such a panel or raceway. Voltage sensing may also be incorporated within the sensors by providing an electrically conductive plate, wire or other element that capacitively couples to the corresponding wire. | 08-09-2012 |
| 20120200291 | NON-CONTACT CURRENT AND VOLTAGE SENSOR - A detachable current and voltage sensor provides an isolated and convenient device to measure current passing through a conductor such as an AC branch circuit wire, as well as providing an indication of an electrostatic potential on the wire, which can be used to indicate the phase of the voltage on the wire, and optionally a magnitude of the voltage. The device includes a housing that contains the current and voltage sensors, which may be a ferrite cylinder with a hall effect sensor disposed in a gap along the circumference to measure current, or alternative a winding provided through the cylinder along its axis and a capacitive plate or wire disposed adjacent to, or within, the ferrite cylinder to provide the indication of the voltage. | 08-09-2012 |
| 20120200293 | NON-CONTACT CURRENT AND VOLTAGE SENSING METHOD - A method of measurement using a detachable current and voltage sensor provides an isolated and convenient technique for to measuring current passing through a conductor such as an AC branch circuit wire, as well as providing an indication of an electrostatic potential on the wire, which can be used to indicate the phase of the voltage on the wire, and optionally a magnitude of the voltage. The device includes a housing that contains the current and voltage sensors, which may be a ferrite cylinder with a hall effect sensor disposed in a gap along the circumference to measure current, or alternative a winding provided through the cylinder along its axis and a capacitive plate or wire disposed adjacent to, or within, the ferrite cylinder to provide the indication of the voltage. | 08-09-2012 |
| 20120203481 | WIRE MANAGER WITH CURRENT AND VOLTAGE SENSING - A wire manager including current sensing features provides input for power measurement and management systems. The wire manager may be a single wire or single bundle retaining device with a current sensor such as a hall effect sensor integrated therein, or may be a multi-wire management housing with multiple current sensing devices disposed inside for measuring the current through multiple wires. The wires may be multiple branch circuits in a power distribution panel or raceway, and the wire manager may be adapted for mounting in such a panel or raceway. Voltage sensing may also be incorporated within the sensors by providing an electrically conductive plate, wire or other element that capacitively couples to the corresponding wire. | 08-09-2012 |
| Patent application number | Description | Published |
|---|
| 20120108201 | SYSTEM AND METHOD FOR PERFORMING A TELECOMMUNICATION SERVICE - A method for performing a telecommunication service, including identifying, on a Service Delivery Platform (SDP) and by a processor, the telecommunication service, selecting, on the SDP and by the processor, the telecommunication service, and executing, on the SDP and by the processor, the telecommunication service on a cellular network, where the SDP is configured to implement the telecommunication service on the cellular network. | 05-03-2012 |
| 20120108214 | MOBILE SOFTWARE SERVICES FOR TELECOM OPERATORS - A system for performing a telecommunication service, including a cellular network, a processor connected to a memory, a Service Delivery Platform (SDP), and the telecommunication service executed by the processor and configured to execute instructions for the SDP on the cellular network. | 05-03-2012 |
| Patent application number | Description | Published |
|---|
| 20080303132 | Semiconductor chip packages having cavities - Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts. | 12-11-2008 |
| 20110291297 | MICROELECTRONIC PACKAGES HAVING CAVITIES FOR RECEIVING MICROELECTRONIC ELEMENTS - Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts. | 12-01-2011 |
| 20120068338 | IMPEDANCE CONTROLLED PACKAGES WITH METAL SHEET OR 2-LAYER RDL - A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential. | 03-22-2012 |
| 20120068365 | METAL CAN IMPEDANCE CONTROL STRUCTURE - A microelectronic assembly includes an interconnection element, element contacts, first and second metal layers, conductive elements, and first and second microelectronic devices. The first metal layer may extend beyond at least one of the edges of the first microelectronic device. The conductive elements may respectively extend beyond at least one of the edges of the first metal layer. The first metal layer may have a surface disposed at a substantially uniform spacing from at least substantial portions of the conductive elements, such that a desired impedance may be achieved for the conductive elements. The conductive elements may be spaced a smaller distance from the metal layer than the distance of the conductive elements from the front surface of the first microelectronic device. The second metal layer may be connectable to a source of reference potential. | 03-22-2012 |
| 20120092832 | ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTICS - A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front surface facing the first surface of the dielectric element, the first microelectronic element having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element including having a rear surface and a front surface facing the rear surface of the first microelectronic element, a projecting portion of the front surface of the second microelectronic element extending beyond the first edge of the first microelectronic element, the projecting portion being spaced from the first surface of the dielectric element, the second microelectronic element having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader thermally coupled to at least one of the first microelectronic element or the second microelectronic element. | 04-19-2012 |
| 20120126389 | ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND VIAS CONNECTED TO THE CENTRAL CONTACTS - The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond an edge of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at its front surface; a dielectric region overlying the front surfaces of the microelectronic elements, the dielectric region having a major surface facing away from the microelectronic elements; metallized vias within openings in the dielectric region extending from the plurality of contacts of the first and second microelectronic elements; and leads extending along a major surface of the dielectric region from the vias to terminals exposed at the major surface. | 05-24-2012 |
| 20120153435 | ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED GROUND OR POWER DISTRIBUTION - A microelectronic assembly includes a dielectric element having at least one aperture and electrically conductive elements thereon including terminals exposed at the second surface of the dielectric element; a first microelectronic element having a rear surface and a front surface facing the dielectric element, the first microelectronic element having a plurality of contacts exposed at the front surface thereof; a second microelectronic element having a rear surface and a front surface facing the rear surface of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at the front surface and projecting beyond an edge of the first microelectronic element; and an electrically conductive plane attached to the dielectric element and at least partially positioned between the first and second apertures, the electrically conductive plane being electrically connected with one or more of the contacts of at least one of the first or second microelectronic elements. | 06-21-2012 |
| 20120155042 | ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED GROUND OR POWER DISTRIBUTION - A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrically conductive elements are positioned thereon. Signal leads are connected to one or more of the microelectronic elements and extend through one or more of the first or second apertures to some of the conductive elements on the dielectric element. One or more jumper leads extend through the first aperture and are connected to a contact of the first microelectronic element. The one or more jumper leads span over the second aperture and are connected to a conductive element on the dielectric element. | 06-21-2012 |
| 20120155049 | ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS - A microelectronic assembly includes a dielectric element having first and second surfaces, first and second apertures extending between the first and second surfaces and defining a central region of the first surface between the first and second apertures, first and second microelectronic elements, and leads extending from contacts exposed at respective front surfaces of the first and second microelectronic elements to central terminals exposed at the central region. The front surface of the first microelectronic element can face the second surface of the dielectric element. The front surface of the second microelectronic element can face a rear surface of the first microelectronic element. The contacts of the second microelectronic element can project beyond an edge of the first microelectronic element. At least first and second ones of the leads can electrically interconnect a first central terminal of the central terminals with each of the first and second microelectronic elements. | 06-21-2012 |
| 20120267771 | STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR - A module can include a module card and first and second microelectronic elements having front surfaces facing a first surface of the module card. The module card can also have a second surface and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket. Each microelectronic element can be electrically connected to the module card. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. | 10-25-2012 |
| 20120267796 | FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES - A microelectronic assembly can include a substrate having first and second surfaces and an aperture extending therebetween, the substrate having terminals. The assembly can also include a first microelectronic element having a front surface facing the first surface of the substrate, a second microelectronic element having a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, first and second leads electrically connecting contacts of the respective first and second microelectronic elements to the terminals, and third leads electrically interconnecting the contacts of the first and second microelectronic elements. The contacts of the first microelectronic element can be exposed at the front surface thereof adjacent the edge thereof. The contacts of the second microelectronic element can be disposed in a central region of the front surface thereof. The first, second, and third leads can have portions aligned with the aperture. | 10-25-2012 |
| 20120267797 | FLIP-CHIP, FACE-UP AND FACE-DOWN WIREBOND COMBINATION PACKAGE - A microelectronic assembly can include a substrate having an aperture extending between first and second surfaces thereof, the substrate having substrate contacts at the first surface and terminals at the second surface. The microelectronic assembly can include a first microelectronic element having a front surface facing the first surface, a second microelectronic element having a front surface facing the first microelectronic element, and leads electrically connecting the contacts of the second microelectronic element with the terminals. The second microelectronic element can have contacts exposed at the front surface thereof beyond an edge of the first microelectronic element. The first microelectronic element can be configured to regenerate at least some signals received by the microelectronic assembly at the terminals and to transmit said signals to the second microelectronic element. The second microelectronic element can embody a greater number of active devices to provide memory storage array function than any other function. | 10-25-2012 |
| 20120267798 | MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE - A microelectronic assembly is disclosed that comprises a substrate having first and second openings, a first microelectronic element and a second microelectronic element in a face-down position. The first element has an active surface facing the front surface of the substrate and bond pads aligned with the first opening, a rear surface remote therefrom, and an edge extending between the front and rear surfaces. The second microelectronic element has a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, and bond pads at the front surface of the second microelectronic element aligned with the second opening. | 10-25-2012 |
