Waechtler
Andreas Waechtler, Darmstadt DE
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20120326084 | LIQUID-CRYSTALLINE MEDIUM - The invention relates to a liquid-crystalline medium which comprises at least one compound of the formula I, | 12-27-2012 |
Thomas Waechtler, Dittmansdorf DE
Patent application number | Description | Published |
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20100301478 | Substrate Having a Coating Comprising Copper and Method for the Production Thereof by Means of Atomic Layer Deposition - A method can be used for the production of a coated substrate. The coating contains copper. A copper precursor and a substrate are provided. The copper precursor is a copper(I) complex which contains no fluorine. A copper-containing layer is deposited by means of atomic layer deposition (ALD) at least on partial regions of the substrate surface by using the precursor. Optionally, a reduction step is performed in which a reducing agent acts on the substrate obtained in the layer deposition step. In various embodiments, the precursor is a complex of the formula L | 12-02-2010 |
Thomas Waechtler, Chemnitz DE
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20130062768 | METHOD FOR THE PRODUCTION OF A SUBSTRATE HAVING A COATING COMPRISING COPPER, AND COATED SUBSTRATE AND DEVICE PREPARED BY THIS METHOD - A method for producing a substrate with a copper or a copper-containing coating is disclosed. The method comprises a first step wherein a first precursor, a second precursor and a substrate are provided. The first precursor is a copper complex that contains no fluorine and the second precursor is selected from a ruthenium complex, a nickel complex, a palladium complex or mixtures thereof. In the second step, a layer is deposited at least on partial regions of a surface of the substrate by using the first precursor and the second precursor by means of atomic layer deposition (ALD). The molar ratio of the first precursor:second precursor used for the ALD extends from 90:10 to 99.99:0.01. The obtained layer contains copper and at least one of ruthenium, nickel and palladium. Finally, a reduction is performed step in which a reducing agent acts on the substrate obtained after depositing the copper-containing layer. | 03-14-2013 |