Patent application number | Description | Published |
20120291454 | Thermoelectric Devices Using Sintered Bonding - A device for conducting heat from a source to a sink is provided that, in one embodiment, includes a thermoelectric element coupled to a substrate via sintered material that includes nano and/or micro particles. In one aspect, the sintered material includes silver particles and in another aspect the sintered material also includes an additive to control the coefficient of thermal expansion of the sintered material. | 11-22-2012 |
20120292009 | Method and Apparatus for Joining Members for Downhole and High Temperature Applications - A method of attaching members is provided. In one aspect, the method includes placing a bonding material comprising at least one of silver micro particles)and silver nano particles on a surface of a first member; placing the first member with the surface of the first member having the bonding material thereon on a surface of a second member; heating the bonding material to a selected temperature while applying a selected pressure on at least one of the first member and second member for a selected time period to sinter the bonding material to attach the first member to the second member. | 11-22-2012 |
20130015426 | METHOD OF MANUFACTURING OF A SEMI-CONDUCTOR ELEMENT AND SEMI-CONDUCTOR ELEMENT - A method of manufacturing of a semi-conductor element, comprising the following steps: providing a substrate, the substrate having a surface, the surface being partially coated with a coating and having at least one uncoated area, and growing a truncated pyramid of gallium nitride on the uncoated area, wherein the method comprises the following step: growing at least one gallium nitride column on the truncated pyramid. | 01-17-2013 |
20130068008 | HIGH TEMPERATURE PIEZORESISTIVE STRAIN GAUGES MADE OF SILICON-ON-INSULATOR - Disclosed is an apparatus for measuring a parameter in a borehole penetrating the earth. The apparatus includes a sensor configured to be disposed in the borehole and having a piezo-resistor fabricated from a semiconductor on an insulator wherein a portion of the semiconductor is etched to the insulator to form the piezo-resistor, the piezo-resistor being responsive to the parameter. | 03-21-2013 |
Patent application number | Description | Published |
20090252634 | METALLIC POWDER MIXTURES - The invention relates to mixtures of metal, alloy or composite powders which have a mean particle diameter D50 of not more than 75 μm, preferably not more than 25 μm, and are produced in a process in which a starting powder is firstly deformed to give platelet-like particles and these are then comminuted in the presence of milling aids together with further additives and also the use of these powder mixtures and shaped articles produced therefrom. | 10-08-2009 |
20090277301 | METALLIC POWDER MIXTURES - The invention relates to mixtures of metal, alloy or composite powders which have a mean particle diameter D50 of not more than 75 μm, preferably not more than 25 μm, and are produced in a process in which a starting powder is firstly deformed to give platelet-like particles and these are then comminuted in the presence of milling aids together with further additives and also the use of these powder mixtures and shaped articles produced therefrom. | 11-12-2009 |
20100003157 | METALLIC POWDER MIXTURES - The invention relates to mixtures of metal, alloy or composite powders which have a mean particle diameter D50 of not more than 75 μm, preferably not more than 25 μm, and are produced in a process in which a starting powder is firstly deformed to give platelet-like particles and these are then comminuted in the presence of milling aids together with further additives and also the use of these powder mixtures and shaped articles produced therefrom. | 01-07-2010 |