Patent application number | Description | Published |
20080197368 | Optoelectronic Component and Package For an Optoelectronic Component - Optoelectronic components with a semiconductor chip, which is suitable for emitting primary electromagnetic radiation, a basic package body, which has a recess for receiving the semiconductor chip and electrical leads for the external electrical connection of the semiconductor chip and a chip encapsulating element, which encloses the semiconductor chip in the recess. The basic package body is at least partly optically transmissive at least for part of the primary radiation and an optical axis of the semiconductor chip runs through the basic package body. The basic package body comprises a luminescence conversion material, which is suitable for converting at least part of the primary radiation into secondary radiation with wavelengths that are at least partly changed in comparison with the primary radiation. | 08-21-2008 |
20080203410 | Methods for the Production of Luminescent Diode Chips and Luminescent Diode Chip - The invention relates to a method of making LED chips provided with a luminescence conversion material containing at least one phosphor. In the method, a layer composite is prepared that includes an LED layer sequence for a multiplicity of LED chips and comprises on a main surface at least one electrical contact surface for each LED chip, for electrically connecting said chip. A layer of adhesion promoter is applied to the main surface and selectively removed from at least portions of the contact surfaces. At least one phosphor is then applied to the main surface. Alternatively, a luminescence conversion material is applied to the main surface and selectively removed from at least portions of the contact surfaces. The invention also relates to an LED chip provided with a luminescence conversion material. | 08-28-2008 |
20080212191 | Optical arrangement and optical method - An optical arrangement comprising at least one first light-emitting element (LE | 09-04-2008 |
20090068776 | Method for fabricating semiconductor substrate for optoelectronic components - Presented is a method for fabricating a semiconductor substrate. The method includes implanting impurity material into the semiconductor substrate, and forming a reflective layer-like zone in the semiconductor substrate that includes the impurity material. | 03-12-2009 |
20090090900 | Optoelectronic Semiconductor Chip - An optoelectronic semiconductor chip comprises the following sequence of regions in a growth direction (c) of the semiconductor chip ( | 04-09-2009 |
20090117711 | Method for Laterally Cutting Through a Semiconductor Wafer and Optoelectronic Component - In a method for laterally dividing a semiconductor wafer ( | 05-07-2009 |
20090206348 | Composite Substrate, and Method for the Production of a Composite Substrate - A composite substrate ( | 08-20-2009 |
20090212307 | Light-emitting diode chip comprising a contact structure - In a luminescence diode chip having a radiation exit area ( | 08-27-2009 |
20090218587 | Radiation-Emitting Semiconductor Body with Carrier Substrate and Method for the Production thereof - A radiation-emitting semiconductor body with a carrier substrate and a method for producing the same. In the method, a structured connection is produced between a semiconductor layer sequence ( | 09-03-2009 |
20090290610 | Method for Laterally Cutting Through a Semiconductor Wafer and Optoelectronic Component - A method for laterally dividing a semiconductor wafer ( | 11-26-2009 |
20090296018 | Light-Emitting Device - A light-emitting device, comprising: a radiation source ( | 12-03-2009 |
20090309113 | Optoelectronic Semiconductor Component - An optoelectronic semiconductor component, comprising a carrier substrate, and an interlayer that mediates adhesion between the carrier substrate and a component structure. The component structure comprises an active layer provided for generating radiation, and a useful layer arranged between the interlayer and the active layer. The useful layer has a separating area remote from the carrier substrate. | 12-17-2009 |
20090311847 | Method for producing a semiconductor component - Presented is a method for producing an optoelectronic component. The method includes separating a semiconductor layer based on a III-V-compound semiconductor material from a substrate by irradiation with a laser beam having a plateau-like spatial beam profile, where individual regions of the semiconductor layer are irradiated successively. | 12-17-2009 |
20100091516 | Arrangement Comprising a Fiber-Optic Waveguide - An arrangement comprising a fiber-optic waveguide ( | 04-15-2010 |
20100112789 | Method for Producing Semiconductor Chips using Thin Film Technology - For semiconductor chips using thin film technology, an active layer sequence is applied to a growth substrate, on which a reflective electrically conductive contact material layer is then formed. The active layer sequence is patterned to form active layer stacks, and reflective electrically conductive contact material layer is patterned to be located on each active layer stack. Then, a flexible, electrically conductive foil is applied to the contact material layers as an auxiliary carrier layer, and the growth substrate is removed. | 05-06-2010 |
20140203413 | Composite Substrate, Semiconductor Chip Having a Composite Substrate and Method for Producing Composite Substrates and Semiconductor Chips - A composite substrate has a carrier and a utility layer. The utility layer is attached to the carrier by means of a dielectric bonding layer and the carrier contains a radiation conversion material. Other embodiments relate to a semiconductor chip having such a composite substrate, a method for producing a composite substrate and a method for producing a semiconductor chip with a composite substrate. | 07-24-2014 |